Patents by Inventor William Minehan

William Minehan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective metallization of integrated circuit packages
    Patent number: 11309251
    Abstract: The disclosed technology generally relates to metallization of substrates, and more particularly to selective metallization of ceramic substrates. A method of selectively metallizing a substrate includes forming a base metal layer comprising a refractory metal on a substrate, forming a base nickel (Ni) layer over the base metal layer by a vapor phase process, forming a palladium (Pd) layer on the base Ni layer by electroless plating, and forming a gold (Au) layer on the Pd layer.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: April 19, 2022
    Assignee: AdTech Ceramics Company
    Inventors: Aaron Fitzsimmons, William Minehan
  • SELECTIVE METALLIZATION OF INTEGRATED CIRCUIT PACKAGES
    Publication number: 20190035735
    Abstract: The disclosed technology generally relates to metallization of substrates, and more particularly to selective metallization of ceramic substrates. A method of selectively metallizing a substrate includes forming a base metal layer comprising a refractory metal on a substrate, forming a base nickel (Ni) layer over the base metal layer by a vapor phase process, forming a palladium (Pd) layer on the base Ni layer by electroless plating, and forming a gold (Au) layer on the Pd layer.
    Type: Application
    Filed: July 31, 2018
    Publication date: January 31, 2019
    Inventors: Aaron Fitzsimmons, William Minehan