Abstract: A coated glazing includes a transparent glass substrate and a coating located on the glass substrate. The coating includes at least the following layers in sequence starting from the glass substrate: a first layer having a refractive index of more than 1.6, an optional second layer having a refractive index that is less than the refractive index of the first layer, a third layer based on tin dioxide doped with fluorine, and a fourth layer based on titanium oxide, wherein the fourth layer is photocatalytic.

Abstract: A coated glazing includes a transparent glass substrate and a coating located on the glass substrate. The coating is provided with at least the following layers in sequence starting from the glass substrate: a first layer having a refractive index of more than 1.6, an optional second layer having a refractive index that is less than the refractive index of the first layer, a third layer based on tin dioxide, a fourth layer based on an oxide of silicon, and a fifth layer based on titanium dioxide, wherein the fifth layer is photocatalytic.

Abstract: A coated glazing includes a transparent glass substrate, and a coating located on the glass substrate. The coating is provided with at least the following layers in sequence starting from the glass substrate: a first layer having a refractive index of more than 1.6, an optional second layer having a refractive index that is less than the refractive index of the first layer, a third layer based on tin dioxide doped with antimony, niobium and/or neodymium, and a fourth layer based on titanium dioxide, wherein the fourth layer is photocatalytic.

Abstract: The present invention relates to a toughenable coated float glass substrate, a method of preparing same and the use thereof, said float glass substrate comprising a first surface and a second surface, wherein the first surface comprises one or more layers applied by chemical vapour deposition (CVD) and the second surface comprises one or more layers applied by physical vapour deposition (PVD); and wherein said one or more layers applied by physical vapour deposition (PVD) includes at least one functional metal layer; and wherein the second surface further comprises a protective layer applied in direct contact with the second surface; and wherein the coated float glass substrate exhibits a transmission b* colour value according to the CIE colour space of less than or equal to 3 and an external reflection b* of less than or equal to ?5.

Abstract: A coated glass pane comprising at least the following layers: a glass substrate and at least one absorbing layer based on at least one metal silicide and/or metal silicide nitride wherein the at least one absorbing layer is embedded between and contacts two layers based on an (oxi)nitride of Si and/or an (oxi)nitride of Al and/or alloys thereof.

Abstract: A coated glass pane comprising at least the following layers: a glass substrate and at least one absorbing layer based on at least one metal silicide and/or metal silicide nitride wherein the at least one absorbing layer is embedded between and contacts two layers based on an (oxi)nitride of Si and/or an (oxi)nitride of Al and/or alloys thereof.

Abstract: A coated glass pane comprising at least the following layers: a glass substrate; and at least one absorbing layer based on at least one metal silicide and/or metal silicide nitride wherein the at least one absorbing layer is embedded between and contacts two layers based on an (oxi) nitride of Si and/or an (oxi) nitride of Al and/or alloys thereof.

Abstract: A coated glass pane comprising at least the following layers: a glass substrate; and at least one absorbing layer based on at least one metal silicide and/or metal silicide nitride wherein the at least one absorbing layer is embedded between and contacts two layers based on an (oxi) nitride of Si and/or an (oxi) nitride of Al and/or alloys thereof.

Abstract: Methods and devices in accordance with the present invention can comprise forming an electrical feed-through assembly to provide a hermetic seal in a coaxial connector. In one embodiment, the electrical feed-through assembly comprises a conductive insert having a bore, a dielectric insert positioned within the bore having a first diameter sized such that an impedance of the dielectric insert is a target impedance, the dielectric insert having a center conductive pin extending there-through, and an air dielectric positioned within the bore, the air dielectric having a second diameter sized such that an impedance of the air dielectric is the target impedance, a portion of the air dielectric extending into the dielectric insert, wherein the portion of the air dielectric extending into the dielectric insert is a compensation gap.

Abstract: Methods and devices in accordance with the present invention can comprise forming an electrical feed-through assembly to provide a hermetic seal in a coaxial connector. In one embodiment, the electrical feed-through assembly comprises a conductive insert having a bore, a dielectric insert positioned within the bore having a first diameter sized such that an impedance of the dielectric insert is a target impedance, the dielectric insert having a center conductive pin extending there-through, and an air dielectric positioned within the bore, the air dielectric having a second diameter sized such that an impedance of the air dielectric is the target impedance, a portion of the air dielectric extending into the dielectric insert, wherein the portion of the air dielectric extending into the dielectric insert is a compensation gap.

Abstract: Systems in accordance with embodiments of the present invention can include an adapter having a sliding portion (a slider) slidable to expose an interface, thereby allowing mating—for example, between a test port and a DUT—to be observed and adjusted as required. The slider is removable, allowing an adapter sex change. In one embodiment, an insertion tool is provided which can hold a dual male pin and allow installation and removal of the dual male pin while assisting mating alignment. After calibration, the slider can be locked in place and the adapter can function as a standard coaxial connector.

