Abstract: A method of assembling a substrate and an electrical or electronic component, the component having electrically conductive leads with surfaces of an alloy from the list consisting of tin, nickel, tin copper, tin silver, nickel palladium, gold palladium, and silver palladium, and the leads being soldered to copper-based terminals of the substrate by a solder alloy, the solder alloy comprising, by weight, 99.3% tin and 0.7% copper. The soldering takes place in a chamber having a nitrogen inert atmosphere. Lead solder is thus avoided.

Abstract: Improvements in MolyPhos corrosion resistant coatings for zinc plated surfaces and zinc alloy surfaces are presented, which enhances corrosion protection in marine environments, and other corrosive atmospheres. In particular a cerium fluoride stabilized MolyPhos coating, and organic acid stabilized coatings are provided, which improve resistance to standard salt fog test exposures to at least 300 hrs, thus extending applicability of a conventional MolyPhos coating to applications to telecommunications, electronics, automotive and aviation equipment. MolyPhos coatings offer promise as an environmentally friendly alternative to conventional chromate corrosion coatings.

Abstract: A polymeric telephone base having two housing members with one of the members provided with an integral mounting for receiving a telephone operating component. A plurality of elongate load distributing and wall stiffening elements extends in divergent manner from the mounting at spaced positions around the site for location of the operating component. This structure can result in a significantly reduced support wall thickness. It is preferable that each stiffening element tapers away from each mounting and is directed towards a location at which side walls of the support member merge into each other. At this location, reinforcing fillets extend between the side walls and the support wall. A device is also provided to flex the support wall to increase locking action between the housing members when these are assembled.

Abstract: An electronics enclosure includes an assembly of wall elements having metallic surfaces with a standard oxidization potential within the range of -0.25 to +0.5 volts, the wall elements rigidly secured together, and having a coating of molybdenum phosphate covering the metallic surfaces of the wall elements and providing electrical discharge continuity around the enclosure. The molybdenum phosphate coating provides a required degree of electrical conductivity for adequate electrostatic discharge thereby providing a Faraday cage to filter out any electromagnetic radiation attempting to pass through the enclosure. Of particular importance in the structure is the feature that the molybdenum phosphate is particularly effective as an electromagnetic interference element at junctures between wall elements of the enclosure. The molybdenum phosphate coating may be applied to the wall elements either prior to assembly or following assembly.

Abstract: An environmental protector for electronics devices in outside terminal boxes. The protector has a laminate wall which provides a moisture barrier, penetration resistant surface and EMI shield. The protector may be flexible or substantially rigid and is in the form of an open-ended container for receiving an electronics device. The container is sealed at the open end around a connector unit of the device with outgoing terminals accessible for connection purposes. The device may be potted within the container. Conveniently, the EMI shield is connected to ground by a ground element in the connector unit.

Abstract: A solid-state surge protection device comprises a semiconductor chip sandwiched between two electrodes. A resilient sealing member or layer comprised of a thermoplastic or thermosetting resin extends around the periphery of the device, adhering to both electrodes, so as to seal the interface region between the chip and each electrode. The resin is a flexible, dielectric material which is not disrupted by heat generated under surge conditions in the device, is environmentally inert, and preferably remains compliant under extremely cold conditions. The electrodes of the device can move together into electric-conductive contact in the event of chip destruction, or can move back into contact with the chip if separated therefrom by an arc.

Abstract: An overvoltage protector for protecting equipment, especially telephone equipment, against high voltage surges such as are caused by lightning in the vicinity of the equipment or the cables to which it is connected, comprises one or more overvoltage protectors (42,58) mounted upon one face of an insulating support (18). A generally planar contact member (62) mounted upon the support member has a ground contact member (90) to make contact with a ground electrode (114) in the equipment to be protected and with each overvoltage protector. A spacer (60) of fusible plastics material extending between the contact member (62) and an interconnection (26) to one terminal (42A) of the protector melts when a sustained fault occurs. As the spacer melts, it permits an electrical connection between the contact member and the line to which the overvoltage protector is connected, effectively short-circuiting the line to ground.

Abstract: A solid-state surge protection device comprises a semiconductor chip sandwiched between two electrodes. A resilient sealing member or layer comprised of a thermoplastic or thermosetting resin extends around the periphery of the device, adhering to both electrodes, so as to seal the interface region between the chip and each electrode. The resin is a flexible, dielectric material which is not disrupted by heat generated under surge conditions in the device, is environmentally inert, and preferably remains compliant under exteremely cold conditions. The electrodes of the device can move together into electric-conductive contact in the event of chip destruction, or can move back into contact with the chip if separated therefrom by an arc.

