Patents by Inventor William Lee Harrison
William Lee Harrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11034474Abstract: A seal head assembly includes a plurality of heat seal plates defining a corresponding plurality of heating areas, each heat seal plate including a heating element to independently control the temperature of the corresponding heating area.Type: GrantFiled: May 30, 2017Date of Patent: June 15, 2021Inventors: William Lee Harrison, Andrew William Jones, David McAuley Alexander, Gary Scott Liles
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Patent number: 10912308Abstract: A tenderizer system, apparatus and method to tenderize meat products and other foods through a cross-cut tenderizing process. This process can be performed by a tenderizer cartridge including at least two shafts in parallel, where a stack of blades are disposed on each shaft and in contact with each other along a respective shaft, each blade including teeth around outer circumferences such that each blade in contact is aligned to form continuous ridges that extend in parallel with the shafts.Type: GrantFiled: March 21, 2018Date of Patent: February 9, 2021Assignee: ROSS Industries, Inc.Inventors: William Lee Harrison, David McAuley Alexander
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Publication number: 20190343134Abstract: A tenderizer system, apparatus and method to tenderize meat products and other foods through a cross-cut tenderizing process. This process can be performed by a tenderizer cartridge including at least two shafts in parallel, where a stack of blades are disposed on each shaft and in contact with each other along a respective shaft, each blade including teeth around outer circumferences such that each blade in contact is aligned to form continuous ridges that extend in parallel with the shafts.Type: ApplicationFiled: March 21, 2018Publication date: November 14, 2019Inventors: William Lee Harrison, David McAuley Alexander
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Publication number: 20180118389Abstract: A seal head assembly includes a plurality of heat seal plates defining a corresponding plurality of heating areas, each heat seal plate including a heating element to independently control the temperature of the corresponding heating area.Type: ApplicationFiled: May 30, 2017Publication date: May 3, 2018Applicant: ROSS INDUSTRIES, INC.Inventors: William Lee Harrison, Andrew William Jones, David McAuley Alexander, Gary Scott Liles
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Publication number: 20180022490Abstract: A vacuum sealing system includes a vacuum pump, a lower tool to hold one or more trays carrying product, an upper tool to seal a plastic film onto the one or more trays, the upper tool including at least one seal plate with a seal plate cavity and a vacuum clamp, the system also including a controller to control the vacuum pump, the lower tool, and the upper tool.Type: ApplicationFiled: July 17, 2017Publication date: January 25, 2018Applicant: ROSS INDUSTRIES, INC.Inventors: William Lee Harrison, Andrew William Jones, David McAuley Alexander
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Patent number: 9440378Abstract: A method of manufacturing a planar board substrate for receiving a magnetic core. The method includes providing a cover layer having a layer side and providing a base layer having first and second sides. The base layer includes a material hole that extends completely through the base layer between the first and second sides. The method also includes coupling the cover and base layers to each other along the first side and the layer side. The cover layer extends over at least a portion of the material hole. The method also includes providing a dielectric member within the material hole, wherein a core-holding channel exists between the dielectric member and the base layer. The core-holding channel extends circumferentially around the dielectric member and is configured to have a magnetic core therein.Type: GrantFiled: February 28, 2012Date of Patent: September 13, 2016Assignee: Tyco Electronics CorporationInventors: Sidharth Dalmia, William Lee Harrison
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Patent number: 8614266Abstract: A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.Type: GrantFiled: May 5, 2011Date of Patent: December 24, 2013Assignee: Tyco Electronics Services GmbHInventors: Haiying Li, William Lee Harrison
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Patent number: 8581114Abstract: A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion.Type: GrantFiled: February 3, 2010Date of Patent: November 12, 2013Assignees: Planarmag, Inc., Mutual-Tek Industries Co., Ltd.Inventors: William Lee Harrison, Jung-Chien Chang
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Patent number: 8466769Abstract: A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.Type: GrantFiled: April 14, 2011Date of Patent: June 18, 2013Assignee: Tyco Electronics CorporationInventors: Sidharth Dalmia, Khanh Nguyen, Jaydip Das, Mark McGrath, William Lee Harrison
