Abstract: Pyrolysis methods for disassociating an organic mass, or coating from an article, by placing the article in an air tight processing chamber, circulating a gaseous mixture of ambient air and at least 40% water vapor from an opening, through the processing chamber and out of an exhaust port, and maintaining the processing chamber at a temperature above 650 degrees Fahrenheit for a sufficient time to disassociate the organic material. A batch oven and a continuous processing oven including entrance and exit air closures that utilize the pyrolysis methods are described.

Abstract: Environmental enhancement by controlling volatile organic compound (VOC) and NO.sub.x emissions in a flatline wafer drying system. The method is characterized by advancing the wafers of the type used in manufacture of oriented strand board (OSB) on a flatline conveyor embodying a plurality of dryer zones. Particularly, heating the dryer zones in successive lower temperatures in the range 500.degree. F. to 200.degree. F. by flowing heated air upwardly through the flatline wafer drying conveyor; removing VOC-rich exhaust air from a primary dryer zone while flowing heated air upwardly therein and removing VOC-rich exhaust air from a secondary dryer zone while flowing heated air from therein.