Abstract: A tool and technique are employed to distill and prioritize multiple organizational (sub-system) capabilities based on ranked customer requirements or desires. A translational matrix is employed to organize preferences of the sub-system with respect to the customer requirements or desires. Relative importance scores are input into the matrix to reflect prioritized input versus prioritized capabilities. An adjusted relative importance score of the sub-system is automatically calculated and a resultant re-prioritization of sub-system attributes is created for application to new designs, services, or processes.

Abstract: A tool and technique are employed to distill and prioritize multiple organizational (sub-system) capabilities based on ranked customer requirements or desires. A translational matrix is employed to organize preferences of the sub-system with respect to the customer requirements or desires. Relative importance scores are input into the matrix to reflect prioritized input versus prioritized capabilities. An adjusted relative importance score of the sub-system is automatically calculated and a resultant re-prioritization of sub-system attributes is created for application to new designs, services, or processes.

Abstract: A redundant path power subsystem comprises a plurality of phase regulators in a multi-phase power converter. The plurality of phase regulators comprises at least N+2 phase regulators. N phases are sufficient to serve an electrical load coupled with the redundant path power subsystem. The redundant path power subsystem also comprises a plurality of power supplies, and a plurality of input and control paths between the plurality of power supplies and the plurality of phase regulators. The plurality of input and control paths comprises a plurality of multiplexing logic devices and a plurality of phase controllers. The plurality of phase controllers is operable to control the plurality of phase regulators. The plurality of multiplexing logic devices is operable to multiplex control signals from the plurality of power supplies and a microprocessor for the plurality of phase controllers.

Abstract: An enhanced computer assembly and related method is provided that enables easy shipment and installation of such computing systems. In one embodiment a split top hat design is provided that can be removed. The removable split hat comprises a receiving member and an inner member that are secured to the frame in a manner that can be easily removed. In an alternate embodiment, a collapsible top hat is provided which adjusts the height of the assembly from a first to a second position. The collapsible feature has an upper portion that is connected to a plurality of pivoted side members that are capable of collapsing onto themselves.

Abstract: A system and method for providing power is disclosed. A variable direct current (DC) power source provides a variable DC voltage. A configurator dynamically converts the variable DC voltage to a selected DC voltage to provide the power. A set of switches combines the solar voltage with a substantially constant DC voltage. A control unit controls the set of switches and the configurator to provide the combined voltages at a selected voltage level.

Abstract: A system and method for providing power is disclosed. A variable direct current (DC) power source provides a variable DC voltage. A configurator dynamically converts the variable DC voltage to a selected DC voltage to provide the power. A set of switches combines the solar voltage with a substantially constant DC voltage. A control unit controls the set of switches and the configurator to provide the combined voltages at a selected voltage level.

Abstract: A redundant path power subsystem comprises a plurality of phase regulators in a multi-phase power converter. The plurality of phase regulators comprises at least N+2 phase regulators. N phases are sufficient to serve an electrical load coupled with the redundant path power subsystem. The redundant path power subsystem also comprises a plurality of power supplies, and a plurality of input and control paths between the plurality of power supplies and the plurality of phase regulators. The plurality of input and control paths comprises a plurality of multiplexing logic devices and a plurality of phase controllers. The plurality of phase controllers is operable to control the plurality of phase regulators. The plurality of multiplexing logic devices is operable to multiplex control signals from the plurality of power supplies and a microprocessor for the plurality of phase controllers.

Abstract: A redundant path power subsystem comprises a plurality of phase regulators in a multi-phase power converter. The plurality of phase regulators comprises at least N+2 phase regulators. N phases are sufficient to serve an electrical load coupled with the redundant path power subsystem. The redundant path power subsystem also comprises a plurality of power supplies, and a plurality of input and control paths between the plurality of power supplies and the plurality of phase regulators. The plurality of input and control paths comprises a plurality of multiplexing logic devices and a plurality of phase controllers. The plurality of phase controllers is operable to control the plurality of phase regulators. The plurality of multiplexing logic devices is operable to multiplex control signals from the plurality of power supplies and a microprocessor for the plurality of phase controllers.

Abstract: An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is coupled to the coolant loop downstream of the electronic component(s) to cool, in primary, liquid-cooling mode, air passing through the system. In primary, liquid-cooling mode, the cooling unit provides cooled system coolant to cool the electronic component(s), and provides system coolant to the air-to-liquid heat exchanger to cool at least a portion of air passing through the electronic system, and in a secondary, air-cooling mode, system coolant flows from cooling the electronic component(s) to the air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the electronic component(s) to air passing across the air-to-liquid heat exchanger.

