Abstract: The method of assembling an antenna and over-molding the same with a thermoplastic material is described which ensures that the elongated rod of the antenna is centrally positioned in its molding material and ensures that the helical spring of the antenna is also centrally positioned in the molding material. A sub-assembly is first created by connecting a helical spring to one end of an elongated metal rod and then inserting a threaded location mandrel in the spring. The assembled sub-assembly is then placed in an injection molding tool and is over-molded with a thermoplastic material. During the initial molding process, the metal rod and helical spring are centered in their respective cavities. The molded sub-assembly is then removed from the injection tool and placed in a second injection tool wherein the interior of the helical spring is filled with a thermoplastic material at the same time as an end cap is created. At the same time, the exposed end of the metal rod is also over-molded.

Abstract: An assembly is provided for uniformly applying pressure to a selected portion of a circuit board mounted between spaced surfaces. The assembly includes a retainer for selectively applying pressure to a proximal surface of the circuit board and a stiff U-shaped bar having a channel in which the retainer is mounted, the bar thus being interposed between the retainer and the circuit board. Preferably, the retainer includes at least one member that is attached to the bar by a snap-in fit. When the retainer is actuated, the bar is pressed against the circuit board, thereby causing the opposite surface of the circuit board to uniformly press against a housing slot wall. A side wall of the bar preferably contacts a wall of a slot in which the assembly is mounted to enhance heat transfer.