Abstract: A removable, reusable safety light comprises a light strip and a protective jacket. The light strip comprises a plurality of microlights, such as LEDs, connected together in parallel by electrical lead wires and encased in a weather and shock resistant microlight protective housing. Control circuitry is provided for controlling operation of the light strip, and comprises control electronics and a printed circuit board. A power source, such as a battery, is included for powering the light strip. The battery is connected to the plurality of microlights via the control circuitry. The control electronics, printed circuit board and battery are housed in a control circuitry housing affixed to the microlight housing tube. The protective jacket is configured to hold the light strip, and can be configured for removably mounting the safety light on an object or the clothing of an individual.

Abstract: A microaccelerometer package is provided for use in on-board automotive safety control and navigational systems. The microaccelerometer package is constructed so as to minimize the influence of extraneous mechanical stress and vibrational resonance on the micromachined accelerometer. The microaccelerometer package includes a rigid housing in which there is a cavity for receiving the micromachined accelerometer unit and the signal-processing circuitry. The lower surface of the cavity is interrupted by a recess projecting below the plane of the lower surface. The micromachined accelerometer unit is secured within the recess so as to be below the plane of the lower surface. The signal-processing circuitry is supported by a substrate which is secured to the lower surface of the cavity.

Abstract: An interface device for thermally coupling an integrated circuit to a heat sink having a first material characterized by high thermal conductivity such as copper, where the copper completely surrounds a plurality of inner core regions. The plurality of inner core regions contain a low coefficient of thermal expansion material and are primarily disposed in the copper material in the region directly under the integrated circuit. The low expansion regions retard thermal expansion of the interface device during exposure to variations in the temperature, yet there are continuous paths of copper provided between the integrated circuit and heat sink to promote efficient heat transfer between the silicon chip to the heat sink through the high conductivity copper. In addition, high thermal resistance layers are provided for dielectric isolation between an integrated circuit chip and heat sink, when necessary, using this invention.