Abstract: The present invention incorporates a hermetic glass bead 206 and a grounding lip 208 into an outer conductor insert 216 to form a microwave coax connector 201. The glass bead 206 forms both the hermetic seal and the support for the coax center conductor pin 214. The outer conductor insert 216 of the coax connector 201 includes the ground lip 208 to provide a short ground path for the connection to a microstrip substrate 10 provided on a carrier 12 in a housing 2. The coax connector 201 is soldered into a cavity 235 in the housing 2 to assure a short ground path between the coax connector 201 and the carrier 12. There is no need for soldering a separate glass bead into the housing 2, which at these high frequencies, is very difficult due to the small size of the glass bead.

Abstract: A dot termination comprising a disk of thin film resistive material connects a transmission line on a substrate to a DC ground plane in a manner to provide broadband high frequency performance. The dot termination connects to DC ground connections spaced about the perimeter of the disk. Each DC connector includes a ground via passing through the substrate to the ground plane. A metal trace is used for each DC connection, the trace connecting a respective via with the perimeter of the disk. Each metal trace can include a resistive portion connected to the dot region and a metal trace portion connecting the trace to the via. A resistive extension tongue of the disk connects the disk to a transmission line trace.

Abstract: A dot termination composed of a circular thin film resistive material connects a transmission line to a DC ground plane in a manner to provide a broadband high frequency performance. The termination uses resistive traces provided around the perimeter of the dot with vias connecting the traces to ground to provide multiple DC paths to ground. The use of these multiple DC paths enhances the high frequency performance of the dot termination, and maintains a desired impedance. The dot termination can be used in a shunt configuration with an optical modulator to provide broadband voltage biasing for the optical modulator. To maximize the biasing voltage, a DC blocking capacitor is placed between the dot termination and ground. Biasing current can be applied between the dot termination and the blocking capacitor to maximize performance.

Abstract: The present invention incorporates a hermetic glass bead 206 and a grounding lip 208 into an outer conductor insert 216 to form a microwave coax connector 201. The glass bead 206 forms both the hermetic seal and the support for the coax center conductor pin 214. The outer conductor insert 216 of the coax connector 201 includes the ground lip 208 to provide a short ground path for the connection to a microstrip substrate 10 provided on a carrier 12 in a housing 2. The coax connector 201 is soldered into a cavity 235 in the housing 2 to assure a short ground path between the coax connector 201 and the carrier 12. There is no need for soldering a separate glass bead into the housing 2, which at these high frequencies, is very difficult due to the small size of the glass bead.

Abstract: A microwave coaxial connector having both inner and outer axial resilient conductors is provided. The connector may be used for connecting a microwave device to a coaxial cable without causing damage to the microwave device housing or degrading a transmitted microwave signal. The inner axial resilient conductor includes an inner cylindrical conducting member having an inner bore formed by a plurality of fingers. A cylindrical contact member includes a first end for inserting into the inner bore. The outer axially resilient conductor includes an outer cylindrical conducting member circumjacent about the inner conductor forming a ring-shaped opening. An outer contact member having a plurality of fingers is inserted in the ring-shaped opening to provide an outer resilient conductor. A connector for connecting adjacent devices is also provided. This connector includes a pair of inner and outer resilient conductors positioned at opposite ends of the connector.

Abstract: A device for measuring and/or injecting a high frequency signal, such as a 20 GHz signal from and/or into a system, is provided. The device includes a connector coupled to a coaxial cable at one end. A relatively small, low inductive rectangular member is coupled to the connector at the other end. A conductive element is coupled to the rectangular member and is used for measuring and infecting the high frequency signal from and/or into a microwave transmission line positioned on a substrate. First and second rigid prongs are coupled to the rectangular member and are inserted into respective ground openings on the substrate. A network analyzer may be coupled to the cable for analyzing and generating the high frequency signal.

Abstract: A ground path for microwave circuits positioned on carriers is provided. A ground path is provided between a first and second carrier coupled to respective microwave circuit substrates. The first and second carriers are coupled to a base, forming an opening between the first and second carriers. A conductive element is coupled to a first microstrip transmission line on the first substrate and a second microstrip transmission line on the second substrate. A conductive spring is then positioned in the opening in order to create a ground path. The microstrip transmission line may consist of alumina or a high-frequency plastic, such as Teflon or Duroid.RTM.. The conductive spring may consist of beryllium copper. A conductive rubber material may also be positioned in the opening, contacting the conductive spring and the base.

Abstract: A power sensor that enables determination of the frequency of a microwave signal comprises a signal input that receives the microwave signal at a particular frequency, at least one sensor that produces a first and second output corresponding to the power of the microwave signal, and a means for coupling the signal input to the sensor so that the coupling means distinguishes the first output from the second output in order that the ratio of these outputs produces a unique value at the particular frequency.