Patents by Inventor William Palmteer

William Palmteer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SURFACE MOUNT PACKAGE
    Publication number: 20100018047
    Abstract: A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.
    Type: Application
    Filed: September 25, 2009
    Publication date: January 28, 2010
    Inventor: William Palmteer
  • Surface mount package
    Patent number: 7595453
    Abstract: A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: September 29, 2009
    Assignee: M/A-COM Technology Solutions Holdings, Inc.
    Inventor: William Palmteer
  • Surface mount package
    Publication number: 20060266546
    Abstract: A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.
    Type: Application
    Filed: May 24, 2005
    Publication date: November 30, 2006
    Inventor: William Palmteer
  • Surface mount package for a high power light emitting diode
    Publication number: 20050093116
    Abstract: A package for a light emitting diode (LED) including an electrically insulating substrate layer, a non-conductive layer disposed on the electrically insulating substrate layer, and a reflector layer disposed on the non-conductive layer. The electrically insulating layer includes metallized portions for coupling a light emitting diode thereto.
    Type: Application
    Filed: October 29, 2003
    Publication date: May 5, 2005
    Applicant: M/A-COM, INC.
    Inventors: William Palmteer, Thomas Yuan, Richard Koba