Abstract: Aspects of the present disclosure includes a method of manufacturing a radio frequency identification (RFID) tag, including connecting a first wire and a second wire across a chip, maintaining the spaced apart distance between the first wire and the second wire adjacent to each side of the chip to define a spaced apart segment of the first wire and the second wire that forms part of an inductive loop, connecting the first wire and the second wire at each side of the chip distal from and adjacent to the spaced apart segment of the first wire and the second wire to close the inductive loop, define connected wire segments, and to form an RFID assembly, and moving the RFID assembly through a casing material at or above a glass transition temperature of the casing material to encase the RFID assembly.

Abstract: Aspects of the present disclosure includes a method of manufacturing a radio frequency identification (RFID) tag, including connecting a first wire and a second wire across a chip, maintaining the spaced apart distance between the first wire and the second wire adjacent to each side of the chip to define a spaced apart segment of the first wire and the second wire that forms part of an inductive loop, connecting the first wire and the second wire at each side of the chip distal from and adjacent to the spaced apart segment of the first wire and the second wire to close the inductive loop, define connected wire segments, and to form an RFID assembly, and moving the RFID assembly through a casing material at or above a glass transition temperature of the casing material to encase the RFID assembly.