Patents by Inventor William Petrocelli

William Petrocelli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10892574
    Abstract: A cable to board interconnect device that is used to interconnect wires to a printed circuit board (PCB) that has conductive traces on its essentially flat surface, where the wires are essentially parallel to the face of the PCB. The device includes an alignment member that overlies the wires, and an elastomeric conductor between the wires and the PCB traces.
    Type: Grant
    Filed: October 21, 2017
    Date of Patent: January 12, 2021
    Assignee: Paricon Technologies Corporation
    Inventors: Roger Weiss, Everett Simons, William Petrocelli, Ethan Berkowitz
  • Publication number: 20200067215
    Abstract: A cable to board interconnect device that is used to interconnect wires to a printed circuit board (PCB) that has conductive traces on its essentially flat surface, where the wires are essentially parallel to the face of the PCB. The device includes an alignment member that overlies the wires, and an elastomeric conductor between the wires and the PCB traces.
    Type: Application
    Filed: October 21, 2017
    Publication date: February 27, 2020
    Inventors: Roger Weiss, Everett Simons, William Petrocelli, Ethan Berkowitz
  • Publication number: 20090159254
    Abstract: A heat sink assembly and a method of fabricating a heat sink assembly. The heat sink assembly comprises a cylindrical core onto which are mounted a plurality of fin disks. The fin disks and cylindrical core are assembled to a threaded base. This assembly comprises the heat sink assembly. The heat sink assembly can be mounted onto a mounting clip or threaded directly onto a device having mating threads. The device can be a printed circuit board or components of a printed circuit board adapted to have threads or other electrical or electronic component that is adapted to have threads to receive the heat sink assembly. The fin disks are interference fit onto the cylindrical core to form a fin disk assembly to provide thermo-mechanical contact between the fin disks and the cylindrical core. The base is then interference fit onto the fin disk assembly to provide thermo-mechanical contact between the fin disk assembly and the base to form a heat sink assembly.
    Type: Application
    Filed: December 19, 2007
    Publication date: June 25, 2009
    Applicant: TYCO Electronics Corporation
    Inventors: Stephen Damian DELPRETE, Victor Horst KHEIL, William PETROCELLI, Shiraz SAMEJA
  • Patent number: 6612851
    Abstract: An electrical connector assembly is provided including first and second circuit boards proximate each other and each having a first side and a second side. The electrical connector assembly includes flex circuits electrically connected to the first and second sides of the first and second circuit boards and carrying electrical signals therebetween. The electrical connector assembly includes load cells having at least one bowed spring, a base plate, and a cover plate. The spring has a peak portion and end portions and is compressed between the base and cover plates. The peak portion engages one of the base and cover plates with the end portions engaging another of the base and cover plates to exert a load force on the base and cover plates. The load cells are aligned opposite each other on the first and second circuit boards and retain the flex circuits thereto.
    Type: Grant
    Filed: April 9, 2002
    Date of Patent: September 2, 2003
    Assignee: Tyco Electronics Corporation
    Inventors: Jonathan W. Goodwin, Donald Amaral, Wayne S. Alden, III, William Petrocelli
  • Patent number: 6434012
    Abstract: Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: August 13, 2002
    Assignee: Tyco Electronics Logistics AG
    Inventors: Wayne S. Alden, William Petrocelli, Peter Wapenski, Arthur G. Michaud, Michael Kirkman, Jeffery Mason, Brian Paul Sharp
  • Patent number: 6345989
    Abstract: The circuit traces of a circuit board extend to and usually outward from a side surface of the board for direct connection to contacts of a mating connector, circuit board or device. The contact portions of the traces are the end surfaces of the traces which in one embodiment extend outward of the plane of the associated side surface of the circuit board. The contact portion may be of greater cross-sectional area than that of the associated trace to provide a contact area of intended size. The contact portion of a trace may be plated with gold or other appropriate conductive material to enhance conductivity and prevent or minimize oxidation or corrosion. Interconnection to the contact portions of the traces is provided by mating contacts which respectively engage the contact and surfaces of the traces. Preferably, the mating contacts are resilient conductive columns or elements which are maintained in engagement with the contact ends by suitable hardware.
    Type: Grant
    Filed: January 4, 2000
    Date of Patent: February 12, 2002
    Assignee: Thomas & Betts International, Inc.
    Inventors: Jeffery W. Mason, William Petrocelli
  • Publication number: 20010030854
    Abstract: Interconnection apparatus is provided which is especially useful to mount and connect circuit boards having a contact assembly of resilient compressive contacts to a backplane or other mateable board or device. The apparatus includes an enclosure having guide channels for each board to be housed in the enclosure, a contact assembly for providing compressive contact between the contact ends of each board and corresponding contacts of the backplane, and elements for seating each board into engagement with the backplane.
    Type: Application
    Filed: December 5, 2000
    Publication date: October 18, 2001
    Applicant: TYCO ELECTRONICS LOGISTICS AG
    Inventors: Wayne S. Alden, William Petrocelli, Peter Wapenski, Arthur G. Michaud, Michael Kirkman, Jeffery Mason, Brian Paul Sharp
  • Patent number: 6280202
    Abstract: An improved securement device aligns adjacent printed circuit boards (“PCBs”) while simultaneously connecting all external hardware so as to prevent overcompression of elastomeric contacts positioned therebetween during assembly. The device supports a connector between a pair of PCBs in spaced parallel relation, wherein the connector itself supports a plurality of elastomeric contacts thereon for establishing electrical engagement between the PCBs. The PCBs and the connector each include aligned securement openings. The device includes an elongate fastener having a substantially cylindrical section positioned in the connector opening. The cylindrical section defines a pair of opposed, substantially planar spaced apart component landings for support of a similarly planar component thereupon. The landings are spaced apart a distance sufficient to place the PCBs in communication with the connector without overcompressing the elastomeric contacts therebetween.
    Type: Grant
    Filed: September 1, 1999
    Date of Patent: August 28, 2001
    Assignee: Thomas & Betts International, Inc.
    Inventors: Wayne S. Alden, 3rd, William Petrocelli