Patents by Inventor William M. Atkinson

William M. Atkinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication tool for bonding
    Patent number: 7866364
    Abstract: A fabrication tool presses a first device surface against a second device surface after the first and the second device surfaces have been plasma activated, to bond the first device surface with the second device surface. The fabrication tool includes a bonding piston to exert force on the first device surface to press the first device surface against the second device surface. The fabrication tool also includes a pressure plate situated between the bonding piston and the first device surface. The fabrication tool further includes a mechanism to ensure that the force exerted by the bonding piston on the first device surface via the pressure plate is initially exerted at one or more first locations on the first device surface and subsequently exerted at one or more second locations on the first device surface.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: January 11, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Troy D. Schwinabart, William M. Atkinson