Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: Elements of a sensor system are encapsulated into a single package. The sensor elements are covered with a flexible gel coat and then inserted into a molding tool cavity. Each element may be individually coated with a gel blob, or all elements may by coated with a single gel blob. One or more retractable pins are incorporated into the molding tool and in their normal position are each in contact with the gel. A molding compound is injected into the cavity so as to encapsulate the device and gel coat. When the pins are extracted and the device ejected from the molding cavity, one or more passageways in the molding are left defined by the pins. The passageways expose the flexible gel covering the device elements to the atmosphere. For pressure sensitive elements, the gel, being flexible, transfers the local air pressure to the pressure sensitive element. For optical elements, the exposed gel is preferably removed to allow for the passage of radiation to and from the device elements.

Abstract: An integrated circuit combines micro-machined elements, piezoelectric elements and signal processing components as part of a compensated oscillating gyroscopic sensor for angular motion detection. An oscillating mass is supported on a number of flexible beams micro-machined into an integrated circuit device, such as a silicon CMOS device. Several Piezo-electric elements, deposited on the beams, are provided to excite the mass and to measure the accelerations. Integrated in the device are electronic circuitry that initiates and maintains the oscillation and electronic circuitry that detects and measures the subsequent motion. Additional circuitry is also provided to eliminate the effects of quadrature oscillation and to determine the Coriolis acceleration and thus the magnitude of the external perturbing velocity.

Abstract: A self-calibrating infrared (IR) sensing device having the capability to measure the attenuation effects of surface contamination on the transmission window and to adjust the gain of the sensor accordingly so as to counter the attenuation. The IR sensing device includes an IR sensor mounted in a housing having an IR transparent window that allows IR radiation originating from outside the housing to be directed toward the sensor. The IR sensor includes a thermally isolated area of IR-absorbing material coupled to a temperature measuring unit. IR radiation impinging on the sensor is absorbed, thereby raising the temperature of the IR absorbing material. The temperature measuring unit measures the increase in temperature and generates a proportional electronic signal indicative of the temperature. The electronic signal is received and processed by a processor. An IR radiator is also included within the sensing device housing.

Abstract: Braking systems including integrated control circuitry and sensors for measuring the pressure and temperature of the brake system and for determining various status information and performance parameters of the braking system and other related systems, such as tire and suspension systems.

Abstract: A self-calibrating infrared (IR) sensing device having the capability to measure the attenuation effects of surface contamination on the transmission window and to adjust the gain of the sensor accordingly so as to counter the attenuation. The IR sensing device includes an IR sensor mounted in a housing having an IR transparent window that allows IR radiation originating from outside the housing to be directed toward the sensor. The IR sensor includes a thermally isolated area of IR-absorbing material coupled to a temperature measuring unit. IR radiation impinging on the sensor is absorbed, thereby raising the temperature of the IR absorbing material. The temperature measuring unit measures the increase in temperature and generates a proportional electronic signal indicative of the temperature. The electronic signal is received and processed by a processor. An IR radiator is also included within the sensing device housing.

Abstract: A self-calibrating infrared (IR) sensing device having the capability to measure the attenuation effects of surface contamination on the transmission window and to adjust the gain of the sensor accordingly so as to counter the attenuation. The IR sensing device includes an IR sensor mounted in a housing having an IR transparent window that allows IR radiation originating from outside the housing to be directed toward the sensor. The IR sensor includes a thermally isolated area of IR-absorbing material coupled to a temperature measuring unit. IR radiation impinging on the sensor is absorbed, thereby raising the temperature of the IR absorbing material. The temperature measuring unit measures the increase in temperature and generates a proportional electronic signal indicative of the temperature. The electronic signal is received and processed by a processor. An IR radiator is also included within the sensing device housing.