Abstract: The disclosure is directed to process and apparatus for the removal, site preparation, and replacement of any single connector pin contained within a sizeable array of closely spaced very small connector pins on an electronic packaging structure (substrate or module) without causing deleterious metallurgical effects either to the remaining pins or the ceramic substrate.

Abstract: A protective cover for a shackle lock is integrally made of a resilient material having an upper surface with a pair of spaced apertures defined by ring seals integrally molded to the top and surrounded by an accordian fold. Downwardly depending sidewalls fit over the body of a shackle lock and terminate with a peripheral bead adapted to sealably engage a bottom plug having a corresponding recess such that when the plug is fitted into the open bottom a tight seal is formed. In the preferred embodiment, a tether is coupled to the bottom and is detachably secured to one of the walls of the cover. The accordian fold surrounding the spaced apertures permits the apertures to align with shackle bars of a variety of lock sizes while the ring provides a tight seal against the shackle bar preventing entry of vapors, dirt, moisture, and the like.

Abstract: A cutting tool includes a shank with one end adapted to be secured to a rotary chuck. Spaced inwardly from an opposite end is a transversely extending radially offset aperture extending through the shank for receiving a cutting tool. A threaded aperture extends into the shank axially from the opposite end for receiving a set screw for securing the cutting tool within the offset aperture. A cup-shaped pilot bushing is provided and fits over the opposite end of the shank and includes means interengaging the cutting tool and an aperture aligned with the threaded aperture of the shank so that the bushing can be interlockably secured to the shank. In some embodiments, the leading edges of the shank and the pilot bushings are chamfered and knurled to define a ream for use of the cutting tool with out-of-round and/or undersized pilot holes. A cutting tool so formed can be employed as a universal drill for enlarging pilot holes within an infinitely adjustable range of sizes.

Abstract: A portable carrier for a semiconductor wafer is detachably connected to an air slide so that the wafer can be propelled from the carrier to the air slide and vice versa by air from the air slide. The carrier has a chamber with an air slide base on which the wafer is supported by air from the air slide when the wafer is to be propelled into or out of the chamber. The carrier has a single wafer port, which is sealed except when the carrier is connected to the air slide, through which the wafer enters or exits when propelled by air from the air slide. When the carrier chamber is sealed, the wafer is retained in position within the chamber by retaining means, which are rendered ineffective when the wafer is to be propelled into or out of the chamber.