Patents by Inventor William Muth

William Muth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8514374
    Abstract: A method provides improved alignment for a photolithographic exposure. In such method, a first exposure tool and a first chuck used in a reference photolithographic exposure of a first material layer on a substrate can be identified. The substrate typically includes at least a semiconductor layer. The first chuck typically is one of a plurality of chucks usable with the first exposure tool. The method may further include identifying a second exposure tool and a second chuck used in a current photolithographic exposure of a second material layer on the substrate. In one embodiment, alignment correction information specific to each of the identified first exposure tool, the first chuck, the second exposure tool and the second chuck can be used in aligning the semiconductor substrate to a second exposure tool and a second chuck.
    Type: Grant
    Filed: November 4, 2009
    Date of Patent: August 20, 2013
    Assignee: International Business Machines Corporation
    Inventors: Todd C. Bailey, William Chu, William Muth
  • Publication number: 20110102760
    Abstract: A method provides improved alignment for a photolithographic exposure. In such method, a first exposure tool and a first chuck used in a reference photolithographic exposure of a first material layer on a substrate can be identified. The substrate typically includes at least a semiconductor layer. The first chuck typically is one of a plurality of chucks usable with the first exposure tool. The method may further include identifying a second exposure tool and a second chuck used in a current photolithographic exposure of a second material layer on the substrate. In one embodiment, alignment correction information specific to each of the identified first exposure tool, the first chuck, the second exposure tool and the second chuck can be used in aligning the semiconductor substrate to a second exposure tool and a second chuck.
    Type: Application
    Filed: November 4, 2009
    Publication date: May 5, 2011
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Todd C. Bailey, William Chu, William Muth
  • Patent number: 4693380
    Abstract: A support member for an inclined open mesh or wire type shelf that can be spaced anywhere along a wall and shelf area to provide support for the inclined shelf. The support is a one piece molded structure having a T-type cross-section with the shank having curved lower and upper ends with those curves providing about a 60.degree. angle of inclination for the shelf. One end includes a flat surface for engaging the wall with the other end including a forwardly directed groove for receiving a crosswise support in the middle of the shelf and a pair of grooves extending perpendicular to that forwardly directed groove sized so that that end of the support can snap in place between two stringers within the shelf structure.
    Type: Grant
    Filed: December 19, 1986
    Date of Patent: September 15, 1987
    Assignee: Clairson International
    Inventor: William Muth