Patents by Inventor William Lytle
William Lytle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11786321Abstract: A robotic surgical system includes a robotic manipulator that includes a mounting fixture defining a longitudinal channel, and a surgical tool removably coupleable to the mounting fixture. The surgical tool including a tool housing matable with the mounting fixture, an elongate shaft extending from the tool housing and receivable within the channel, and a latching mechanism provided on the elongate shaft and comprising one or more retention tabs biased radially outward with one or more biasing members. The one or more retention tabs are movable between a deployed state, where the one or more retention tabs protrude radially outward through a corresponding one or more slots to engage the mounting fixture, and a retracted state, where the one or more retention tabs are urged radially inward through the one or more slots to disengage the mounting fixture.Type: GrantFiled: September 28, 2020Date of Patent: October 17, 2023Assignee: Cilag GmbH InternationalInventors: David C. Yates, Thomas William Lytle, IV, Kharyl Evenson George Stephens, John Scott Kimsey, Lauren S. Weaner, Joshua Dean Young
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Publication number: 20210007813Abstract: A robotic surgical system includes a robotic manipulator that includes a mounting fixture defining a longitudinal channel, and a surgical tool removably coupleable to the mounting fixture. The surgical tool including a tool housing matable with the mounting fixture, an elongate shaft extending from the tool housing and receivable within the channel, and a latching mechanism provided on the elongate shaft and comprising one or more retention tabs biased radially outward with one or more biasing members. The one or more retention tabs are movable between a deployed state, where the one or more retention tabs protrude radially outward through a corresponding one or more slots to engage the mounting fixture, and a retracted state, where the one or more retention tabs are urged radially inward through the one or more slots to disengage the mounting fixture.Type: ApplicationFiled: September 28, 2020Publication date: January 14, 2021Applicant: Ethicon LLCInventors: David C. Yates, Thomas William Lytle, IV, Kharyl Evenson George Stephens, John Scott Kimsey, Lauren S. Weaner, Joshua Dean Young
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Patent number: 10786316Abstract: Robotic surgical tools can incorporate a latching mechanism as a secondary fastener to maintain operable coupling between the robotic surgical tool and a mounting fixture of a robotic manipulator. Such robotic surgical tools may comprise: a tool housing, an elongate shaft extending from the tool housing, and a latching mechanism arranged on the elongate shaft. The latching mechanism comprises one or more retention tabs that are biased radially outward with one or more biasing members. The one or more retention tabs are configured to transition between a retracted state and a deployed state under influence of a biasing force supplied by the one or more biasing members. In the deployed state, the one or more retention tabs are positioned to engage an exterior surface of a mounting fixture of a robotic manipulator. In the retracted state, the one or more retention tabs are positioned to disengage from the mounting fixture.Type: GrantFiled: November 28, 2017Date of Patent: September 29, 2020Assignee: Ethicon LLCInventors: David C. Yates, Thomas William Lytle, IV, Kharyl Evenson George Stephens, John Scott Kimsey, Lauren S. Weaner, Joshua Dean Young
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Publication number: 20190159846Abstract: Robotic surgical tools can incorporate a latching mechanism as a secondary fastener to maintain operable coupling between the robotic surgical tool and a mounting fixture of a robotic manipulator. Such robotic surgical tools may comprise: a tool housing, an elongate shaft extending from the tool housing, and a latching mechanism arranged on the elongate shaft. The latching mechanism comprises one or more retention tabs that are biased radially outward with one or more biasing members. The one or more retention tabs are configured to transition between a retracted state and a deployed state under influence of a biasing force supplied by the one or more biasing members. In the deployed state, the one or more retention tabs are positioned to engage an exterior surface of a mounting fixture of a robotic manipulator. In the retracted state, the one or more retention tabs are positioned to disengage from the mounting fixture.Type: ApplicationFiled: November 28, 2017Publication date: May 30, 2019Applicant: Ethicon LLCInventors: David C. Yates, Thomas William Lytle, VI, Kharyl Evenson George Stephens, John Scott Kimsey, Lauren S. Weaner, Joshua Dean Young
