Abstract: In a semiconductor package, a die has electrical circuits formed on a first side surface. A lead frame for connecting the electrical circuits to a power source is connected to the electrical circuits of the die. A package body made of a dielectric material is formed around the die and the lead frame. One or more fins made of a thermally conductive material are independently attached to the die by a thermally conductive bond. The fins, receive heat directly from the die, and dissipate the heat by radiative or convection cooling into the surrounding environment.

Abstract: In order to provide a thermal coupling between a heat source and a heat sink, an interleaved-fin connector is provided. The connector comprises first and second substrates. The first substrate includes a first surface. A plurality of first channels are etched on the first surface to form a plurality of first fins and a first base. The first base can be thermally engaged with the heat source. The second substrate includes a second surface having a plurality of second channels etched therein. The second channels form a plurality of second fins and a second base. The second base can be thermally engaged with the heat sink. The first and second fins providing a thermally conductive path from the heat source to the heat sink when interleaved with each other.

Abstract: In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed in the first side surface. A plurality of first channels are etched in the second side surface to form a plurality of first fins. A second substrate has a plurality of second channels etched therein to form a plurality of second fins and a base. The base is for thermally engaging with a heat sink. The first and second fins providing a thermally conductive path from the heat generating devices to the heat sink when interleaved with each other.

Abstract: In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed in the first side surface. A plurality of first channels are etched in the second side surface to form a plurality of first fins. A second substrate has a plurality of second channels etched therein to form a plurality of second fins and a base. The base is for thermally engaging with a heat sink. The first and second fins providing a thermally conductive path from the heat generating devices to the heat sink when interleaved with each other.

Abstract: In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed in the first side surface. A plurality of first channels are etched in the second side surface to form a plurality of first fins. A second substrate has a plurality of second channels etched therein to form a plurality of second fins and a base. The base is for thermally engaging with a heat sink. The first and second fins providing a thermally conductive path from the heat generating devices to the heat sink when interleaved with each other.

Abstract: In order to provide a thermal coupling between a heat source and a heat sink, an interleaved-fin connector is provided. The connector comprises first and second substrates. The first substrate includes a first surface. A plurality of first channels are etched on the first surface to form a plurality of first fins and a first base. The first base can be thermally engaged with the heat source. The second substrate includes a second surface having a plurality of second channels etched therein. The second channels form a plurality of second fins and a second base. The second base can be thermally engaged with the heat sink. The first and second fins providing a thermally conductive path from the heat source to the heat sink when interleaved with each other.

Abstract: Power bus bars are provided for a semiconductor die. Power bus bars are thick electrical conductors that extend the length of the die in an electrically isolated array of stripes. The electrical stripes are divided into two or more interdigitated groups, each group connected to a power supply, or connected to a ground supply. This arrangement of alternate power and ground stripes minimizes inductance and resistance, and brings power and ground close to every transistor in the semiconductor die with minimized voltage variations.

Abstract: Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and bonding pads of the lead frame, and the lead frame/chip assembly is encased. within a plastic molded body, with the inactive back side of the chip exposed and facing outside the package.

Abstract: A thermosiphon provides cooling for a high powered die. The thermosiphon includes a fuse for accommodating temperature fault conditions. The thermosiphon utilizes a water and alcohol mixture for improved boiling characteristics. Contaminants at the joint betweeen the thermosiphon and the package housing are reduced by the use of a shrink ring seal. Thermal interfaces between the die and the thermosiphon are eliminated by directly coupling the die to the thermosiphon.

Abstract: A fixture (10) for bonding multiple components together includes a bottom plate (20), a middle plate (22) and a top plate (24). The plates (20), (22) and (24) are aligned by dowels (26) and clamps (30). Bottom plate (20) has a rectangular pocket (32) for holding heat sink (14) and alignment pins (34) for locating plastic pin grid array (PPGA) package (12) over the heat sink (14). An annular projection (40 ) covered with a conformal pad (42) extends from bottom surface (44) of the middle plate (22). Dowel (50) extends through openings (46) and (36) in the top and middle plates (24) and (22) to apply pressure to chip (16). A first spring (56) is mounted on the dowel (50) and compressed between the top plate (24) and a snap ring (58) to provide pressure from the dowel (50 ) on the chip (16). A second, larger diameter spring (60) is compressed between the middle plate (22) and the top plate (24) to provide pressure from the middle plate (22) on the PPGA (12).

Abstract: An apparatus for removing heat from a semiconductor is disclosed. The apparatus is a non-uniform thermal conductance structure which includes high thermal conductance regions and low thermal conductance regions. The apparatus is coupled to the semiconductor in such a manner that the high power density, and thus high temperature, regions on the semiconductor are aligned with the high thermal conductance regions of the apparatus, and low power density, and thus low temperature, regions on the semiconductor are aligned with the low thermal conductance regions of the apparatus. As a result, a desirable temperature profile may be established across the surface of the semiconductor.

Abstract: A device for hermetically protecting integrated circuits is disclosed. The device includes a plastic housing which has a cavity. The cavity forms an opening at the top of the housing and extends toward the bottom of the housing where a metallic slug is positioned. The cavity also includes one or more bond shelves descending from the top of the housing toward the bottom of the housing. The bond shelves support conducting bond pads which are coupled to connecting pins which extend from the housing. An integrated circuit with a number of integrated circuit bond pads is attached by an epoxy to the bottom of the cavity. Bond wires couple the integrated circuit bond pads and the bond shelf pads. A liquid is dispensed in the cavity such that the liquid extends from the bottom of the cavity to a position above the bond wires. A properly selected liquid provides protection for the integrated circuit and its electrical connections.

