Abstract: The present disclosure describes systems and methods for identifying defective components in a power integrated circuit. In one such system, a voltage regulator circuit is embedded in an integrated circuit device, wherein the voltage regulator circuit includes a control feedback loop having a compensation capacitor that is configured to maintain a stable output voltage of the voltage regulator voltage at a set value or range. Additionally, a test circuitry is embedded in the integrated circuit device, wherein the test circuitry comprises a voltage source that is configured to generate a cyclical test input signal that passes through the control feedback loop. Accordingly, the test circuitry is configured to provide a test output signal to an output pin of the integrated circuit device that indicates a performance level of the compensation capacitor in the control feedback loop of the voltage regulator circuit. Other systems and methods are also included.

Abstract: The present disclosure describes systems and methods for identifying defective components in a power integrated circuit. In one such system, a voltage regulator circuit is embedded in an integrated circuit device, wherein the voltage regulator circuit includes a control feedback loop having a compensation capacitor that is configured to maintain a stable output voltage of the voltage regulator voltage at a set value or range. Additionally, a test circuitry is embedded in the integrated circuit device, wherein the test circuitry comprises a voltage source that is configured to generate a cyclical test input signal that passes through the control feedback loop. Accordingly, the test circuitry is configured to provide a test output signal to an output pin of the integrated circuit device that indicates a performance level of the compensation capacitor in the control feedback loop of the voltage regulator circuit. Other systems and methods are also included.

Abstract: Wireless and non-wireless drug delivery integrated circuits, systems, and methods of delivering therapeutic pharmaceutical compounds are provided. The system can include a control module, a wireless drug delivery integrated circuit, a first electrode and a second electrode that are both attached to the wireless drug delivery integrated circuit, an electroactive polymer, and a pharmaceutical compound. The electroactive polymer and the pharmaceutical compound can be formed as films on one of the electrodes and, when placed in a solution, a voltage potential can be applied across the electrodes causing the pharmaceutical compound to be released into the solution.

Abstract: Wireless and non-wireless drug delivery integrated circuits, systems, and methods of delivering therapeutic pharmaceutical compounds are provided. The system can include a control module, a wireless drug delivery integrated circuit, a first electrode and a second electrode that are both attached to the wireless drug delivery integrated circuit, an electroactive polymer, and a pharmaceutical compound. The electroactive polymer and the pharmaceutical compound can be formed as films on one of the electrodes and, when placed in a solution, a voltage potential can be applied across the electrodes causing the pharmaceutical compound to be released into the solution.

Abstract: Embodiments relate to smart mosquito and insect trap devices, networks and method for detecting, counting, trapping and discarding a population of mosquitoes and/or insects. The mosquito species include the ones such as Aedes mosquito species that can cause Zika virus diseases. The device comprising a housing (201) having a directional force through a narrow path (240) to move an insect or mosquito in a predetermined direction. The device comprises one or more detectors (255) to detect a presence of an insect or mosquito along the path (240). An isolated basket (260) or trap is included to trap the insect or mosquito at a location below or at an end of the path. A processor (352) tracks a count of a population in the basket based on detection of the presence of the insect or mosquito.

Abstract: Embodiments relate to smart mosquito and insect trap devices, networks and method for detecting, counting, trapping and discarding a population of mosquitoes and/or insects. The mosquito species include the ones such as Aedes mosquito species that can cause Zika virus diseases. The device comprising a housing (201) having a directional force through a narrow path (240) to move an insect or mosquito in a predetermined direction. The device comprises one or more detectors (255) to detect a presence of an insect or mosquito along the path (240). An isolated basket (260) or trap is included to trap the insect or mosquito at a location below or at an end of the path. A processor (352) tracks a count of a population in the basket based on detection of the presence of the insect or mosquito.

Abstract: Monitoring and reporting of the temperature and/or other conditions of perishable and/or temperature sensitive products during transportation and storage is described. A system for wireless temperature monitoring can be carried out at a box level, but can provide information at a finer granularity than box-level. For temperature monitoring, the box (or other container) can be configured with a plurality of temperature sensors provided in an arrangement about the box and connected to a transmitter for communicating the temperature at each location to a monitoring system with a processor and database. A temperature profile and spatial model can be constructed by the processor and stored at the database to generate profiles for defined volumes within the container.

Abstract: Monitoring and reporting of the temperature and/or other conditions of perishable and/or temperature sensitive products during transportation and storage is described. A system for wireless temperature monitoring can be carried out at a box level, but can provide information at a finer granularity than box-level. For temperature monitoring, the box (or other container) can be configured with a plurality of temperature sensors provided in an arrangement about the box and connected to a transmitter for communicating the temperature at each location to a monitoring system with a processor and database. A temperature profile and spatial model can be constructed by the processor and stored at the database to generate profiles for defined volumes within the container.

Abstract: A self-testing transceiver having an on-chip power detection capability is provided. The self-testing transceiver can include a semiconductor substrate and a transmitter having a high-power amplifier disposed on the substrate. The self-testing transceiver also can include a receiver disposed on the substrate for selectively coupling to an antenna. The self-testing transceiver can further include at least one power detector disposed on the semiconductor substrate for determining a power such as an RMS and/or peak-power of a signal at an internal node of the self-testing transceiver. Additionally, the self-testing transceiver can include a loopback circuit disposed on the substrate.

Abstract: An embedded s-parameter measurement system for measuring or determining an s-parameter is provided. The system includes an s-parameter test circuit for connecting to a port of a high-frequency multi-port device-under-test (DUT). The s-parameter test circuit includes a directional coupler for sampling a forward signal conveyed to the DUT and for sampling a reverse signal reflected by the DUT. The s-parameter test circuit also includes a peak detector electrically connected to the directional coupler for detecting a magnitude of a signal conveyed to the peak detector by the directional coupler. The s-parameter test circuit further includes a phase detector electrically connected to the directional coupler for determining a phase of a signal conveyed to the phase detector by the directional coupler, and at least one other s-parameter test circuit for connecting to another port of the high-frequency multi-port DUT.

