Abstract: An apparatus is provided that includes a substrate having a top surface, at least one optical data transport medium coupled to the substrate, one or more lens devices coupled to the substrate, and one or more reflective devices coupled to the substrate. The one or more lens devices and the one or more reflective devices are at least partially passively aligned with the at least one optical transport medium by use of one or more pins.

Abstract: An optical lens structure includes a substantially transparent substrate a lens array attached to the substrate with lenses of the lens array situated opposite the substrate and packaging material surrounding at least the periphery of the lens array, the packaging material including at least two alignment holes which are aligned with respect to positions of the lenses. In one example, the structure is fabricated by attaching a lens array to a substrate with lenses of the lens array situated opposite the substrate, surrounding a periphery of the lens array with a packaging material, the packaging material being attached to the substrate, planarizing the packaging material, and providing alignment holes through the packaging material.

Abstract: An in situ breast tumor temperature profile measuring probe includes a rod, thermal sensors and electrical output leads. The thermal sensors are formed in spaced apart holes in an outer insulating layer of the rod and a common electrical input lead to provide an electrical input signal to the thermal sensors is disposed below and has portions exposed at the holes and electrically connected to the thermal sensors. The thermal sensors receive the electrical input signal from the common electrical input lead, sense the temperature of biological matter adjacent to the thermal sensors and produce an electrical output signal correlated thereto. Each electrical output lead mounted to the outer insulating layer is in electrical contact with a different one of the thermal sensors to receive the electrical output signal from the one thermal sensor and output the same.

Abstract: A switch structure having a base surface; a first high density interconnect (HDI) plastic interconnect layer overlying the base surface layer; a cavity within the HDI plastic interconnect layer; at least one patterned shape memory alloy (SMA) layer overlying the HDI plastic interconnect layer and the cavity, and at least one patterned conductive layer over the at least one patterned SMA layer; a fixed contact pad within the cavity and attached to the base surface and a movable contact pad attached to a portion of the first patterned SMA layer within the cavity such that when the first and second patterned SMA layers and the first and second patterned metallized layers are in a first stable position, the movable contact pad touches the fixed contact pad, thereby providing an electrical connection and forming a closed switch. The structure has a second stable position in which the SMA and metallized layers are flexed away from the cavity so that the contact pads are not in contact and form an open switch.

Abstract: A high-density cable of a type suitable for transmitting ultrasound signals from an ultrasonic probe to multiplexing circuitry during a medical ultrasound procedure is provided. The cable includes one or more flexible circuits arranged within a flexible sheath that surrounds and confines the flexible circuits. Each flexible circuit includes an elongate flexible substrate with oppositely-disposed surfaces and multiple conductors on at least one of these surfaces. The opposing longitudinal ends of the substrate define integral connectors for connecting with respective output connectors and/or electronic devices, such as an ultrasonic probe or multiplexing circuitry.

Abstract: An in situ breast tumor temperature profile measuring probe (12) includes a rod (20), thermal sensors (22) and electrical output leads (24). The thermal sensors (22) are formed in spaced apart holes (30) in an outer insulating layer (26) of the rod (20) and a common electrical input lead (28) to provide an electrical input signal to the thermal sensors (22) is disposed below and has portions (28a) exposed at the holes (30) and electrically connected to the thermal sensors (22). The thermal sensors (22) receive the electrical input signal from the common electrical input lead (28), sense the temperature of biological matter adjacent to the thermal sensors (22) and produce an electrical output signal correlated thereto. Each electrical output lead (24) mounted to the outer insulating layer (26) is in electrical contact with a different one of the thermal sensors (22) to receive the electrical output signal from the one thermal sensor (22) and output the same.

Abstract: An in situ breast tumor temperature profile measuring probe includes a rod, thermal sensors and electrical output leads. The thermal sensors are formed in spaced apart holes in an outer insulating layer of the rod and a common electrical input lead to provide an electrical input signal to the thermal sensors is disposed below and has portions exposed at the holes and electrically connected to the thermal sensors. The thermal sensors receive the electrical input signal from the common electrical input lead, sense the temperature of biological matter adjacent to the thermal sensors and produce an electrical output signal correlated thereto. Each electrical output lead mounted to the outer insulating layer is in electrical contact with a different one of the thermal sensors to receive the electrical output signal from the one thermal sensor and output the same.

Abstract: A light source includes a substrate; an array of un-packaged light emitting semiconductor devices (LESDs), each of the LESDs having at least one surface for emitting light and a substrate surface being attached to the substrate; and a plurality of electrical connections, each electrical connection coupled for providing electrical power to a respective LESD. The LESDs are arranged on the substrate with sufficient density and light generating capability to provide a predetermined irradiation from the light source.

Abstract: A flexible multiple electrode assembly includes at least one fixed electrode; at least one extendible electrode; and electrically conductive interconnections coupling the at least one fixed electrode and the at least one extendible electrode to a common connector. The at least one extendible electrode is adapted to be physically separable from the at least one fixed electrode while remaining electrically coupled to the common connector. In one embodiment, an array of fixed and extendible electrodes is configured for the acquisition of electrical pulses from a heart for transmission to an electrocardiograph (EKG or ECG) device.

