Abstract: An imaging assembly for an intraluminal imaging device is provided. In one embodiment, the imaging assembly includes an imaging array positioned at a distal portion of the intraluminal imaging device. The imaging array may have a plurality of imaging elements arranged into subarrays. The imaging assembly also may include a micro-beam-former integrated circuit (IC) coupled to the imaging array at the distal portion of the intraluminal imaging device. The micro-beam-former IC includes a plurality of microchannels that may separately beam-form signals received from imaging elements of at least two subarrays. The imaging assembly further includes two or more signal lines that may couple to the micro beam-former IC. Each signal line may correspond to a specific subarray and may receive the beam-formed signals specific to corresponding subarray.

Abstract: An imaging assembly for an intraluminal imaging device is provided. In one embodiment, the imaging assembly includes an imaging array positioned at a distal portion of the intraluminal imaging device. The imaging array may have a plurality of imaging elements arranged into subarrays. The imaging assembly also may include a micro-beam-former integrated circuit (IC) coupled to the imaging array at the distal portion of the intraluminal imaging device. The micro-beam-former IC includes a plurality of microchannels that may separately beam-form signals received from imaging elements of at least two subarrays. The imaging assembly further includes two or more signal lines that may couple to the micro beam-former IC. Each signal line may correspond to a specific subarray and may receive the beam-formed signals specific to corresponding subarray.

Abstract: An imaging assembly for an intraluminal imaging device is provided. In one embodiment, the imaging assembly includes an imaging array positioned at a distal portion of the intraluminal imaging device. The imaging array may have a plurality of imaging elements arranged into subarrays. The imaging assembly also may include a micro-beam-former integrated circuit (IC) coupled to the imaging array at the distal portion of the intraluminal imaging device. The micro-beam-former IC includes a plurality of microchannels that may separately beam-form signals received from imaging elements of at least two subarrays. The imaging assembly further includes two or more signal lines that may couple to the micro beam-former IC. Each signal line may correspond to a specific subarray and may receive the beam-formed signals specific to corresponding subarray.

Abstract: An imaging assembly for an intraluminal imaging device is provided. In one embodiment, the imaging assembly includes an imaging array positioned at a distal portion of the intraluminal imaging device. The imaging array may have a plurality of imaging elements arranged into subarrays. The imaging assembly also may include a micro-beam-former integrated circuit (IC) coupled to the imaging array at the distal portion of the intraluminal imaging device. The micro-beam-former IC includes a plurality of microchannels that may separately beam-form signals received from imaging elements of at least two subarrays. The imaging assembly further includes two or more signal lines that may couple to the micro beam-former IC. Each signal line may correspond to a specific subarray and may receive the beam-formed signals specific to corresponding subarray.

Abstract: An acoustic probe includes a plurality of acoustic array components separated and spaced apart from each other. Each of the acoustic array components includes: an array of acoustic element circuits disposed contiguous to each other at a first pitch; a plurality of pads each corresponding to one of the acoustic element circuits and formed within a circuitry area of the corresponding acoustic element circuit, the pads being disposed at a second pitch; a plurality of interconnection bumps each corresponding to one of the pads and being disposed in electrical connection with the corresponding pad, wherein the interconnection bumps are disposed at a third pitch; and a plurality of acoustic transducer elements on the interconnection bumps. The acoustic transducer elements are disposed at a fourth pitch. At least two of the first, second, third, and fourth pitches are different than each other.

Abstract: An acoustic probe includes a plurality of acoustic array components separated and spaced apart from each other. Each of the acoustic array components includes: an array of acoustic element circuits disposed contiguous to each other at a first pitch; a plurality of pads each corresponding to one of the acoustic element circuits and formed within a circuitry area of the corresponding acoustic element circuit, the pads being disposed at a second pitch; a plurality of interconnection bumps each corresponding to one of the pads and being disposed in electrical connection with the corresponding pad, wherein the interconnection bumps are disposed at a third pitch; and a plurality of acoustic transducer elements on the interconnection bumps. The acoustic transducer elements are disposed at a fourth pitch. At least two of the first, second, third, and fourth pitches are different than each other.

Abstract: An integrated circuit (IC) apparatus includes a substrate having opposed first and second major sides and one or more edges defining an outer periphery of the substrate. The substrate may be a semiconductor material. The IC apparatus may further include one or more transducers situated on the first major side of the substrate; and an attenuation pattern formed in at least one of the second major side and one or more of the edges of the substrate.

Abstract: A third matching layer (140) affording wide bandwidth for an ultrasound matrix probe is made of polyethylene, and may extend downwardly to surround the array (S360) and attach to the housing to seal the array (S370).

Abstract: An ultrasound transducer comprises a piezoelectric element (175), a first and second matching layers (120,130), and a third matching layer (140) comprising low-density polyethylene (LPDE). The third matching layer (140) affording wide bandwidth for an ultrasound matrix probe may extend downwardly to surround the array (S360) and attach to the housing to seal the array (S370).

Abstract: Ultrasonic transducer including a multi-layer transformer arranged between a backing block and piezoelectric layer on each of which at least one matching layer is arranged. The transformer includes a substrate having an electronic circuit, one or more acoustically active layers and an interconnect layer interposed between the piezoelectric layer and the substrate. The properties of the substrate, each acoustically active layer and the interconnect layer are selected and then the acoustic impedance of the transformer at a side of the piezoelectric layer adjacent the transformer is determined. The properties are then varied, e.g., using a computer simulation, until values for these properties are obtained which provide a desired acoustic performance characteristic at the side of the piezoelectric layer adjacent the transformer. The electronic circuit is thus considered in the determination of the acoustic impedance of the transformer.

Abstract: Ultrasonic transducer including a multi-layer transformer arranged between a backing block and piezoelectric layer on each of which at least one matching layer is arranged. The transformer includes a substrate having an electronic circuit, one or more acoustically active layers and an interconnect layer interposed between the piezoelectric layer and the substrate. The properties of the substrate, each acoustically active layer and the interconnect layer are selected and then the acoustic impedance of the transformer at a side of the piezoelectric layer adjacent the transformer is determined. The properties are then varied, e.g., using a computer simulation, until values for these properties are obtained which provide a desired acoustic performance characteristic at the side of the piezoelectric layer adjacent the transformer. The electronic circuit is thus considered in the determination of the acoustic impedance of the transformer.

Abstract: Acoustic imaging systems are provided. A preferred system includes a protective cover configured to mate with a transducer body. The transducer includes a two-dimensional transducer element matrix array formed by a plurality of individually controllable transducer elements. The protective cover is superposed above the two-dimensional matrix array and is transparent to incident acoustic energy. Preferably, the protective cover is shaped to reduce patient discomfort and repetitive motion injuries to sonographers. Alternative embodiments comprise a shaped two-dimensional transducer element matrix array. Methods for improved ultrasound imaging are also provided.