Abstract: In a method and apparatus for inhibiting ice mass formation around equipment housed in a chamber subject to water penetration, a plurality of compressible, non-absorbent, smooth-surfaced blocks are packed around the equipment to substantially fill the chamber. The blocks are provided with handles for their placement in and removal from the chamber. The blocks are particularly useful for inhibiting ice mass formation in shallow underground chambers housing telecommunications cable equipment.

Abstract: A solid-state surge protection device comprises two electrodes between which is sandwiched a semiconductor chip. A resilient, annular, sealing member comprised of a thermoplastic resin extends around the periphery of the device and is adhered to both electrodes. The resin is a flexible, dielectric material which is not disrupted by heat generated under surge conditons in the device, and which is environmentally inert. The electrodes can be soldered to opposite surfaces of the chip.

Abstract: A wood preservative solution comprising water, hexavalent chromium, copper and arsenic can be stabilized against precipitation by the addition of fluorine ion, thereby enhancing the useful life and safety of the solution. Fluoride salts like cerium fluoride, sodium fluoride and calcium fluoride are suitable sources for fluorine ion in such a solution. Wood treated with the preservative solution displays increased penetration, distribution and retention of chromium, copper and arsenic.

Abstract: Optical conductors, useful in the transmission of data-encoding light beams, that comprise an optically transmissive rod carrying one or more cavities, each with a border defining an inclined planar surface, can be produced via a method comprising the steps of (1) coating the rod, via plasma-assisted physical vapor deposition, with an amorphous material of lower refractive index than the rod's; and (2) rendering each inclined planar surface light-reflective. The sequence of steps (1) and (2) can be reversed.

Abstract: A fluorescent solder paste mixture comprising a fluorescent pigment dispersed in a solder paste is disclosed. The solder paste comprises solder fragments dispersed in a solder flux. A method for making the solder paste mixture and a method for using the solder paste mixture to make a fluorescent solder joint between an electrical component and a circuit board are also disclosed. Use of the fluorescent solder paste mixture facilitates automatic and manual inspection of circuit boards during and after assembly.

Abstract: A treatment for wood poles, as used for telecommunications and electric power poles, to reduce surface hardening comprises modifying the standard treatment solution by the addition of a polymer of ethylene oxide. A surface active agent is a further possible additive, and reduction of the hexavalent chrome ion in the standard solution is a further modification.

Abstract: A flexible, tear resistant, protective glove, particularly for use near live wires or equipment, is of unitary structure, having an inner layer of natural rubber, particularly suited for high voltage protection, and an outer layer of urethane elastomer bonded thereto and giving tear and abrasion resistance. Bulges are formed across the back of the main portion of the glove and across the back at each finger and the thumb, to provide excess material which permits ready bonding of fingers and thumb for gripping, without restriction by the glove.

Abstract: A splice between ends of a pair of telecommunications cables is encapsulated in a thermoset foam. To encapsulate the splice it is positioned within a mold with the cables extending through apertures in the mold. At the apertures the cables are wrapped with an open cell foam material to block the cavity ends. A foam base material is then mixed with an activating agent which includes both a heat activated blowing agent and a material which reacts exothermically with the foam base material. The mixture is deposited within the mold and the mold closed. The mixture then foams to fill the mold and rapidly cures. The resulting joint is light, durable, waterproof and re-enterable.

Abstract: A compound for spray application onto pulp insulation on an electrical conductor, the compound comprising between 5 and 9 parts by weight of polyvinylpyrrolidone polyvinylacetate copolymer with 0.5 to 0.9 parts by weight of a copper corrosion inhibitor and 1.0 to 3.0 parts of a plasticizer. The compound is useful either to repair damaged pulp regions or for spraying the pulp during manufacture of an insulated conductor without substantially reducing the electrical insulating characteristics of the pulp.

Abstract: A protective package for an optical fiber splice comprises two elongate plastic members, each having a layer of pressure sensitive adhesive on a front face. Elongate grooves are formed at each end of each member. The grooves are dimensioned so as to be a close fit over the uncoated portions of spliced fibers and intervening adhesive material, with the members in face-to-face assembly. The members may be hingedly connected by the adhesive layer or by a thin deformable hinge portion. A further groove may connect the end grooves, being of a dimension to fit firmly over the uncoated end portions of spliced fibers.