Abstract: The present disclosure includes apparatus, system, and method embodiments that provide micro electro mechanical system optical switching and methods of manufacturing switches. For example, one optical switch embodiment includes at least one micro electro mechanical system type pivot mirror structure disposed along a path of an optical signal, the structure having a mirror and an actuator, and the mirror having a pivot axis along a first edge and having a second edge rotatable with respect to the pivot axis, the mirror being capable of and arranged to be actuated to pivot between a position parallel to a plane of an optical signal and a position substantially normal to the plane of the optical signal.

Abstract: One apparatus embodiment includes an optical emitter and a photodetector. At least a portion of the optical emitter extends a radial distance from a center point. The photodetector provided around at least a portion of the optical emitter and positioned outside the radial distance of the portion of the optical emitter.

Abstract: A flexible high density interconnect structure is provided by extending the high density interconnect structure beyond the solid substrate containing the chips interconnected thereby. During fabrication, the flexible portion of the high density interconnect structure is supported by a temporary interconnect support to facilitate fabrication of the structure in accordance with existing fabrication techniques. Subsequently, that temporary support structure may be removed or may remain in place if it sufficiently flexible to impart the desired degree of flexibility to that portion of the high density interconnect structure. Methods of fabrication are also disclosed.

Abstract: The electrical operating characteristics of a microwave circuit are modified by providing a dielectric layer on the circuit in a pattern which modifies the electrical characteristics of an overlay responsive portion of the circuit in a manner which results in the overall circuit having a desired electrical operating characteristic within a tolerance. Adjustment of the operating characteristics may be done in an iterative manner of measuring the characteristics, modifying the distribution of dielectric material and remeasuring the operating characteristics until satisfactory operating characteristics are obtained.

Abstract: An eddy current probe array is disclosed comprising a plurality of spatially correlated eddy current probe elements sufficiently disposed within a flexible interconnecting structure to collect a discrete plurality of spatially correlated eddy current measurements for nondestructive near surface flaw detection. A plurality of precisely fabricated, substantially identical elements being sufficiently distributed can accommodate inspecting an area of conductor covered by the active width of the array in a single uni-directional scan. The array structure can flexibly conform to accommodate inspection of large, irregular, curved conductive surfaces which cannot be inspected by conventional means.

Abstract: A body is hermetically sealed by electroplating a hermetic layer over the exterior surface of the body. A hermetic high density interconnect structure is provided by forming a continuous metal layer over the outermost dielectric layer of the multilayer interconnect structure and by disposing that continuous metal layer in a hermetically sealing relation to the substrate of the high density interconnect structure. A variety of techniques may be used for providing electrical feedthroughs between the interior and exterior of the hermetic enclosure as may a pseudo-hermetic enclosure in those situations where true hermeticity is not required.

Abstract: Active components of a microwave system are interconnected on a substrate by a dielectric-overlay, high-density-interconnect structure in a manner which provides close impedance matching, minimizes impedance discontinuities and substantially increases the yield of good circuits.

Abstract: A test fixture for testing microwave components enables components to be tested with high correlation between the component's test results and its operation in a system. The test fixture provides for non-destructive mounting of and connection of the component to the test fixture in the same manner as it will be connected in the final system and also provides for tailoring of the test connections as may be desired.

Abstract: A multimodule microwave system is assembled in a physically compact, high reliability manner employing a high density interconnect structure to interconnect the different modules of a microwave system by rendering the portion of the interconnect structure between modules flexible and by folding the interconnect structure on appropriate sized mandrels between the modules to place the modules in a multi-tier physical stack. Shielding and hermetic packaging may also be provided.

Abstract: A high density interconnect structure is rendered suitable for the packaging of overlay sensitive chips by providing a cavity in the high density interconnect structure which spaces the sensitive surface of such chips from the overlying high density interconnect structure in a manner which prevents undesired interactions between the dielectric of the high density interconnect structure and the chip.

Abstract: An eddy current device for inspecting a component includes an eddy current array circuit having respective pluralities of drive and sense elements and having an active face for positioning on a surface of the component during the inspection operation. A backing is disposed on a face of the eddy current array circuit opposite to the active face for concentrating an electromagnetic flux from the eddy current array circuit into the component when each of the plurality of drive elements is being energized. A mechanical arrangement is provided for supporting and deploying the backing and the array circuit to substantially conform with the surface portion under inspection and to cause each of the pluralities of drive and sense elements to be maintained at their respective substantially constant distances from the inspection surface during scanning, preferably at a controlled rate of scan.

