Abstract: A laminated structure comprising a copper metal substrate adhered to a polyimide polymer by the use of first and second adhesive resin layers.

Abstract: The viscosity of epoxy resins and phenoxy resins having an average weight average molecular weight of from about 1,700 to about 100,000 and containing an average of at least about 4.5 aliphatic hydroxyl groups per molecule is reduced by reacting said epoxy or phenoxy resin with a trihalomethyl acyl aromatic compound such as trichloroacetophenone in the presence of a tertiary amine such as triethylamine. These modified resins have particular utility in the preparation of coatings, adhesives, laminates, flooring and the like.

Abstract: Water-compatible compositions are described which consist essentially of at least one resinous compound whose backbone is linear or substantially linear and consists essentially of at least one oxyaryleneoxyalkylene or oxyaryleneoxy(1,3-(2-hydroxy)alkylene) unit and which bears at least two functional organic moieties through which cross-linking can occur (preferably groups having active hydrogen, more preferably aliphatic hydroxyl groups) and at least one terminal carbamoylpyridinium group covalently bonded through the ring nitrogen atom combined with an acid curable cross-linking agent. The compositions are useful coating compositions which find particular utility in cathodic electrodeposition. The compounds are prepared, for example, by reacting a linear or substantially linear epoxy resin with a carbamoylpyridine in the presence of sufficient amount of a Bronsted acid and water to stabilize the carbamoylpyridinium salt thus formed.

Abstract: A process for the preparation of phenolic hydroxy ethers whereby an aromatic hydroxyl-containing compound is reacted with a vicinal epoxy-containing compound in the presence of a phosphonium salt of an acid, ester or acid ester of an element selected from carbon or phosphorus, and to precatalyzed epoxy resin compositions comprising an epoxy resin and a catalyst as defined above.