Abstract: An RF/Microwave on-chip signal source for testing an integrated circuit embedded in a substrate is provided. The signal source includes an on-chip antenna embedded in the substrate to receive a signal from a signal source external to the substrate. The signal source also includes a frequency divider circuit also embedded in the substrate. The frequency divider converts one or more frequencies of the signal into an operating frequency of the integrated circuit, the signal at the operating frequency of the integrated circuit defining an on-chip test signal. The signal source further includes one or more output buffers embedded in the substrate to provide a signal interface with the integrated circuit.

Abstract: A distributed RF/microwave power detector for detecting the power of a signal is provided. The distributed RF/microwave power detector includes a power detector on or at least partially embedded in a single substrate. The distributed RF/microwave power detector includes a detection unit that has a distributed amplifier for amplifying the signal and outputting an amplified signal, and a detector for detecting the power of the amplified signal. The distributed RF/microwave power detector further includes at least one additional detection unit cascaded with the first. The additional detection unit includes an additional distributed amplifier for amplifying the amplified signal and outputting a further amplified signal, as well as an additional detector for detecting a power of the further amplified signal. The distributed RF/microwave power detector also includes a multiplexer for multiplexing outputs of the detector and at least one additional detector, each having a dynamic range different from the other.

Abstract: Various embodiments of self-calibration systems and methods are described. One method embodiment, among others, includes imposing an alternate test to components within the device, responsive to the imposition of the alternate test, providing test responses corresponding to the components, and substantially, simultaneously mapping each of the test responses to corresponding specification values of the components.

Abstract: Various embodiments of self-calibration systems and methods are described. One method embodiment, among others, includes imposing an alternate test to components within the device, responsive to the imposition of the alternate test, providing test responses corresponding to the components, and substantially, simultaneously mapping each of the test responses to corresponding specification values of the components.

Abstract: An RF/Microwave on-chip signal source for testing an integrated circuit embedded in a substrate is provided. The signal source includes an on-chip antenna embedded in the substrate to receive a signal from a signal source external to the substrate. The signal source also includes a frequency divider circuit also embedded in the substrate. The frequency divider converts one or more frequencies of the signal into an operating frequency of the integrated circuit, the signal at the operating frequency of the integrated circuit defining an on-chip test signal. The signal source further includes one or more output buffers embedded in the substrate to provide a signal interface with the integrated circuit.

Abstract: A self-testing transceiver having an on-chip power detection capability is provided. The self-testing transceiver can include a semiconductor substrate and a transmitter having a high-power amplifier disposed on the substrate. The self-testing transceiver also can include a receiver disposed on the substrate for selectively coupling to an antenna. The self-testing transceiver can further include at least one power detector disposed on the semiconductor substrate for determining a power such as an RMS and/or peak-power of a signal at an internal node of the self-testing transceiver. Additionally, the self-testing transceiver can include a loopback circuit disposed on the substrate.

Abstract: A distributed RF/microwave power detector for detecting the power of a signal is provided. The distributed RF/microwave power detector includes a power detector on or at least partially embedded in a single substrate. The distributed RF/microwave power detector includes a detection unit that has a distributed amplifier for amplifying the signal and outputting an amplified signal, and a detector for detecting the power of the amplified signal. The distributed RF/microwave power detector further includes at least one additional detection unit cascaded with the first. The additional detection unit includes an additional distributed amplifier for amplifying the amplified signal and outputting a further amplified signal, as well as an additional detector for detecting a power of the further amplified signal. The distributed RF/microwave power detector also includes a multiplexer for multiplexing outputs of the detector and at least one additional detector, each having a dynamic range different from the other.

Abstract: An embedded s-parameter measurement system for measuring or determining an s-parameter is provided. The system includes an s-parameter test circuit for connecting to a port of a high-frequency multi-port device-under-test (DUT). The s-parameter test circuit includes a directional coupler for sampling a forward signal conveyed to the DUT and for sampling a reverse signal reflected by the DUT. The s-parameter test circuit also includes a peak detector electrically connected to the directional coupler for detecting a magnitude of a signal conveyed to the peak detector by the directional coupler. The s-parameter test circuit further includes a phase detector electrically connected to the directional coupler for determining a phase of a signal conveyed to the phase detector by the directional coupler, and at least one other s-parameter test circuit for connecting to another port of the high-frequency multi-port DUT.

Abstract: A self-testing transceiver having an on-chip power detection capability is provided. The self-testing transceiver can include a semiconductor substrate and a transmitter having a high-power amplifier disposed on the substrate. The self-testing transceiver also can include a receiver disposed on the substrate for selectively coupling to an antenna. The self-testing transceiver can further include at least one power detector disposed on the semiconductor substrate for determining a power such as an RMS and/or peak-power of a signal at an internal node of the self-testing transceiver. Additionally, the self-testing transceiver can include a loopback circuit disposed on the substrate.

Abstract: An integrated circuit which includes at least one DC to DC converter for receiving a supply voltage level and producing at least one intermediate voltage level which is greater than the supply voltage level. The integrated circuit also includes processing circuitry for receiving at least one time-varying input voltage signal and increasing a level of the time-varying voltage signal. The processing circuitry can include analog or digital circuitry or a combination of both analog and digital circuitry, and the time-varying input voltage signal can be an analog signal or a digital signal. The integrated voltage boost power supply can output the increased time-varying voltage signal and a plurality of DC voltages.