Abstract: Apparatus for retracting and extending sets of operational processing devices in a multi-device enclosure. In accordance with some embodiments, an enclosed housing is provided with opposing first and second ends. Sleds are individually movable between a retracted position within the enclosed housing and an extended position in which the sled projects from the first end. Each sled supports a group of processing devices. A control board is disposed within the enclosed housing adjacent the second end. A plurality of flex circuits contactingly engage the processing devices to provide communication paths between the processing devices and the control board in both the retracted and extended positions of the sleds.

Abstract: Apparatus and method for maintaining processing devices at a nominally common temperature, such as but not limited to storage devices in a multi-device networked storage enclosure. In accordance with some embodiments, an enclosed housing has a first side adjacent a cold zone with a lower ambient temperature and an opposing second side adjacent a warm zone with a higher ambient temperature. First and second processing devices are arranged within the enclosed housing so that the first processing device is adjacent the cold zone and the second processing device is adjacent the warm zone. First and second thermal interface material (TIM) modules are contactingly affixed to the first and second devices and are provided with different heat conductivities so that the first and second devices are maintained at a nominally common operational temperature.

Abstract: Apparatus and method for maintaining processing devices at a nominally common temperature, such as but not limited to storage devices in a multi-device networked storage enclosure. In accordance with some embodiments, an enclosed housing has a first side adjacent a cold zone with a lower ambient temperature and an opposing second side adjacent a warm zone with a higher ambient temperature. First and second processing devices are arranged within the enclosed housing so that the first processing device is adjacent the cold zone and the second processing device is adjacent the warm zone. First and second thermal interface material (TIM) modules are contactingly affixed to the first and second devices and are provided with different heat conductivities so that the first and second devices are maintained at a nominally common operational temperature.

Abstract: Apparatus and method for performing secure erasure of a processing device, such as a data storage device in an object storage system. In accordance with some embodiments, an apparatus is provided with a plurality of processing devices arranged within an enclosed housing and each having an associated memory. A mechanical switch is coupled to the enclosed housing. The associated memories of the processing devices are securely erased responsive to activation of the mechanical switch.

Abstract: Apparatus for retracting and extending sets of operational processing devices in a multi-device enclosure. In accordance with some embodiments, an enclosed housing is provided with opposing first and second ends. Sleds are individually movable between a retracted position within the enclosed housing and an extended position in which the sled projects from the first end. Each sled supports a group of processing devices. A control board is disposed within the enclosed housing adjacent the second end. A plurality of flex circuits contactingly engage the processing devices to provide communication paths between the processing devices and the control board in both the retracted and extended positions of the sleds.

Abstract: In order to improve signal to noise ratio and reduce electromagnetic interference, it is presently contemplated to connect ground potential on an electronic package mounted to a printed circuit board directly to a commonly grounded surface of a device via an improved die ground lead with a first end connected to an electrical circuit within the electronic package, and a second end extending away from the electronic package and compressively contacting, rather than forming a bonded or soldered connection to, the commonly grounded surface. By way of example and not limitation, the improved die ground lead may be any one of a tie bar, a metal lead, a pogo pin, and a spring. The use of this configuration for the ground connection between the electrical circuit and the commonly grounded surface results in significantly less physical distance than conventional ground paths for electrical circuits within electronic packages.

Abstract: A disc drive has actuator servo-controls and signal processing electronics positioned on, and electrically connected to, a flex printed circuit board positioned on a top surface of a base along with the actuator assembly and the spindle motor of the disc drive. A power combo chip is also positioned on the flex printed circuit board that is positioned on the top surface of the base. A top cover is attached to the base to form an enclosed space. The actuator assembly and the spindle motor are within the enclosed space and the actuator servo-controls and signal processing electronics are outside the enclosed space.

Abstract: A multi-chip package for a computer disc drive. In a preferred embodiment, the multi-chip package (MCP) includes a first die having a buffer function thereon, such as an SDRAM device, and a second die including a channel function and a controller function thereon. The two die are packaged in a single package for placement on a printed circuit board of the disc drive.

Abstract: An actuator assembly includes a rotatable actuator arm mounted on the base of a disc drive. The actuator arm includes a metallic member seated on a non-metallic body. A proximal end of a load beam is mounted on the actuator arm and a distal end of the load beam supports a head. The actuator assembly also includes a connection between the metallic member and the load beam that secures the load beam to the actuator arm.

Abstract: A disc drive has actuator servo-controls and signal processing electronics positioned on, and electrically connected to, a flex printed circuit board positioned on a top surface of a base along with the actuator assembly and the spindle motor of the disc drive. A power combo chip is also positioned on the flex printed circuit board that is positioned on the top surface of the base. A top cover is attached to the base to form an enclosed space. The actuator assembly and the spindle motor are within the enclosed space and the actuator servo-controls and signal processing electronics are outside the enclosed space.

Abstract: An actuator assembly includes a rotatable actuator arm mounted on the base of a disc drive. The actuator arm includes a metallic member seated on a non-metallic body. A proximal end of a load beam is mounted on the actuator arm and a distal end of the load beam supports a head. The actuator assembly also includes a connection between the metallic member and the load beam that secures the load beam to the actuator arm.

Abstract: A method and system are disclosed for protecting an electrical component from electrostatic discharge prior to its electrical connection to an additional component. Specifically, a flex on suspension circuit of a disc drive that is electrically connected to the read/write head is disclosed as having exposed leads for connection to a printed circuit cable assembly. The exposed leads are shunted with a solder conductor such as solder tape after testing of the circuit and head to prevent electrostatic build-up across the read and write elements. The flex on suspension circuit is then electrically connected to the printed circuit assembly cable by reflowing the solder conductor to bond the exposed leads of the flex on suspension circuit to the electrical contacts of the printed circuit assembly cable and also to remove the electrical short established between the exposed leads by the solder conductor.

Abstract: A method and system are disclosed for protecting an electrical component from electrostatic discharge prior to its electrical connection to an additional component. Specifically, a flex on suspension circuit of a disc drive that is electrically connected to the read/write head is disclosed as having exposed leads for connection to a printed circuit cable assembly. The exposed leads are shunted with a solder conductor such as solder tape after testing of the circuit and head to prevent electrostatic build-up across the read and write elements. The flex on suspension circuit is then electrically connected to the printed circuit assembly cable by reflowing the solder conductor to bond the exposed leads of the flex on suspension circuit to the electrical contacts of the printed circuit assembly cable and also to remove the electrical short established between the exposed leads by the solder conductor.