Abstract: The disclosure generally relates to method and apparatus for predicting the steady state temperature of solid state devices, preferably under transient conditions. An apparatus according to one embodiment of the disclosure includes a thermocouple for detecting temperature of the solid state system; a processor in communication with the thermocouple and programmed with instructions to: construct an initial curve for the solid state system, the initial curve having a shape; obtain a plurality of theoretical temperature curves for the solid state system; select one of the plurality of theoretical temperature curves having a shape closest to the shape of the initial curve; and superimposing the selected theoretical temperature curve on the initial curve to predict the steady state temperature.

Abstract: A support fixture for a printed circuit board connector having L-shaped wire wrapping pins attached to a printed circuit board includes a plurality of L-shaped elements, each for placement in the L-shaped space defined by adjacent arrays of pins, connector body and printed circuit board. An outer L-shaped structure is juxtaposed with the pins at their bends and with the elements to preclude motion of the pins at their bends in response to wire wrapping forces on the ends of the pins protruding from the printed circuit board.

Abstract: A stiff assist spring is secured around a receptacle contact having opposed spaced contact arms extending forward from a body portion thereof to receive a plug terminal insertably therebetween, said assist spring having spring arms coextensive with and outside said contact arms and extending from base sections interconnected by an integral bridge section straddling said contact arms proximate said body portion, such that said spring arms resist the widening of the contact arms by the insertion of said plug terminal.