Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: A cross reality system that provides an immersive user experience by storing persistent spatial information about the physical world that one or multiple user devices can access to determine position within the physical world and that applications can access to specify the position of virtual objects within the physical world. Persistent spatial information enables users to have a shared virtual, as well as physical, experience when interacting with the cross reality system. Further, persistent spatial information may be used in maps of the physical world, enabling one or multiple devices to access and localize into previously stored maps, reducing the need to map a physical space before using the cross reality system in it. Persistent spatial information may be stored as persistent coordinate frames, which may include a transformation relative to a reference orientation and information derived from images in a location corresponding to the persistent coordinate frame.

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: A cable retractor enclosure having a weighted cable pulley and cable pulley guide rails. The cable pulley is rotatable about a pivot and configured to translate along said grooves when a cable wrapped underneath is extracted from the cable retractor enclosure. The cable extends outside of the retractor enclosure from its upper end and provides a cable end plug that sits within a retractor module insert. Weights may be attached to the cable pulley in order to leverage gravitational forces, which result in a bias causing the cable to retract back into the enclosure. Friction forces against the extracted cable can be used to prevent the gravitational bias the cable pulley exerts (retraction forces) on the cable by bending the cable to lay flat onto a table surface.

Abstract: A cable retractor enclosure having a weighted cable pulley and cable pulley guide rails. The cable pulley is rotatable about a pivot and configured to translate along said grooves when a cable wrapped underneath is extracted from the cable retractor enclosure. The cable extends outside of the retractor enclosure from its upper end and provides a cable end plug that sits within a retractor module insert. Weights may be attached to the cable pulley in order to leverage gravitational forces, which result in a bias causing the cable to retract back into the enclosure. Friction forces against the extracted cable can be used to prevent the gravitational bias the cable pulley exerts (retraction forces) on the cable by bending the cable to lay flat onto a table surface.

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau