Abstract: The present invention provides a compliant mechanism that can be used to make a variety of devices, such as tunable optical devices, that are more reliable, more cost effective, and/or exhibit better performance than prior art devices. In one embodiment, the complaint mechanism includes an island that is suspended from a frame using a compliant member that is attached to the frame and the island. Individual actuators and/or sensor elements may be placed on the island, so that each island may be individually actuated or sensed.

Abstract: The present invention provides method of making mechanisms in which the relative locations of elements are maintained during manufacturing. The methods according to the present invention can be used to make a variety of devices, including tunable optical devices. The methods include displaceably attaching an island (support) to a frame with a non-rigid material.

Abstract: The present invention provides a compliant mechanism that can be used to make a variety of devices, such as tunable optical devices that are more reliable, more cost effective and/or exhibit better performance than prior art devices.

Abstract: The present invention provides a compliant mechanism that can be used to make a variety of devices, such as tunable optical devices that are more reliable, more cost effective and/or exhibit better performance than prior art devices.

Abstract: The present invention provides method of making mechanisms in which the relative locations of elements are maintained during manufacturing. The methods according to the present invention can be used to make a variety of devices, including tunable optical devices. The methods include displaceably attaching an island (support) to a frame with a non-rigid material.

Abstract: The present invention provides a compliant mechanism that can be used to make a variety of devices, such as tunable optical devices that are more reliable, more cost effective and/or exhibit better performance than prior art devices.

Abstract: A microelectromechanical (MEM) capacitance pressure sensor integrated with electronic circuitry on a common substrate and a method for forming such a device are disclosed. The MEM capacitance pressure sensor includes a capacitance pressure sensor formed at least partially in a cavity etched below the surface of a silicon substrate and adjacent circuitry (CMOS, BiCMOS, or bipolar circuitry) formed on the substrate. By forming the capacitance pressure sensor in the cavity, the substrate can be planarized (e.g. by chemical-mechanical polishing) so that a standard set of integrated circuit processing steps can be used to form the electronic circuitry (e.g. using an aluminum or aluminum-alloy interconnect metallization).