Abstract: A liquid level sensor circuit for measuring a liquid level in the reservoir comprising two electrodes extending into the reservoir along at least part of a height of the reservoir down to a base of the reservoir, wherein the liquid level sensor circuit is arranged to have increased sensitivity near the base.

Abstract: A micro-display has a device chip with a transparent layer overlying one or more micro-electromechanical system devices. A transparent cover overlies the transparent layer. An index-of-refraction-matching medium is interposed between the transparent layer and the transparent cover. An index of refraction of the index-of-refraction-matching medium is substantially equal to an index of refraction of the transparent layer and the transparent cover.

Abstract: A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.

Abstract: A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.

Abstract: A mold configured to be coupled to a fluid ejection head die to allow a protective material to be molded around a plurality of contact pads on the die is disclosed. The mold includes a molding surface configured to cover the contact pads, wherein the molding surface is configured to support and shape the protective material during molding, and at least one side extending away from the molding surface, wherein the side is configured to contain the protective material during molding.

Abstract: A mold configured to be coupled to a fluid ejection head die to allow a protective material to be molded around a plurality of contact pads on the die is disclosed. The mold includes a molding surface configured to cover the contact pads, wherein the molding surface is configured to support and shape the protective material during molding, and at least one side extending away from the molding surface, wherein the side is configured to contain the protective material during molding.

Abstract: An electronic device includes a substrate, a substrate electrical connector disposed on the substrate, and a carrier lead electrically coupled to the substrate electrical connector. In addition, the electronic device further includes a polymer enclosing the substrate electrical connector, and an inorganic film disposed over the substrate electrical connector in contact with the polymer.

Abstract: An electronic device includes a substrate, a substrate electrical connector disposed on the substrate, and a carrier lead electrically coupled to the substrate electrical connector. In addition, the electronic device further includes a polymer enclosing the substrate electrical connector, and an inorganic film disposed over the substrate electrical connector in contact with the polymer.

Abstract: In one embodiment of the invention, a flexible tape has formed on it conductors for being connected to a printhead substrate. The conductors on the tape are coated with an insulating layer, and exposed ends of the conductors extend from the layer. A headland is formed on a plastic print cartridge for receiving the printhead substrate having the exposed conductors extending from one or more edges of the printhead substrate. An adhesive bead is formed on the headland so that when the printhead is properly positioned on the headland, the adhesive contacts the conductors to encapsulate and insulate one exposed side of the conductors. A second adhesive or encapsulant bead is deposited over the opposite side of the conductors to encapsulate and insulate the remaining exposed regions of the conductors. In this manner, the combined insulating action of the insulating layer and the two insulating adhesive beads prevents the conductors from being shorted together by ink which may flow in the vicinity of the conductors.

Abstract: An orifice plate for an ink jet printhead wherein a plurality of elongated isolator slots are adjacent the orifices and in fluid communication therewith, so as to prevent cross-talk between adjacent orifices.