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Publication number: 20070237631Abstract: A split shroud system for a gas turbine engine having a pair of annular-shaped shrouds that each have an inner pocket; to form a pair of inner pockets. Each of the pair of pockets having liner parts that form a circle. Liner parts of one of the pair of pockets facing liner parts of the other of the pair of pockets to form liner part pairs. One of each of said of pair of liner parts has a mutual abutting surface that forms a plurality of slots for accepting a plurality of vane inner trunnions.Type: ApplicationFiled: September 2, 2005Publication date: October 11, 2007Inventor: William Lytle
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Publication number: 20070210427Abstract: Methods and apparatus are provided for an electronic panel assembly (EPA) (82, 83), comprising: providing one or more electronic devices (30) with primary faces (31) having electrical contacts (36), opposed rear faces (33) and edges (32) therebetween. The devices (30) are mounted primary faces (31) down on a temporary support (60) in openings (44) in a warp control sheet (WCS) (40) attached to the support (60). Plastic encapsulation (50) is formed at least between lateral edges (32, 43) of the devices (30) and WCS openings (44). Undesirable panel warping (76) during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. After encapsulation cure, the EPA (82) containing the devices (30) and the WCS (40) is separated from the temporary support (60) and, optionally, mounted on another carrier (70) with electrical contacts (36) exposed.Type: ApplicationFiled: March 10, 2006Publication date: September 13, 2007Inventors: William Lytle, Scott Hayes, George Leal
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Publication number: 20060128066Abstract: Methods and apparatus are provided for use in manufacturing a device packaging comprising the steps of: positioning a metal substrate such as spring steel on a magnetic plate so as to expose a surface of the metal substrate; placing a first tape layer on the exposed surface of a metal substrate so as to expose a nonstick surface of the first tape layer such as PTFE; placing a second tape layer on the exposed surface of the first tape layer so as to expose a surface of the second tape layer; positioning a mold frame on the exposed surface of the second tape layer; positioning a die within the mold frame; depositing epoxy within the mold frame; curing the epoxy so as to create a molded panel; removing the mold frame; grinding the molded panel to a desired thickness; separating the first tape layer from the second tape layer so as to separate the metal substrate from the molded panel; and peeling the second tape layer from the molded panel.Type: ApplicationFiled: December 10, 2004Publication date: June 15, 2006Inventors: William Lytle, Craig Amrine
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Publication number: 20050104207Abstract: The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.Type: ApplicationFiled: November 5, 2004Publication date: May 19, 2005Inventors: Timothy Dean, Terance Blake, Gregory Dunn, Remy Chelini, William Lytle, Owen Fay, George Strumberger
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Publication number: 20050001324Abstract: The invention provides an integrated device with corrosion-resistant capped copper bond pads. The capped copper bond pads include at least one copper bond pad on a semiconductor substrate. An activation layer comprising one of immersion palladium, electroless cobalt, or immersion ruthernium is disposed on the copper bond pad. A first intermediate layer of electroless nickel-boron alloy is disposed on the activation layer. A second intermediate layer comprising one of electroless nickel or electroless palladium is disposed on the first intermediate layer, and an immersion gold layer is disposed on the second intermediate layer. A capped copper bond pad and a method of forming the capped copper bond pads are also disclosed.Type: ApplicationFiled: July 1, 2003Publication date: January 6, 2005Inventors: Gregory Dunn, Owen Fay, Timothy Dean, Terance Blake, Remy Chelini, William Lytle, George Strumberger
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Publication number: 20050001316Abstract: The invention provides an integrated device with corrosion-resistant capped bond pads. The capped bond pads include at least one aluminum bond pad on a semiconductor substrate. A layer of electroless nickel is disposed on the aluminum bond pad. A layer of electroless palladium is disposed on the electroless nickel, and a layer of immersion gold is disposed on the electroless palladium. A capped bond pad and a method of forming the capped bond pads are also disclosed.Type: ApplicationFiled: July 1, 2003Publication date: January 6, 2005Inventors: Timothy Dean, Terance Blake, Gregory Dunn, Remy Chelini, William Lytle, Owen Fay, George Strumberger