Abstract: An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is coupled to the coolant loop downstream of the electronic component(s) to cool, in primary, liquid-cooling mode, air passing through the system. In primary, liquid-cooling mode, the cooling unit provides cooled system coolant to cool the electronic component(s), and provides system coolant to the air-to-liquid heat exchanger to cool at least a portion of air passing through the electronic system, and in a secondary, air-cooling mode, system coolant flows from cooling the electronic component(s) to the air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the electronic component(s) to air passing across the air-to-liquid heat exchanger.

Abstract: Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.

Abstract: A data processing system and method providing a jumper which provides standby power from a redundant power supply to one of at least two critical functions in a frame having bays for holding at least two nodes. The redundant power supply supplying power to one of the nodes in the frame and one of the critical functions. A jumper is slidably engageable in the frame in place of one of the nodes. The jumper, when engaged in the frame, transfers power from the redundant power supply to the other of the critical functions. The jumper is included in a jumper book of an airblock which includes passive airblock books. Mechanical keys on the passive airblock books prevent the removal of the jumper book until after the passive airblock books are removed.

Abstract: A technique for controlling a system is provided in which a control-data table is employed for facilitating operation of the system, and an inject-fault-data table is selectively used during testing of the system. Pursuant to the technique, a security mechanism is provided to restrict the system's utilization of the inject-fault-data table. A security check by the security mechanism is to be satisfied for the system to access the inject-fault-data table. In an enhanced embodiment, the system is tested by substituting an inject-fault-data entry of the inject-fault-data table for a control-data entry of the control-data table as an input to the system. The testing verifies the response of the system to an emulated fault, which results from employing at least one inject-fault-data entry during testing of the system.

Abstract: An enhanced computer assembly and related method is provided that enables easy shipment and installation of such computing systems. In one embodiment a split top hat design is provided that can be removed. The removable split hat comprises a receiving member and an inner member that are secured to the frame in a manner that can be easily removed. In an alternate embodiment, a collapsible top hat is provided which adjusts the height of the assembly from a first to a second position. The collapsible feature has an upper portion that is connected to a plurality of pivoted side members that are capable of collapsing onto themselves.

Abstract: Monitoring a plurality of field-replaceable units (FRUs) in an enclosure using two or more microcontroller-equipped power supplies to detect an FRU failure. Upon detection of an FRU failure, a first signal indicative of the failure is communicated from at least one of the microcontroller-equipped power supplies to one or more small computer system interface (SCSI) repeaters over an I2C bus. The one or more SCSI repeaters report a second signal indicative of the failure to one or more central electronics complexes (CECs) over one or more SCSI busses. The first signal may, but need not, be substantially identical to the second signal.

Abstract: A technique for controlling a system is provided in which a control-data table is employed for facilitating operation of the system, and an inject-fault-data table is selectively used during testing of the system. Pursuant to the technique, a security mechanism is provided to restrict the system's utilization of the inject-fault-data table. A security check by the security mechanism is to be satisfied for the system to access the inject-fault-data table. In an enhanced embodiment, the system is tested by substituting an inject-fault-data entry of the inject-fault-data table for a control-data entry of the control-data table as an input to the system. The testing verifies the response of the system to an emulated fault, which results from employing at least one inject-fault-data entry during testing of the system.

Abstract: A method of controlling a system is provided in which a control-data table is employed for facilitating operation of the system, and an inject-fault-data table is selectively used during testing of the system. Pursuant to the method, a security mechanism is provided to restrict the system's utilization of the inject-fault-data table. A security check by the security mechanism is to be satisfied for the system to access the inject-fault-data table. In an enhanced embodiment, the system is tested by substituting an inject-fault-data entry of the inject-fault-data table for a control-data entry of the control-data table as an input to the system. The testing verifies the response of the system to an emulated fault, which results from employing at least one inject-fault-data entry during testing of the system.

Abstract: Disclosed a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate disposed on a printed circuit board. The multi-chip module also includes a quantity of molecular sieve desiccant, and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board.

Abstract: Disclosed is a multi-chip module with solder corrosion prevention including one or more chips connected to a substrate by soldering, the substrate situated on a printed circuit board. The multi-chip module also includes a molecular sieve desiccant chamber containing a quantity of molecular sieve desiccant and a first cover to contain the one or more chips, the substrate, and the molecular sieve desiccant, the first cover having a seal to the printed circuit board. The molecular sieve desiccant chamber is connected to the first cover via a first fluid pathway and a second fluid pathway.

Abstract: In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a heat spreader having a first surface operably coupled to a top surface defining the electronic device and an opposite second surface in thermal communication with a second substrate; and a frame defining an opening therethrough. The frame is further defined by an inwardly extending ledge configured to allow the heat spreader to extend at least to a peripheral edge defining a perimeter of the first substrate. In an exemplary embodiment, the second substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.