Patents by Inventor William P. Hanlon

William P. Hanlon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micrograin adhesive method and a joint produced by it
    Patent number: 6395207
    Abstract: A method of forming a joint comprises the steps of: (a) at least filling a container with granular particles, the granular particles having a size of 0.25 mm to 1 mm; (b) inserting a component part into the container; and (c) at least partially filling the container containing this component part and the granular particles with a flowable, curable liquid, this liquid having curing time of less than 90 seconds. According to one embodiment of the present invention, the curable liquid has a gap fill of less than 0.25 mm and the curing time is less than about 5 seconds or less.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: May 28, 2002
    Assignee: Eastman Kodak Company
    Inventor: William P. Hanlon
  • MICROGRAIN ADHESIVE METHOD AND A JOINT PRODUCED BY IT
    Publication number: 20020015615
    Abstract: A method of forming a joint comprises the steps of: (a) at least filling a container with granular particles, the granular particles having a size of 0.25 mm to 1 mm; (b) inserting a component part into the container; and (c) at least partially filling the container containing this component part and the granular particles with a flowable, curable liquid, this liquid having curing time of less than 90 seconds. According to one embodiment of the present invention, the curable liquid has a gap fill of less than 0.25 mm and the curing time is less than about 5 seconds or less.
    Type: Application
    Filed: May 24, 1999
    Publication date: February 7, 2002
    Inventor: WILLIAM P. HANLON