Abstract: A headlamp illumination source that switches from a first configuration conforming to on-road illumination standards to a second configuration that does not conform to on-road illumination standards. The switching is preferably controlled by a wireless signal but in some embodiments the switching can be controlled by a hard-wired signal or by a switch proximate the illumination source itself.

Abstract: A sprinkler includes a body having an upper portion removably attached to a lower portion. The upper portion includes a nozzle strip and lower nozzle plate. The lower portion includes a hollow body, a locking plate, and a controller connected to the locking plate. The locking plate is configured to move in a lengthwise direction. The locking plate includes a locking plate tab and a locking plate groove. The lower nozzle plate includes a nozzle plate tab. The hollow body comprises a vertical channel configured to accommodate the locking plate tab in a first position. The nozzle plate tab is arranged beneath the locking plate tab in the first position. The locking plate tab is arranged outside the vertical channel in a second position. The controller is configured to move the locking plate to the first position and to the second position to facilitate removal of the upper portion.

Abstract: A sprinkler includes a nozzle assembly attached to an upper portion a the sprinkler. The nozzle assembly includes a nozzle strip having nozzles and an angle plate in contact with the nozzle strip. The angle plate includes angle plate grooves and teeth. The nozzles extend through the angle plate grooves. The upper portion includes nozzle openings that correspond to the angle plate grooves. The nozzles extend through the nozzle openings. The angle plate grooves overlap with the nozzle openings to form an adjustable intersection opening. The sprinkler includes a controller having a knob extending outside the sprinkler and teeth positioned inside the sprinkler. The teeth mesh with the teeth of the angle plate. The controller drives the angle plate and an axis of at least one of the plurality of nozzles extending outside the sprinkler varies based on a position of the angle plate.

Abstract: A sprinkler includes a body having an upper portion removably attached to a lower portion. The upper portion includes a nozzle strip and lower nozzle plate. The lower portion includes a hollow body, a locking plate, and a controller connected to the locking plate. The locking plate is configured to move in a lengthwise direction. The locking plate includes a locking plate tab and a locking plate groove. The lower nozzle plate includes a nozzle plate tab. The hollow body comprises a vertical channel configured to accommodate the locking plate tab in a first position. The nozzle plate tab is arranged beneath the locking plate tab in the first position. The locking plate tab is arranged outside the vertical channel in a second position. The controller is configured to move the locking plate to the first position and to the second position to facilitate removal of the upper portion.

Abstract: In a system for severing conductive links by laser irradiation to repair electronic devices, multiple laser beams are deflected at high-speed to target selected links for processing by positioning laser spots in a two dimensional pattern during relative motion of a substrate and a beam delivery system. As link targeting flexibility is increased, selection may be required from a large number of addressable link pairs. Various embodiments advantageously use beam deflection and beam splitting to improve memory repair processing rates.

Abstract: A mop bucket comprises an internal compartment defined by a side wall for retaining a liquid. A first bracket is supported in the compartment and supports a first agitator blade and a second bracket supported in the compartment and supports a second agitator blade such that the agitator blades are spaced from one another a distance sufficient to receive a mop. The first agitator blade and the second agitator blade each comprising a plurality of fins extending from a planar support surface. The first agitator blade and said second agitator blade may also comprise a plurality of bristles extending from a planar support surface.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.

Abstract: A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.

Abstract: A laser polarization control apparatus includes a polarization modifying device, such as a liquid crystal variable retarder, and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller, which is connected to the polarization modifying device, adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. For example, the polarization of the laser beam may be rotated to correspond with the alignment of a link in a semiconductor device to be cut by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam.

Abstract: A laser polarization control apparatus includes a polarization modifying device and a controller. The polarization modifying device receives a laser beam and modifies the polarization of the laser beam. The controller adjusts an input to the polarization modifying device in order to control modification of the polarization of the laser beam based on alignment of a structure to be processed by the laser beam. The polarization modifying device is configured for incorporation into a laser processing system that produces the laser beam received by the polarization modifying device and that focuses the laser beam modified by the polarization modifying device onto a workpiece that includes the structure to be processed by the laser beam. An analyzer tool receives the laser beam modified by the polarization modification device and measures the modification of the polarization of the laser beam by the polarization modification device.

Abstract: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate.