Abstract: An RFID antenna comprised of a first arm, load element, and second arm together providing a complex impedance match to one or more load circuits contained within the load element for operation at one or more frequency bands. The load element is comprised of one or more load circuits. Load circuits are further comprised of one or more RFID transponders, energy scavengers, microcontrollers, and associated sensor circuits. The first and second arms are different in length and shape resulting in an asymmetrical antenna structure along the major axis. The first arm, the load element, and the second arm all comprise radiative electromagnetic structures for ultra high frequency and higher bands of operation. Embodiments provide an antenna with Faraday coils located within the arms operating in one or more of low frequency and, high frequency bands.

Abstract: An antenna for a Radio-Frequency IDentification (RFID) system is disclosed that comprises a resonant structure, an RFID load element, and a floating coupling element. One of the two terminals of the RFID load element is connected directly to the resonant structure, and the other terminal is connected to the floating coupling element. The floating coupling element is electrically isolated from the resonant structure; its presence provides an improved impedance match to the RFID load element.

Abstract: A system for monitoring parameters associated with a device, such as current, voltage, power, temperature, energy consumed, moisture, fluid levels and flow, wind speed, identification parameters, and repair history. The system includes the use of hybrid RFID sensor tags including a combination of active, semi-passive, and passive RFID circuits. Hybrid tags are attached to electrical system components. Standalone electrical components and generators and those connected to the electrical grid may be monitored. Data collected and stored in the hybrid tags may be accessed via a wireless communication link between hybrid tags and either active scanners or a passive interrogators. The data collected and processed from the hybrid tags may be provided to a user via the Internet or another wired or wireless communication network.

Abstract: An RFID antenna comprised of a first arm, load element, and second arm together providing a complex impedance match to one or more load circuits contained within the load element for operation at one or more frequency bands. The load element is comprised of one or more load circuits. Load circuits are further comprised of one or more RFID transponders, energy scavengers, microcontrollers, and associated sensor circuits. The first and second arms are different in length and shape resulting in an asymmetrical antenna structure along the major axis. The first arm, the load element, and the second arm all comprise radiative electromagnetic structures for ultra high frequency and higher bands of operation. Embodiments provide an antenna with Faraday coils located within the arms operating in one or more of low frequency and, high frequency bands.

Abstract: An antenna for a Radio-Frequency IDentification (RFID) system is disclosed that comprises a pair of resonant cavities. The antenna is realized by folding the ends of a ribbon of conductive material, such as metal foil, over the middle part of the ribbon. The antenna generates a higher voltage than prior-art antennas used in RFID systems, and it makes possible RFID systems with an improved range. In an alternative embodiment, the antenna comprises a reflector that enables the RFID system to better tolerate the presence of nearby metal objects.

Abstract: A tag for a radio frequency Identification RFID system that comprises an open cavity with an integral load element. The load element is comprised of an impedance matching network and a load circuit. The load circuit contains one or more of an RFID transponder, microcontroller, capacitive sensor circuit, resistive sensor circuit, complex impedance sensor circuit, and an RF energy scavenging circuit in specific implementations. In various embodiments the tag includes reflector elements which enable the antenna structure to better tolerate the presence of nearby metal objects and provide electromagnetic gain.

Abstract: A system for monitoring parameters associated with a device, such as current, voltage, power, temperature, energy consumed, moisture, fluid levels and flow, wind speed, identification parameters, and repair history. The system includes the use of hybrid RFID sensor tags including a combination of active, semi-passive, and passive RFID circuits. Hybrid tags are attached to electrical system components. Standalone electrical components and generators and those connected to the electrical grid may be monitored. Data collected and stored in the hybrid tags may be accessed via a wireless communication link between hybrid tags and either active scanners or a passive interrogators. The data collected and processed from the hybrid tags may be provided to a user via the Internet or another wired or wireless communication network.

Abstract: A Radio-Frequency IDentification (RFID) receiver is disclosed that comprises a plurality of resonant structures arranged to form an antenna. The resonant structures are interconnected in series and are arranged, relative to one another, so as to achieve a received electrical signal with an increased voltage, when the antenna is exposed to an incident electromagnetic signal. This occurs for a majority of all possible incident electromagnetic signals and, therefore, an RFID receiver based on such an antenna provides, in a majority of cases, an improved performance.

Abstract: An RFID tag communicating with a wireless reader interrogator on more than one frequency band. In one embodiment the tag contains independent sensor circuits for a ultra high frequency UHF band and a lower frequency band. The UHF antenna element used in the tag is a double-resonant antenna typically operating in the 860-960 MHz frequency range providing both near and far field sensitivity. Separate resonant antenna structures a the lower frequency band is connected in series with the UHF antenna substructure. The high frequency HF antenna element contains a coil for magnetic induction pickup of signals typically in the 7-14 MHz frequency band but can also be used for the entire spectral range 100 KHz to 100 MHz. The tag antenna is an integrated structure providing for operation in both the UHF and a lower frequency band. In a separate embodiment the tag is configured with the UHF double-dipole antenna structure only and operates in a single UHF band.

Abstract: A system for monitoring parameters associated with a device, such as current, voltage, power, temperature, energy consumed, moisture, fluid levels and flow, wind speed, identification parameters, and repair history. The system includes the use of hybrid RFID sensor tags including a combination of active, semi-passive, and passive RFID circuits. Hybrid tags are attached to electrical system components. Standalone electrical components and generators and those connected to the electrical grid may be monitored. Data collected and stored in the hybrid tags may be accessed via a wireless communication link between hybrid tags and either active scanners or a passive interrogators. The data collected and processed from the hybrid tags may be provided to a user via the Internet or another wired or wireless communication network.