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Publication number: 20120154097Abstract: A method of manufacturing a planar board substrate for receiving a magnetic core. The method includes providing a cover layer having a layer side and providing a base layer having first and second sides. The base layer includes a material hole that extends completely through the base layer between the first and second sides. The method also includes coupling the cover and base layers to each other along the first side and the layer side. The cover layer extends over at least a portion of the material hole. The method also includes providing a dielectric member within the material hole, wherein a core-holding channel exists between the dielectric member and the base layer. The core-holding channel extends circumferentially around the dielectric member and is configured to have a magnetic core therein.Type: ApplicationFiled: February 28, 2012Publication date: June 21, 2012Applicant: Tyco Electronics CorporationInventors: SIDHARTH DALMIA, WILLIAM LEE HARRISON
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Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors
Patent number: 8203418Abstract: The current invention provides an integrated planar transformer and electronic component that includes at least one wideband planar transformer disposed in a planar substrate, where each wideband planar transformer includes a planar substrate in a fully-cured and rigid state, a ferrite material embedded in the planar substrate, where the ferrite material is enveloped in an elastic and non-conductive material, inter-wound conductors disposed around the embedded ferrite material, where top and bottom conductors are bonded by an insulating adhesive. The top and bottom conductors are connected in an inter-connected pattern by conductive vias disposed on each side of the ferrite material and span through the layers to the conductors. The planar transformer further includes at least one center tap connected to at least one inter-wound conductor.Type: GrantFiled: December 1, 2009Date of Patent: June 19, 2012Assignee: PlanarMag, Inc.Inventors: William Lee Harrison, Anh-Vu Pham, James E. Quilici, Sidharth Dalmia, Steven R. Kubes -
Publication number: 20110291789Abstract: A multilayer inductor device includes a planar substrate, a ferrite body, and an outer and an inner conductive coil. The substrate includes plural dielectric layers with the ferrite body is disposed in the substrate. The outer and inner conductive coils are helically wrapped around the ferrite body. The outer conductive coil includes first upper conductors, first lower conductors, and first conductive vias vertically extending through the substrate and conductively coupled with the first upper and lower conductors. The inner conductive coil includes second upper conductors, second lower conductors, and second conductive vias vertically extending through the substrate and conductively coupled with the second upper and lower conductors. The inner conductive coil is disposed between the outer conductive coil and the ferrite body.Type: ApplicationFiled: April 14, 2011Publication date: December 1, 2011Applicant: TYCO ELECTRONICS CORPORATIONInventors: Sidharth Dalmia, Khanh Nguyen, Jaydip Das, Mark McGrath, William Lee Harrison
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Publication number: 20110291788Abstract: A planar inductor device includes a substrate, a ferrite body in the substrate, upper and lower conductors, and conductive vias. The substrate vertically extends from an upper surface to an opposite lower surface. The substrate laterally extends from a first edge to a second edge. The upper conductors are disposed above the ferrite body. The lower conductors are disposed below the ferrite body. The conductive vias extend through the substrate and are conductively coupled with the upper conductors and with the lower conductors. The vias, the upper conductors, and the lower conductors form one or more conductive coils that encircle the ferrite body in the substrate. At least one of the first edge or the second edge of the substrate passes through one or more of the vias such that the vias are exposed at the at least one of the first edge or the second edge.Type: ApplicationFiled: April 14, 2011Publication date: December 1, 2011Applicant: TYCO ELECTRONICS CORPORATIONInventors: Sidharth Dalmia, William Lee Harrison
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Publication number: 20110272191Abstract: A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.Type: ApplicationFiled: May 5, 2011Publication date: November 10, 2011Applicant: TYCO ELECTRONICS SERVICES GMBHInventors: Haiying LI, William Lee Harrison
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Publication number: 20110242713Abstract: A voltage protection assembly includes a planar substrate, an input terminal, a capacitive element, an inductive element, and an output terminal. The substrate includes conductive traces with the input terminal conductively coupled with at least one of the traces. The capacitive element is electrically coupled with the input terminal. The inductive element is conductively coupled with the capacitive element. The output terminal is disposed on the substrate and is conductively coupled with the inductive element. The output terminal, the inductive element, the capacitive element, and the input terminal are connected in series to form a voltage protection circuit that filters one or more frequencies of a data signal transmitted through the voltage protection circuit. At least one of the capacitive element or the inductive element is entirely disposed within the thickness dimension of the substrate.Type: ApplicationFiled: March 22, 2011Publication date: October 6, 2011Applicant: TYCO ELECTRONICS CORPORATIONInventors: Sidharth Dalmia, William Lee Harrison, Jaydip Das
