Patents by Inventor William Lippert

William Lippert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5213747
    Abstract: A three-dimensional master of the article to be molded is provided. The surface of the master is coated with a mold release agent. A gel coat layer is then applied to the mold release agent coated surface of the master, and cured at about room temperature and preferably no greater than 55.degree. C., until the cured surface feels slightly tacky. At least one fiber-reinforced catalyzed resin layer is then applied to the cured gel coat layer and cured. The resin layer includes a room temperature curing, low shrinkage thermosetting filled paste system including 25 to 75 percent of an unsaturated polyester resin, 1 to 25 weight percent of a mixture of thermoplastic polymers of vinyl acetate, an epoxy compound having at least one 1,2-epoxy group per molecule, and 25 to 75 percent filler. The resin is preferably cured at room temperature for about 30 minutes to 4 hours using a free radical initiator which is mixed with the resin as it is being applied.
    Type: Grant
    Filed: August 27, 1991
    Date of Patent: May 25, 1993
    Inventor: William Lippert