Patents by Inventor William Lewis Sked

William Lewis Sked has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic circuit construction method, as for a wireless RF tag
    Patent number: 6973716
    Abstract: A method for making an electronic circuit arrangement comprises providing a substrate having an electrical conductor thereon, wherein the electrical conductor includes two contacts spaced apart substantially a predetermined distance; providing an electronic jumper having two contacts spaced apart substantially the predetermined distance; mounting an electronic device on the electronic circuit jumper and having two contacts respectively connected to the two contacts of the electronic circuit jumper and then mounting the electronic circuit jumper on the substrate.
    Type: Grant
    Filed: December 11, 2003
    Date of Patent: December 13, 2005
    Assignee: Amerasia International Technology, Inc.
    Inventors: Kevin Kwong-Tai Chung, William Lewis Sked
  • Electronic circuit construction method, as for a wireless RF tag
    Publication number: 20040117985
    Abstract: An electronic circuit arrangement comprises a substrate having an electrical conductor thereon, wherein the electrical conductor includes two contacts spaced apart substantially a predetermined distance; an electronic jumper having two contacts spaced apart substantially the predetermined distance and respectively connected to the two contacts of the substrate; and an electronic device on the electronic circuit jumper and having two contacts respectively connected to the two contacts of the electronic circuit jumper.
    Type: Application
    Filed: December 11, 2003
    Publication date: June 24, 2004
    Inventors: Kevin Kwong-Tai Chung, William Lewis Sked
  • Electronic circuit construction, as for a wireless RF tag
    Patent number: 6665193
    Abstract: An electronic circuit arrangement comprises a substrate having an electrical conductor thereon, wherein the electrical conductor includes two contacts spaced apart substantially a predetermined distance; an electronic jumper having two contacts spaced apart substantially the predetermined distance and respectively connected to the two contacts of the substrate; and an electronic device on the electronic circuit jumper and having two contacts respectively connected to the two contacts of the electronic circuit jumper.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: December 16, 2003
    Assignee: Amerasia International Technology, Inc.
    Inventors: Kevin Kwong-Tai Chung, William Lewis Sked