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Publication number: 20050003677Abstract: The invention provides a method of plating an integrated circuit. An activation plate is positioned adjacent to at least one integrated circuit. The integrated circuit includes a plurality of bond pads comprising a bond-pad metal, and the activation plate also comprises the bond-pad metal. A layer of electroless nickel is plated on the bond pads and the activation plate, and a layer of gold is plated over the layer of electroless nickel on the bond pads and the activation plate. An integrated circuit with bond pads plated using the activation plate, and a system for plating an integrated circuit is also disclosed.Type: ApplicationFiled: July 1, 2003Publication date: January 6, 2005Inventors: Timothy Dean, William Lytle
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Publication number: 20040059412Abstract: Several embodiments of a heart valve holder are described. In one instance, the heart valve holder is comprised of a plurality of hollow members having a plurality of openings formed therein. The heart valve holder is adapted to engage a heart valve through use of vacuum pressure. In another instance, a heart valve holder comprised of at least one inflatable balloon member is disclosed. When inflated, the balloon members may be used to hold the heart valve during implantation.Type: ApplicationFiled: September 25, 2002Publication date: March 25, 2004Inventors: Thomas William Lytle, Jimmie B. Allred
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Patent number: 6659892Abstract: A practice goal apparatus comprises a box-like structure having an open face and providing plural interior faces adapted to rebound a resilient ball upon impact. The plural interior faces are set at selected angles such that the resilient ball, upon forcefully entering the box-like structure through the open face, from any direction will rebound in a manner resulting in forceful exit from the box-like structure back to the kicker. The apparatus has a hollow base that may be filled with water or sand to anchor it in place.Type: GrantFiled: December 21, 2001Date of Patent: December 9, 2003Inventors: Thomas William Lytle, Fred Saldana
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Patent number: 6591998Abstract: A packaging for an implantable medical device such as a heart valve wherein the implantable medical device is immersed in a liquid medium. The packaging comprises a jar and a lid assembly having a seal and a ridge therebetween, the ridge being adapted to contact the seal. At least one circumferential leg is interposed between the lid assembly and the jar. The leg maintains a predetermined spacing between the lid and the jar and may be loaded in compression. The lid assembly may comprise a lid and an overcap. The overcap may turn independently of the lid and may apply compressive pressure to the lid over the ridge and seal. The lid and overcap may be coupled together by, for example, mating snap hooks. At least one of the lid or overcap may have a plurality of snap hooks. At least one of the plurality of snap hooks may be of different length than other of the snap hooks, whereby an asymmetric force may be applied to the lid when the overcap is loosened from the jar.Type: GrantFiled: December 21, 2000Date of Patent: July 15, 2003Assignee: Sulzer Carbomedics Inc.Inventors: Clinton A. Haynes, Reginald D. Fortson, Kenneth D. Waeber, Douglas L. Marriot, Thomas William Lytle, IV
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Publication number: 20030119611Abstract: A practice goal apparatus comprises a box-like structure having an open face and providing plural interior faces adapted to rebound a resilient ball upon impact. The plural interior faces are set at selected angles such that the resilient ball, upon forcefully entering the box-like structure through the open face, from any direction will rebound in a manner resulting in forceful exit from the box-like structure back to the kicker. The apparatus has a hollow base that may be filled with water or sand to anchor it in place.Type: ApplicationFiled: December 21, 2001Publication date: June 26, 2003Inventors: Thomas William Lytle, Fred Saldana
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Publication number: 20020079286Abstract: A packaging for an implantable medical device such as a heart valve wherein the implantable medical device is immersed in a liquid medium. The packaging comprises ajar and a lid assembly having a seal and a ridge therebetween, the ridge being adapted to contact the seal. At least one circumferential leg is interposed between the lid assembly and the jar. The leg maintains a predetermined spacing between the lid and the jar and may be loaded in compression. The lid assembly may comprise a lid and an overcap. The overcap may turn independently of the lid and may apply compressive pressure to the lid over the ridge and seal. The lid and overcap may be coupled together by, for example, mating snap hooks. At least one of the lid or overcap may have a plurality of snap hooks. At least one of the plurality of snap hooks may be of different length than other of the snap hooks, whereby an asymmetric force may be applied to the lid when the overcap is loosened from the jar.Type: ApplicationFiled: December 21, 2000Publication date: June 27, 2002Inventors: Clinton A. Haynes, Reginald D. Fortson, Kenneth R. Waeber, Douglas L. Marriott, Thomas William Lytle