Patents by Inventor William Pennington

William Pennington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12326217
    Abstract: The present disclosure provides a portable electronic device including a frame body supporting electronic components and a stand mechanism. The stand mechanism includes a foot, and an activator. The foot includes a foot support and a foot shaft including a foot guide path. The activator includes an engaging element, and the engaging element is received by the foot guide path. A portion of the foot guide path extends at an angle relative to a longitudinal axis of the foot shaft. When the activator engages a surface, the engaging element of the activator moves along the portion of the foot guide path at the angle relative to the longitudinal axis of the foot shaft causing the foot support to rotate from a stored position to a deployed position.
    Type: Grant
    Filed: December 4, 2023
    Date of Patent: June 10, 2025
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Benjamin Carroll, John William Pennington, Jr., Marcus Hoggarth, Stephen Philip de Saulles, Michael Brown
  • Publication number: 20250109820
    Abstract: The present disclosure provides a portable electronic device including a frame body supporting electronic components and a stand mechanism. The stand mechanism includes a foot, and an activator. The foot includes a foot support and a foot shaft including a foot guide path. The activator includes an engaging element, and the engaging element is received by the foot guide path. A portion of the foot guide path extends at an angle relative to a longitudinal axis of the foot shaft. When the activator engages a surface, the engaging element of the activator moves along the portion of the foot guide path at the angle relative to the longitudinal axis of the foot shaft causing the foot support to rotate from a stored position to a deployed position.
    Type: Application
    Filed: December 4, 2023
    Publication date: April 3, 2025
    Inventors: Benjamin Carroll, John William Pennington, Jr., Marcus Hoggarth, Stephen Philip de Saulles, Michael Brown
  • Publication number: 20250074964
    Abstract: The disclosure described herein provides for enzymatically stable and potent GLP-1 analogs (i.e., derivatives) for the treatment of metabolic disease or disorder in a subject. In some embodiments, the GLP-1 analog is a derivatized GLP-1 peptide, wherein the derivatized peptide has 1, 2, 3, 4, 5, 6, 7, 8, 9, or 10 amino acid differences from any one of GLP-1, GLP-1(7-39), GLP-1(7-36), GLP-1(7-37). In certain embodiments, the GLP-1 analog comprises at least one lysine substituent. The GLP-1 analogs described herein demonstrate potent receptor binding and extended plasma half-life. A pharmaceutical composition of the GLP-1 analogs is described herein for the treatment of metabolic disease or disorder in a subject, such as diabetes or obesity.
    Type: Application
    Filed: September 5, 2024
    Publication date: March 6, 2025
    Inventors: Juncai BAI, Guoqing ZHANG, Fuliang ZHANG, Michael William PENNINGTON, Simrat P. SINGH
  • Patent number: 12153480
    Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: November 26, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John William Pennington, Jr., Rahul Shrikant Patil
  • Publication number: 20220413575
    Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.
    Type: Application
    Filed: September 1, 2022
    Publication date: December 29, 2022
    Inventors: John William Pennington, Jr., Rahul Shrikant Patil
  • Patent number: 11460899
    Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: October 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John William Pennington, Jr., Rahul Shrikant Patil
  • Publication number: 20210373627
    Abstract: An example computing device includes: a housing; a liquid cooling system; a first compartment of the housing that contains processing components; a second compartment of the housing that contains cooling components of the liquid cooling system; an airgap in the housing that physically separates and thermally isolates the first compartment and the second compartment, the airgap defined by external surfaces of the housing; and, a conduit of the housing that joins the first compartment and the second compartment at a side of the airgap, the conduit routing, internal to the housing, tubing of the liquid cooling system from the first compartment to the second compartment, the tubing conveying liquid that carries heat from the processing components to the cooling components for dissipation
    Type: Application
    Filed: December 13, 2018
    Publication date: December 2, 2021
    Applicant: Hewlett-Packard Development Company, LP.
    Inventors: John William Pennington, JR., Rahul Shrikant Patil
  • Patent number: D898025
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: October 6, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Siddhartha Bhat, John William Pennington, Jr., Henry Chu, Glenn A. Wong
  • Patent number: D937832
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: December 7, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Siddhartha Bhat, John William Pennington, Jr., Henry Chu, Glenn A. Wong
  • Patent number: D938421
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: December 14, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Siddhartha Bhat, John William Pennington, Jr., Henry Chu, Glenn A. Wong
  • Patent number: D938950
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: December 21, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel Yoon, Glenn A. Wong, John William Pennington, Jr.
  • Patent number: D941288
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Siddhartha Bhat, Henry Ken Chu, Daniel Young Yoon, Glenn A. Wong, John William Pennington, Jr.
  • Patent number: D944243
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: February 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Henry Ken Chu, Daniel Young Yoon, Siddhartha Bhat, Glenn A Wong, John William Pennington, Jr., Rahul Shrikant Patil
  • Patent number: D944244
    Type: Grant
    Filed: May 31, 2021
    Date of Patent: February 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Henry Ken Chu, Daniel Young Yoon, Siddhartha Bhat, Glenn A Wong, John William Pennington, Jr., Rahul Shrikant Patil
  • Patent number: D964348
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: September 20, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel Yoon, Glenn A. Wong, John William Pennington, Jr.
  • Patent number: D1009863
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: January 2, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel Yoon, John William Pennington, Jr., Glenn A. Wong, Kevin L. Massaro
  • Patent number: D1033419
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: July 2, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel Yoon, John William Pennington, Jr., Glenn A. Wong, Kevin L. Massaro, Marcus Hoggarth, Stephen De Saulles
  • Patent number: D1042470
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: September 17, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Glenn A. Wong, Kevin L. Massaro, David N. Skinner, John William Pennington, Jr., Stacy L. Wolff, Siddhartha Bhat, Marcus Hoggarth
  • Patent number: D1063933
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: February 25, 2025
    Assignee: Hewlett-Packard Development Co., L.P.
    Inventors: Siddhartha Bhat, John William Pennington, Jr., Henry Chu, Glenn A. Wong
  • Patent number: D1077041
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: May 27, 2025
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Daniel Young Yoon, Glenn A. Wong, John William Pennington, Jr., Kevin L. Massaro, Benjamin Carroll, Ben Henley, Marcus Hoggarth