Abstract: An ultrasonic surgical device is disclosed including a surgical tool including a proximal transducer mounting portion defining a surface, a distal end effector end, and a waveguide disposed therebetween, the waveguide extending along a longitudinal axis. The ultrasonic surgical device further includes a transducer is in mechanical communication with the surface of the transducer mounting portion. The transducer is configured to operate in a D31 mode with respect to the longitudinal axis of the waveguide. Upon activation by an electrical signal having a predetermined frequency component, the transducer is configured to induce a standing wave in the surgical tool to cause the end effector to vibrate, the standing wave having a wavelength proportional to the predetermined frequency component of the electrical signal.

Abstract: Solder is applied to a circuit structure 7 by dipping the structure into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The structure is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit structure. This is achieved by supporting the structure on a carrier 9 which in turn is attached to a motor shaft 11.

Abstract: Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The solder is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

Abstract: Solder is applied to a circuit structure 7 by dipping the structure into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The structure is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit structure. This is achieved by supporting the structure on a carrier 9 which in turn is attached to a motor shaft 11.

Abstract: Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The board is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

Abstract: Method of providing a printed circuit board with a cover coat on a selected area thereof characterized by the steps of:i) applying a photoresist material to an area of the board not to be provided permanently with a cover coat;ii) applying a photosensitive material to both the photoresist and the area of the board to be provided with cover coat;iii) blanket exposing the board to light to promote reaction of photoresist material with photosensitive material only in areas in which the photosensitive material and photoresist interface;iv) removing the reaction product of photoresist material and photosensitive material from the interface areas; andv) curing the remaining photosensitive material to convert the cover coat.

Abstract: This invention is for wood fiber crumbles, and a method for making the same, for use as an animal litter, a petroleum spill absorbent, floor sweeping material, and mulch. Grists of an assortment of types of wood are combined and admixed, dried, moisturized, pelletized, and ground to form crumbles. Depending upon the selection types of wood utilized, the crumbles are capable of rapidly and efficiently absorbing animal excretions and petroleum, minimizing unpleasant odors, restricting the growth of microorganisms, repelling insect pests, and adding or removing nitrogen to soil when used as a mulch.

Abstract: A semiconductor integrated display is disclosed herein in which a matrix of conductive display electrodes is formed over a corresponding matrix of switching devices which are integrated in a single crystal semiconductor chip such that the display electrodes are connected to their respective switching devices through respective conductive paths. The display electrodes are divided into a plurality of subsets each of which is formed in respective layers, so that the display electrodes of an upper subset overlap the edges of the display electrodes of the lower subset. The display electrode layers are separated by intermediate layers of electrically insulating material. The conductive paths from each higher layer subset passes through gaps between electrodes of any lower subset and through the insulating layers to connect their respective electrodes to the corresponding switching devices.

Abstract: A trivalent chromium electroplating solution containing trivalent chromium ions, a complexant, a buffer and an organic compound having a --C.dbd.S group or a --C--S-- group. The complexant is selected to give the chromium complex a stability constant, K.sub.1, in the range 10.sup.8 <K.sub.1 <10.sup.12 M.sup.-1.

Abstract: A trivalent chromium electroplating solution containing trivalent chromium ions, a complexant, a buffer and thiocyanate ions. The thiocyanate is of a molar concentration which is lower than the molar concentration of the chromium ions, and the chromium ion concentration being lower than 0.1 M. The stability constant, K.sub.1, of the solution's chromium complex is in the range 10.sup.8 <K.sub.1 <10.sup.12 M.sup.-1.

Abstract: A trivalent chromium electroplating solution containing trivalent chromium ions, a complexant, a buffer and a sulphur species having S--O or S--S bonds. The complexant is selected to give the chromium complex a stability constant, K.sub.1, in the range 10.sup.6 <K.sub.1 <10.sup.12 M.sup.-1.

Abstract: A trivalent chromium electroplating solution containing trivalent chromium ions, a complexant, a buffer and a sulphur species selected from sulphites and dithionites, the complexant being selected to impart a stability constant, K.sub.1, to the chromium complex which is in the range 10.sup.6 <K.sub.1 <10.sup.12 M.sup.-1. The chromium ion molar concentration is lower than 0.01M. The complexant is selected from aspartic acid, iminodiacetic acid, nitrilotriacetic acid, 5-sulphosalicylic acid or citric acid.

Abstract: A plating solution and method of forming such a solution for plating chromium and its alloys from Cr(III) is disclosed. The solution is an aqueous solution of a chromium(III) thiocyanate complex having at least a ligand other than water or thiocyanate in the inner coordination sphere.

Abstract: An electrochromic display device, preferably employing an organic electrochromic material such as heptyl viologen, has display electrodes with a rough surface in contact with the electrochromic material. The device is operated at a sufficiently high current density so that the diffusion depth of the material conforms to the contours of the electrodes.

Abstract: A chromium or chromium alloy plating system and material are disclosed. The chromium is supplied by an aqueous equilibrated solution of a chromium (III) thiocyanate complex. A buffer material which also supplies one of the ligands to the chromium complex is provided. The buffer material is selected from amino acids, peptides, formates, acetates and hypophosphites.

Abstract: A plating solution, the making thereof and the use for chromium plating is disclosed. The solution is an equilibrated essentially aqueous solution of a hexavalent thiocyanatochromium III complex wherein the ratio of the total chromium III to the total thiocyanate is about 1:6. A preferred and improved method of making the solution from a hexathiocyanatochromium salt is also disclosed.

Abstract: Chromium containing deposits free of cracks and having good hardness are plated by the use of a novel aqueous chromium (III) electrolyte. The electrolyte includes an aquo chromium (III)-thiocyanato complex as a source of chromium (III) cations.