Abstract: A hermetic package particularly adapted for high density interconnect (HDI) electronic systems employs a ceramic substrate which serves as a base for the hermetic package. The substrate comprises a cofired body including buried conductors which provide electrical continuity between a set of inner contact points and a set of outer contact points bridging a seal ring that comprises either a solder seal or a weldable seal for the hermetic package lid. The outer contact points may be directly connected to a leadframe. The leadframe leads, after severing, can be directly attached to a printed circuit board.

Abstract: An apparatus for near surface, nondestructive eddy current scanning of a conductive part using a multi-layer eddy current probe array. Such structures of this type, generally, employ an ultra-thin, flexible, film-like, multi-layer eddy current probe array which is adapted to provide routine inspection of conductive parts while also providing improved signal integrity, signal transmission and isolation.

Abstract: A control system for regulating electrical power input to the resistive heating elements of an electric heating apparatus, including domestic cooking appliances, is provided which employs at least one piezoceramic relay device. The electrical power is applied with the piezoceramic relay device responsive to control signals and with the control circuitry being directly and ohmically connected to the power source. In one embodiment, the control system employs individual piezoceramic relay devices for power regulation to the individual heating elements while in different embodiments a single piezoceramic relay device regulates power input to a pair of the heating elements. A method of operating the controlled apparatus in such manner and an apparatus having such control system are also disclosed.

Abstract: Microwave components are prepackaged and pretested to provide standard microwave components or subsystems. A dielectric overlay interconnection structure enables accurate testing and rework of out of specification packages. Microwave systems are formed of a plurality of such prepackaged components with a high yield.

Abstract: In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is bonded to the chips and has interconnecting conductors disposed thereon and extending through via holes therein into ohmic contact with appropriate contact pads of the chips. Inclusion of a flexible portion in the high density interconnect structure enables the readout and the focal plane array chips to be disposed in different planes to provide a compact structure. Focal plane array sensor hybrid testing and repair are both facilitated by this structure.

Abstract: In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is bonded to the chips and has interconnecting conductors disposed thereon and extending through via holes therein into ohmic contact with appropriate contact pads of the chips. Inclusion of a flexible portion in the high density interconnect structure enables the readout and the focal plane array chips to be disposed in different planes to provide a compact structure. Focal plane array sensor hybrid testing and repair are both facilitated by this structure.

Abstract: This application describes a number of novel advanced piezoelectric ceramic power switching devices which are mounted within protective gastight enclosures that are either evacuated to a high degree of vacuum or filled with an inert gas protective atmosphere. The devices thus constructed are capable of operating over a range of load voltages extending from about 100 volts to 5000 volts or more with corresponding currents of from a few amperes to hundreds of amperes and wherein it is possible to provide a number of such structures in a single common protective gastight enclosure. For certain circuit applications the devices thus constructed have unpoled portions on which are mounted either passive circuit components such as resistors, capacitors and the like or active semiconductor devices all interconnected in circuit relationship with each other and the switching devices by using printed circuit or integrated circuit fabrication techniques.

Abstract: Improved piezoelectric ceramic switching devices are described along with their .[.method.]. .Iadd.methods .Iaddend.of fabrication. In addition to the devices themselves, novel electric circuits are described for the energization as well as the use of such devices as switching elements in electrical systems. Parts of both the energization circuits and/or utilization circuits employing the piezo ceramic switching device are physically mounted on and supported by non-polarized parts of the piezoelectric ceramic plate elements comprising the switching devices so that lightweight compact construction is achieved along with substantial reduction of stray inductance intercoupling.

Abstract: Improved piezoelectric ceramic switching devices are described along with their .[.method.]. .Iadd.methods .Iaddend.of fabrication. In addition to the devices themselves, novel electric circuits are described for the energization as well as the use of such devices as switching elements in electrical systems. Parts of both the energization circuits and/or utilization circuits employing the piezo ceramic switching device are physically mounted on and supported by non-polarized parts of the piezoelectric ceramic plate elements comprising the switching devices so that lightweight compact construction is achieved along with substantial reduction of stray inductance intercoupling.