Abstract: Structures that implement three-dimensional (3D) conductive material (e.g., copper) in printed circuit boards (PCBs) are disclosed. 3D (three-dimensional) conductive material may include trenches and/or buried vias that are filled with conductive material in the PCBs. Trenches may be formed in build-up layers of a PCB by overlapping multiple laser drilled vias. The trenches may be filled with conductive material using electroplating process(es). Buried vias may be formed through the core layers of the PCB by mechanical drilling. The buried via may be filled with solid conductive material using a combination of electroless plating and electrolytic plating of conductive material. Various PCB structures are disclosed that implement combinations of these trenches and/or these buried vias filled with conductive material.

Abstract: A method and apparatus for edge finishing glass sheets, wherein a polymer film is deposited onto the major surface of the glass sheet. The polymer film is contacted, perforated, or cut using a water jet and the edges of the sheet are then ground or polished The polymer film is cut or perforated in a manner which facilitates against loading of the grinding or polishing device employed.

Abstract: A structural building module has first and second upright cast structural members. Each of the first and second structural upright members include a wall portion and a roof portion. These structural members are initially supported on erection pads such that the wall portions are upright and the roof portions project toward one another such that the roof portions can be joined together. After joining the roof portions a structural base is formed in situ by casting. The structural base is attached to the wall portions of the structural members by entraining into the structural base, attaching members projecting out of the wall portions near their bottom edge.

Abstract: Hermetically sealed lead-in structures of the compression seal type, useful for electronic devices and particularly for transistor and integrated circuit headers, are described. The seal structures comprise a glass-metal compression seal between steel casing and low-expansion cobalt-nickel-iron alloy leads, utilizing specific glassy sealing materials which impart thermal shock resistance of at least 425.degree. C. to the compression seal.