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Publication number: 20110108317Abstract: A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion.Type: ApplicationFiled: February 3, 2010Publication date: May 12, 2011Inventors: William Lee HARRISON, Jung-Chien CHANG
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Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors
Publication number: 20100295646Abstract: The current invention provides an integrated planar transformer and electronic component that includes at least one wideband planar transformer disposed in a planar substrate, where each wideband planar transformer includes a planar substrate in a fully-cured and rigid state, a ferrite material embedded in the planar substrate, where the ferrite material is enveloped in an elastic and non-conductive material, inter-wound conductors disposed around the embedded ferrite material, where top and bottom conductors are bonded by an insulating adhesive. The top and bottom conductors are connected in an inter-connected pattern by conductive vias disposed on each side of the ferrite material and span through the layers to the conductors. The planar transformer further includes at least one center tap connected to at least one inter-wound conductor.Type: ApplicationFiled: December 1, 2009Publication date: November 25, 2010Inventors: William Lee Harrison, And-Vu Pham, James E. Quilici, Sidharth Dalmia, Steven R. Kubes -
Patent number: 7821374Abstract: A method of arranging and fabricating parallel primary and secondary coils of a wideband planar transformer is provided. The spacing and width of the coils are disposed to extend the bandwidth from DC to GHz and allow for high frequency coupling when the core permeability dramatically drops and achieves low reflected energy and low loss over a wide bandwidth. A bottom mold having a pattern of hole-pairs with conductive elements inserted vertically couples to a top mold such that a middle portion of the conductive elements spans between the top and bottom molds. Dielectric material envelopes the middle portion and a displacement feature of the mold creates a vacancy. A ferrite element is deposited to the vacancy. A second top mold spans the bottom mold and dielectric material is deposited to create a molded assembly. A deposited patterned conductive coating connects the element ends to define the transformer coils.Type: GrantFiled: January 4, 2008Date of Patent: October 26, 2010Assignee: KeyEye CommunicationsInventors: William Lee Harrison, Stephen M. McConnell, Anh-Vu Pham
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Publication number: 20090002111Abstract: A method of arranging and fabricating parallel primary and secondary coils of a wideband planar transformer is provided. The spacing and width of the coils are disposed to extend the bandwidth from DC to GHz and allow for high frequency coupling when the core permeability dramatically drops and achieves low reflected energy and low loss over a wide bandwidth. A bottom mold having a pattern of hole-pairs with conductive elements inserted vertically couples to a top mold such that a middle portion of the conductive elements spans between the top and bottom molds. Dielectric material envelopes the middle portion and a displacement feature of the mold creates a vacancy. A ferrite element is deposited to the vacancy. A second top mold spans the bottom mold and dielectric material is deposited to create a molded assembly. A deposited patterned conductive coating connects the element ends to define the transformer coils.Type: ApplicationFiled: January 4, 2008Publication date: January 1, 2009Inventors: William Lee Harrison, Stephen M. McConnell, Anh-Vu Pham
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Publication number: 20080219289Abstract: A method of power management in a 10GBase-T Ethernet transceiver is provided. The 10GBase-T Ethernet transceiver is according to an IEEE 802.3an standard. The method includes determining a cable length from a transmitter to a receiver in the Ethernet. A low-power mode of the transceiver is enabled when the cable length is determined to be 30-meters or less, and the low-power mode of the transceiver is disabled when the cable length is determined to be greater than 30-meters. The cable length determination can be accomplished using time domain reflectometry prior to an auto-negotiation process, during the auto-negotiation process, or through interrogation of a management interface. The transceiver can be monitored, where an operational link speed is reduced when transmit and receive data is below a predetermined level for a predetermined duration.Type: ApplicationFiled: November 13, 2007Publication date: September 11, 2008Inventors: William Lee Harrison, Stephen M. McConnell