Abstract: Semiconductor package and method in which a cavity is provided for a chip or die, a bonding shelf extends peripherally of the cavity, and a layer of metallization extends along the under side of the shelf, wraps around the inner peripheral edge of the shelf and extends along the inner margin of the upper surface of the shelf to form a conductive ring to which a lead from the chip is bonded. Additional bonding pads are formed on the upper surface of the shelf, and additional leads from the chip are attached to these pads. In one embodiment, locating fingers align the chip precisely within the cavity.

Abstract: A package extraction tool (10) removes package (12) from socket (14) of circuit board (16). The tool (10) consists of a cylinder (18) and a piston assembly (20). Port (24) that is used to evacuate the cylinder (18) after the piston (20) is inserted in, the cylinder (18). The piston assembly (20) splits symmetrically into two halves (26) and (28) along its major axis. On one end (32) of the piston (20), there is an undercut pocket (34) to grab around the edges (36) of the package (12) and seal on flat edge (38) of pin side (40) of the package (12). A small port (42) connects the two ends (32) and (33) of the piston (20) with a controlled leak. Piston (20) fits into the cylinder (18) with a slight clearance. Leakage is controlled by the piston (20 )/cylinder (18) clearance. In use, the piston halves (26) and (28) are separated far enough to allow them to be reassembled around the package (12). The cylinder (18) is placed over the piston (20), and vacuum applied.

Abstract: A wet micro-channel wafer chuck (10) holds a semiconductor wafer 12 having a plurality of high powered chips (14) held in place with vacuum provided in the chuck (10). The chuck (10) has a plurality of micro-channels (16), which extend along cooling fins (18), on which the semiconductor wafer (12) rests when it is held in place on the chuck. A water supply manifold (20) extends perpendicular to the micro-channels (16) across the chuck (10). Water supply slot (22) extends upward from the water supply manifold into the micro-channels (16). Similarly, water exit slots (24) extend upward from water exit manifolds (26) into the micro-channels (16). Water (28) is delivered from pump (30) of an external recirculator/chiller (32) to the supply manifold (20) and into the many micro-channels (16) that pass under the wafer (12) under test. The water (28) leaves the micro-channels (16), enters the exit slots (24) and then the exit manifolds (26), from which it is returned to the recirculator/chiller (32).

Abstract: A test fixture (10) for integrated circuits includes a wafer chuck (12). The chuck (12) has a plurality of concentrically arranged vacuum hold down rings (14) which communicate with top (18) of the chuck (12). Between the hold down rings (14) are a plurality of concentrically arranged helium gas supply rings (20), connected to a source of helium gas (22), and also communicating with top (18) of the chuck (12). An integrated circuit wafer (24) is mounted on the top (18) of the chuck (12), held in place by the vacuum hold down rings (14). Helium has a thermal conductivity five times that of air. Flow of helium gas in the helium supply rings (20) between the wafer (24) and the chuck (12) therefore reduces the interface thermal resistance between the wafer (24) and the chuck (12) as much as five times. A coolant supply tube (32) extends through the probe card (26), terminating proximate to the wafer (24), and is connected to a source of coolant (33), to assist the cooling.

Abstract: Die attach structure and method in which the joint between a die and a substrate is formed in a manner which provides a uniform temperature distribution in the die and reduces stress in the joint near the edge of the die. In some embodiments, the substrate is formed with a non-planar surface in the die attach area, and the joint between the die and the substrate is thicker toward the edge of die than at the center. In other embodiments, different die attach materials are employed to make the joint stiffer toward the center of the die and more flexible toward the edges. In some embodiments, both the thickened joint and the different die attach materials are employed.

Abstract: A device for hermetically protecting integrated circuits is disclosed. The device includes a plastic housing which has a cavity. The cavity forms an opening at the top of the housing and extends toward the bottom of the housing where a metallic slug is positioned. The cavity also includes one or more bond shelves descending from the top of the housing toward the bottom of the housing. The bond shelves support conducting bond pads which are coupled to connecting pins which extend from the housing. An integrated circuit with a number of integrated circuit bond pads is attached by an epoxy to the bottom of the cavity. Bond wires couple the integrated circuit bond pads and the bond shelf pads. A liquid is dispensed in the cavity such that the liquid extends from the bottom of the cavity to a position above the bond wires. A properly selected liquid provides protection for the integrated circuit and its electrical connections.

Abstract: A wafer cooling chuck (10) uses 3M micro-channel stock (12). A coolant manifold (14) surrounds ends (16) and (18) of the stock (12). A vacuum manifold (17) surrounds the coolant manifold (14) at end (16). A heat transfer fluid supply manifold (15) surrounds the coolant manifold (14) at end (18). A first set of alternate channels (22) of the stock (12) are connected to the coolant manifolds (14) at each end (16) and (18). A second set of alternate channels (24) are connected to the vacuum manifold (17) by apertures (25, 26) connected to them from top surface (28) of the stock (12). The apertures (26) are connected to every other one of the alternate channels (24) at end (16). A set of apertures (35) are connected to the same channels (24) as the apertures (26) at end (16). A second set of apertures (37) are connected to the same channels as the apertures (25) at end (18).

Abstract: In order to provide thermal coupling of a package, particularly a package containing electronic components, and a heat sink, a thermal transfer assembly includes a first assembly having a group of generally parallel cooling fins coupled to the package. Coupled to the heat sink, such as cooling plate, is a second assembly also including a plurality of generally parallel cooling fins. The second set of cooling fins is positioned on the heat sink so that when the heat sink is in a predetermined position with respect to the package, the cooling fins overlap. The overlapping cooling fins permit efficient transfer of heat thus permitting heat generated in the package to be conveyed to the heat sink. The overlapping fins also permit convenient disassembly and reassembly for test and maintenance procedures. Techniques for fabrication of the thermal transfer assembly are described along with procedures for improving the operation of the heat transfer assembly.