Patents by Inventor William Levingstone

William Levingstone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transparent antenna assembly with flexible transparent antenna
    Patent number: 12676396
    Abstract: A transparent antenna assembly and flexible transparent antenna. In one embodiment, the transparent antenna assembly includes a flexible transparent antenna having a transparent flexible substrate, the flexible transparent antenna being configured to operate according to a desired frequency band, the flexible transparent antenna including a portion that is configured to connect with a transparent substrate interface assembly; and a connector subassembly having a printed circuit board (PCB) mount connector, the PCB mount connector is configured to interface with the transparent flexible substrate via the transparent substrate interface assembly, the connector subassembly further including a radio frequency (RF) connector, the RF connector being in signal communication with the PCB mount connector.
    Type: Grant
    Filed: February 19, 2024
    Date of Patent: July 7, 2026
    Assignee: Taoglas Group Holdings Limited
    Inventors: William Levingstone, Vincent Hodnett, Baha Badran
  • TRANSPARENT ANTENNA ASSEMBLY AND FLEXIBLE TRANSPARENT ANTENNA
    Publication number: 20240283131
    Abstract: A transparent antenna assembly and flexible transparent antenna. In one embodiment, the transparent antenna assembly includes a flexible transparent antenna having a transparent flexible substrate, the flexible transparent antenna being configured to operate according to a desired frequency band, the flexible transparent antenna including a portion that is configured to connect with a transparent substrate interface assembly; and a connector subassembly having a printed circuit board (PCB) mount connector, the PCB mount connector is configured to interface with the transparent flexible substrate via the transparent substrate interface assembly, the connector subassembly further including a radio frequency (RF) connector, the RF connector being in signal communication with the PCB mount connector.
    Type: Application
    Filed: February 19, 2024
    Publication date: August 22, 2024
    Inventors: William Levingstone, Vincent Hodnett, Baha Badran