Patents by Inventor William Lutap

William Lutap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9839142
    Abstract: A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: December 5, 2017
    Assignee: IMI USA, Inc.
    Inventors: Timothy P. Patterson, William Lutap, Roger Nguyen
  • Publication number: 20150342061
    Abstract: A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.
    Type: Application
    Filed: August 6, 2015
    Publication date: November 26, 2015
    Inventors: Timothy P. Patterson, William Lutap, Roger Nguyen
  • Publication number: 20120273559
    Abstract: A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.
    Type: Application
    Filed: April 27, 2012
    Publication date: November 1, 2012
    Inventors: Timothy P. Patterson, William Lutap, Roger Nguyen