Abstract: An electromagnetic system for detecting cracked rail and enhancing traction when necessary, includes wiring coils around wheel axles, and a corresponding power source for supplying power to the coils for producing electromagnetic flux. The produced electromagnetic flux is routed through the wheel axles, wheels and rails in a closed circuit. When a cracked rail is encountered along the route, the circuit will be interrupted or open, resulting in a changed flux pattern. This pattern change is detected by a flux sensor, and the geographic location of the crack in the rail is determined. The electromagnetic system further includes an electromagnetic wheel loading means for generating an attraction to the rails. The generated attraction to the rails increases friction between the wheels and the rails, thereby increasing traction to enable hauling greater loads up steep grades.

Abstract: A switch structure having a base surface; a first high density interconnect (HDI) plastic interconnect layer overlying the base surface layer; a cavity within the HDI plastic interconnect layer; at least one patterned shape memory alloy (SMA) layer overlying the HDI plastic interconnect layer and the cavity, and at least one patterned conductive layer over the at least one patterned SMA layer; a fixed contact pad within the cavity and attached to the base surface and a movable contact pad attached to a portion of the first patterned SMA layer within the cavity such that when the first and second patterned SMA layers and the first and second patterned metallized layers are in a first stable position, the movable contact pad touches the fixed contact pad, thereby providing an electrical connection and forming a closed switch. The structure has a second stable position in which the SMA and metallized layers are flexed away from the cavity so that the contact pads are not in contact and form an open switch.

Abstract: A thermal sensor array includes a dielectric layer including a plurality of individual thermal sensors and a pattern of deposited electrical interconnections facing at least one surface of the dielectric layer for providing electrical connections from each of the plurality of individual thermal sensors, the dielectric layer and the pattern of deposited electrical interconnections being surface-conformable. The thermal sensor array can be used in a diagnostic tool that further includes: a scanning device coupled to the pattern of deposited electrical interconnections for obtaining sensor signals from the thermal sensors; and a computer for processing the sensor signals to estimate temperature distributions.

Abstract: A thermocouple array includes a dielectric layer having via openings therethrough, a first patterned conductive layer facing one surface of the dielectric layer, and a second patterned conductive layer facing another surface of the dielectric layer. Portions of the second patterned conductive layer can extend through the via openings to couple respective portions of the first patterned conductive layer. The second patterned conductive layer has a different thermal emf than the first patterned conductive layer. The dielectric layer, the first patterned conductive layer, and the second patterned conductive layer can be surface-conformable.

Abstract: A thermocouple array includes a dielectric layer having via openings therethrough, a first patterned conductive layer facing one surface of the dielectric layer, and a second patterned conductive layer facing another surface of the dielectric layer. Portions of the second patterned conductive layer can extend through the via openings to couple respective portions of the first patterned conductive layer. The second patterned conductive layer has a different thermal emf than the first patterned conductive layer. The dielectric layer, the first patterned conductive layer, and the second patterned conductive layer can be surface-conformable.

Abstract: An array ultrasonic transducer precursor includes a body of piezoelectric material with a dielectric substrate bonded to a surface of the body. Circuit elements supported on the dielectric substrate include, in an active region, physically parallel signal conductors arranged in a pattern with spaces between adjacent ones of the conductors. Dicing saw cuts made in these spaces define individual circuit elements within the piezoelectric body. The circuit elements outside the active region include a set of resistive alignment elements in predetermined positions with reference to the pattern of signal conductors. The transducer precursor is mounted in a dicing saw fixture, and initial cuts made with the dicing saw remove portions of the resistive alignment elements. Locations of the initial cuts with reference to the resistive alignment elements are determined by measuring resistances of the resistive alignment elements after the initial cuts.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.

Abstract: An array ultrasonic transducer precursor includes a body of piezoelectric material with a dielectric substrate bonded to a surface of the body. Circuit elements supported on the dielectric substrate include, in an active region, physically parallel signal conductors arranged in a pattern with spaces between adjacent ones of the conductors. Dicing saw cuts made in these spaces define individual circuit elements within the piezoelectric body. The circuit elements outside the active region include a set of resistive alignment elements in predetermined positions with reference to the pattern of signal conductors. The transducer precursor is mounted in a dicing saw fixture, and initial cuts made with the dicing saw remove portions of the resistive alignment elements. Locations of the initial cuts with reference to the resistive alignment elements are determined by measuring resistances of the resistive alignment elements after the initial cuts.

Abstract: An eddy current surface measurement array structure for complete coverage of an underlying inspection surface without requiring mechanical scanning is disclosed. A three-dimensional array of eddy current sense elements is organized as a plurality of layers of two-dimensional sub-arrays. The sub-arrays, although in different layers, are essentially identical in configuration, and are staggered such that the sense elements of one layer provide at least partial coverage of portions of the inspection surface not covered by the sense elements of another layer. As many staggered layers are included as are necessary to ensure that no "blind spots" remain, for complete coverage of the underlying inspection surface. The sense elements are disposed in a layered flexible structure fabricated employing high density interconnect fabrication techniques or other photolithographic techniques.

Abstract: A magnetic circulator is incorporated into a multi-chip module using a microwave high density interconnect (HDI) structure. A prepackaged circulator can be inserted into a ready-made high density interconnected multi-chip module; this prepackaged circulator may use a stripline design having a signal line with two ground planes above and below the signal line, or a microstrip transmission line design having one signal line and one ground plane below the signal line. Alternatively a circulator can be manufactured directly in a high density interconnected multi-chip module, with a stripline, or a microstrip transmission line design.