Abstract: A virtual fabrication environment for semiconductor device fabrication that includes an analytics module for performing key parameter identification, process model calibration and variability analysis is discussed.

Abstract: The present invention includes a process using environmentally friendly materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The process uses a novel adhesive remover composition comprising one or more non-halogenated organic solvents, a non-abrasive thickening agent, a surfactant, and a vapor-pressure modulating agent. The total Hansen Solubility Parameter (?t) at 25° C. for each of the non-halogenated organic solvents is from about 14 MPa1/2 to about 24 MPa1/2. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.

Abstract: The present invention includes a process using environmentally friendly materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The process uses a novel adhesive remover composition comprising one or more non-halogenated organic solvents, a non-abrasive thickening agent, a surfactant, and a vapor-pressure modulating agent. The total Hansen Solubility Parameter (?t) at 25° C. for each of the non-halogenated organic solvents is from about 14 MPa1/2 to about 24 MPa1/2. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.

Abstract: The present invention includes a process using environmentally friendly materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The process uses a novel adhesive remover composition comprising one or more non-halogenated organic solvents, a non-abrasive thickening agent, a surfactant, and a vapor-pressure modulating agent. The total Hansen Solubility Parameter (?t) at 25° C. for each of the non-halogenated organic solvents is from about 14 MPa1/2 to about 24 MPa1/2. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.

Abstract: The present invention includes a process using environmentally friendly materials for the removal of adhesive residues from hard substrates, particularly vehicles, e.g., cars, trucks, buses, aerospace vehicles including airplanes, and the like. The process uses a novel adhesive remover composition comprising one or more non-halogenated organic solvents, a non-abrasive thickening agent, a surfactant, and a vapor-pressure modulating agent. The total Hansen Solubility Parameter (?t) at 25° C. for each of the non-halogenated organic solvents is from about 14 MPa1/2 to about 24 MPa1/2. The invention provides a cost effective, safe, environmentally friendly adhesive remover composition specifically formulated for removal of, e.g., pressure sensitive adhesive residues from large areas of aircraft composite and aluminum surfaces, as well as others.