Abstract: A Radio-Frequency IDentification (RFID) receiver is disclosed that comprises a plurality of resonant structures arranged to form an antenna. The resonant structures are interconnected in series and are arranged, relative to one another, so as to achieve a received electrical signal with an increased voltage, when the antenna is exposed to an incident electromagnetic signal. This occurs for a majority of all possible incident electromagnetic signals and, therefore, an RFID receiver based on such an antenna provides, in a majority of cases, an improved performance.

Abstract: An antenna for a Radio-Frequency IDentification (RFID) system is disclosed that comprises a resonant structure, an RFID load element, and a floating coupling element. One of the two terminals of the RFID load element is connected directly to the resonant structure, and the other terminal is connected to the floating coupling element. The floating coupling element is electrically isolated from the resonant structure; its presence provides an improved impedance match to the RFID load element.

Abstract: An antenna for a Radio-Frequency IDentification (RFID) system is disclosed that comprises a pair of resonant cavities. The antenna is realized by folding the ends of a ribbon of conductive material, such as metal foil, over the middle part of the ribbon. The antenna generates a higher voltage than prior-art antennas used in RFID systems, and it makes possible RFID systems with an improved range. In an alternative embodiment, the antenna comprises a reflector that enables the RFID system to better tolerate the presence of nearby metal objects.

Abstract: A thermal sensor for low level radiation with built-in photo-thermal gain utilizing a thin film of pyro-optical material to modulate the reflectivity and/or transmission of a photonic carrier beam. The photonic carrier beam is modulated by the temperature of the pyro-optical film and detected by typically a silicon detector. A slight temperature increase of the pyro-optical film due to absorption of low level radiation increases the coefficient of absorption of the photonic carrier beam which in turn causes a further increase in temperature of the pyro-optical film. The photonic carrier beam provides power to increase the temperature of the pyro-optical film beyond the heating caused by the absorption of low level radiation alone. This thermal amplification effect provides a radiation sensor with photo-thermal gain.

Abstract: This invention consists of a radiation sensor with a thermal cycling and synchronous readout scheme. It is intended for use with pyro-optical materials which exhibit a phase transition that is hysteric. A preferred material is vanadium oxide which has a semiconductor-metal phase transition typically at 68 deg C. and a hysteresis of a few degrees C. depending on material processing. The temperature of the pyro-optical film is cycled in synchronization with readout electronics to achieve a reset reference for the readout once each repetitive cycle. When the thermal cycle is divided into two regions, a reference and a biased frame are obtained. The readout electronics compare the reference frame the biased frame to obtain a desired difference which is an unbiased frame.

Abstract: A thermal sensor for low level radiation with built-in photo-thermal gain utilizing a thin film of pyro-optical material to modulate the reflectivity and/or transmission of a photonic carrier beam. The photonic carrier beam is modulated by the temperature of the pyro-optical film and detected by typically a silicon detector. A slight temperature increase of the pyro-optical film due to absorption of low level radiation increases the coefficient of absorption of the photonic carrier beam which in turn causes a further increase in temperature of the pyro-optical film. The photonic carrier beam provides power to increase the temperature of the pyro-optical film beyond the heating caused by the absorption of low level radiation alone. This thermal amplification effect provides a radiation sensor with photo-thermal gain.

Abstract: A multilevel structures is formed with the cubic crystal material typically silicon. Structures with {111} sidewalls are formed for a desired etching depth on the surface of a (100) silicon wafer by a conventional masked anisotropic etching process using a specially designed etching mask. Then, the etching mask is removed except for some areas (including the frame area) and a maskless etching follows. In the downward etching of the upper and lower (100) planes during maskless etching, the {111] sidewalls will finally be replaced by {311} planes. The cutting edge apex angle is 25.24 degrees and is that angle determined by the intersection of the {100} and {311] planes.

Abstract: The method of the invention causes fracture of a semiconductor layer containing semiconductor devices from a support layer and requires no masking of the semiconductor device features during an implantation action. The method initially implants protons throughout an entirety of the semiconductor layer at an energy level that enables the protons to reach a depth that defines a delamination region. The implanting creating defects in the semiconductor devices and charge accumulation in dielectric portions (if any). Next a heat treating step causes a delamination of the semiconductor layer from the support layer that lies beneath the delamination region. Then the semiconductor layer is annealed at a temperature that exceeds a thermal stability temperature of the defects to cause a healing thereof.

Abstract: A surface micromachined microaccelerometer includes a substrate which has a surface plane, and a cantilever formed on the substrate with a fixed end and a free end, the fixed end being anchored to the substrate. The cantilever includes a mass fixed along the length of the cantilever. A cooperating device reads out the occurrence of an acceleration event when the free end of the cantilever has moved to a predetermined position. The cooperating device may be fixed or an opposing co-aligned cantilever structure. In a first embodiment, the cooperating device takes the form of a fixed structure having slots in which the tip of the cantilever is selectively retained. A further embodiment configures the cooperating device as an overlapping opposed cantilever. A further feature of the invention enables a reset function of a latched cantilever and comprises a pair of layers which when energized cause a cantilever to be suitably deflected so as to return from the latched state back to the unlatched state.

Abstract: A micromachined platform structure includes a substrate having a major surface and a platform positioned over the major surface. Plural support beams are tethered between the substrate and the platform, with each support beam including at least a first layer exhibiting a first thermal coefficient of expansion (TCE) and a second layer with a second TCE, the first TCE greater than the second TCE. The first layer is deposited on the second layer at a temperature that is higher than an ambient temperature at which the platform is to be used. Thus, at the ambient use temperature, the first layer is in a contraction/tension state relative to the second layer and causes a flexure of the support beams and an elevation of the platform away from the substrate's major surface.