Patents by Inventor William Macropoulos

William Macropoulos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090078456
    Abstract: At least an embodiment of the present technology provides a method of manufacturing a mechanically adapting interconnecting device for multi-substrate packages comprising placing a metal laminate on each side of a polymer composite, forming a channel in the metal laminate; and metallizing the laminate to create a metal connection inside the channel.
    Type: Application
    Filed: September 27, 2008
    Publication date: March 26, 2009
    Inventors: William Macropoulos, Izzac Khayo, Greg Mendolia
  • Patent number: 7471146
    Abstract: An embodiment of the present invention provides an apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a top tier substrate and a second portion of the integrated circuit is placed on a bottom tier substrate stacked adjacent the top tier substrate and wherein the first portion and the second portion of the integrated circuit are interconnected; and printed spiral arms stacked vertically on both the top and bottom surface of the top tier substrate thereby creating high Q inductors.
    Type: Grant
    Filed: February 14, 2006
    Date of Patent: December 30, 2008
    Assignee: Paratek Microwave, Inc.
    Inventors: William Macropoulos, Greg Mendolia, James G. Oakes, Izz Khayo
  • Publication number: 20060267174
    Abstract: An embodiment of the present invention provides an apparatus, comprising a plurality of stacked substrates, wherein the substrates are capable of accepting surface mounted components (SMCs) and wherein the plurality of stacked substrates are separated and connected by the surface mounted components (SMC) or solder balls or both.
    Type: Application
    Filed: February 6, 2006
    Publication date: November 30, 2006
    Inventors: William Macropoulos, Greg Mendolia, Izzac Khayo
  • Publication number: 20060245308
    Abstract: At least an embodiment of the present technology provides a device, comprising at least one passive component, at least one active component and at least two substrates. The substrates may be advantageously stacked to form a 3D structure. The active and passive components may be advantageously placed in between said substrates to create a compact monolithic 3D device. At least one embodiment of the technology comprises at least a passive component disposed in between said substrates in order to manipulate, distort or otherwise transform at least one electrical signal from one substrate to the next. In another embodiment of the technology at least an interconnector device may be disposed upon at least one substrate in order to respond to mechanical distortions of said substrates under thermal and mechanical stresses.
    Type: Application
    Filed: February 24, 2006
    Publication date: November 2, 2006
    Inventors: William Macropoulos, Izzac Khayo, Greg Mendolia
  • Publication number: 20060214165
    Abstract: An apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a first substrate and a second portion of the integrated circuit is placed on a second substrate stacked adjacent the first substrate and wherein the first portion and the second portion of the integrated circuit are interconnected.
    Type: Application
    Filed: February 14, 2006
    Publication date: September 28, 2006
    Inventors: William Macropoulos, Greg Mendolia, James Oakes, Izz Khayo