Abstract: A structural assembly and an associated system and method for manufacture are provided. The structural assembly includes an elongate member and a first connector member that is connected to an end of the elongate member by a braze joint. A second connector member can be connected to an end of the elongate member opposite the first connector by another braze joint. The elongate member is formed of a metal matrix composite material that includes a plurality of fibers of a reinforcement material disposed in a metal matrix. Each connector member is formed of a material that is dissimilar to the material of the elongate member. The braze joints can be formed by selectively heating the braze material, e.g., with an inductive coil that extends circumferentially around only a portion of the structural assembly.

Abstract: A sensor device for detecting vibration, including a laser light, a first optical fiber for transmitting the laser light, an oscillator to receive the transmitted laser light and reflect the light as a frequency modulated light; a second optical fiber to transmit the frequency modulated light; and a frequency modulated discriminator for receiving the frequency modulated light from the second optical fiber and producing a signal responsive of vibration of the oscillator. In a preferred embodiment, the frequency modulated discriminator further includes a frequency meter for determining the average number of cycles per unit time to provide a second signal responsive of the temperature of the oscillator. The optical fibers may be a pair of different fibers positioned for transmitting the laser light and the frequency modulated light respectively, or the same fiber positioned for transmitting both the laser light and the frequency modulated light.

Abstract: A multi-material resonant thin film beam for a micromechanical sensor having a zero temperature coefficient of frequency (TCF) which is the resonant frequency shift with temperature change. One of the materials may be polysilicon and the other material may be silicon nitride or silicon oxide. Each material has a different thermal coefficient of expansion. The proportion of the various materials is adjusted and the specific geometries are determined so that the TCF is zero. One embodiment is a microbeam composed of two polysilicon thin films with a silicon nitride thin film inserted between the polysilicon films. The thickness of the silicon nitride film may be adjusted to trim the TCF to zero. The film of nitride instead may be placed on one side of a polysilicon film to form a beam. Dual or multiple beam resonators likewise may be made with several materials. The nitride may be placed in the shank areas which join and secure the ends of the beams.

Abstract: A microactuator array device, which includes a plurality of generally parallel thin flexible polymer sheets bonded together in a predetermined pattern to form an array of unit cells on at least one layer. Thin conductive and dielectric films are deposited on the sheets to form a plurality of electrodes associated with the array of unit cells. A source of electric potential operably connects the electrodes, whereby electrostatic forces are generated most intensely proximate the point where the gap between the sheets is smallest. Inlets and outlets for each cell permit displacement of fluid during generation of the electrostatic forces. In a preferred embodiment, the plurality of sheets forms a stack of layers of arrays of unit cells. The layers are configured such that bi-directional activation is caused by pairs of actuators working opposite each other.

Abstract: A sensor device for detecting vibration, including a light source for providing a laser light, a first optical fiber connected to the source for transmitting the laser light, an oscillator positioned to receive the transmitted laser light and adapted to reflect the light as a frequency modulated light; a second optical fiber positioned to capture the frequency modulated light to transmit the frequency modulated light; and a frequency modulated discriminator for receiving the frequency modulated light from the second optical fiber and producing a signal responsive of vibration of the oscillator. In a preferred embodiment, the frequency modulated discriminator further includes a frequency meter for determining the average number of cycles per unit time to provide a second signal responsive of the temperature of the oscillator.

Abstract: A microactuator array device, which includes a plurality of generally parallel thin flexible polymer sheets bonded together in a predetermined pattern to form an array of unit cells on at least one layer. Thin conductive and dielectric films are deposited on the sheets to form a plurality of electrodes associated with the array of unit cells. A source of electric potential operably connects the electrodes, whereby electrostatic forces are generated most intensely proximate the point where the gap between the sheets is smallest. Inlets and outlets for each cell permit displacement of fluid during generation of the electrostatic forces. In a preferred embodiment, the plurality of sheets forms a stack of layers of arrays of unit cells. The layers are configured such that bi-directional activation is caused by pairs of actuators working opposite each other.

Abstract: A diaphragm pump, which is preferably electrostatically actuated, but which may be activated by other forces such as electromagnetic or piezoelectric actuation. The pump is formed by a pump body having a pump chamber formed therein. First and second diaphragms each having a set of valve holes in the diaphragm surface thereof are mounted in the chamber. Also provided are at least one inlet and at least one outlet port for communication with the pump chamber. The ports are positioned for sealing contact with the diaphragms at points that are not aligned with the holes in the diaphragms. A driver electrostatically actuates the diaphragms to cause diaphragm movement to a plurality of diaphragm positions to control flow of fluid through the pump. The first position is when the diaphragms are spaced from one another and from the ports to permit flow of fluid through the pump chamber.

Abstract: An electrostatic actuator device including a stationary support and a buckled, moveable support mounted to enter into contact with the stationary support. At least three electrodes are employed. The first is mounted on the moveable support and a second electrode is on the stationary support. A third electrode is mounted on one of the supports such that the electrodes are positioned to form two pairs of electrodes for electrostatic attraction therebetween. The electrodes are powered by a voltage supply to provide electrostatic attraction between pairs of electrodes and move them into electrostatic contact. The buckled electrode has a shape configured to transmit a restoring force to its portion in contact with stationary support upon application of voltage to another pair of electrodes.

Abstract: A micromechnical sensor having a polysilicon beam that is an integral part of the diaphragm resulting in a frequency of the beam that is a direct result of the pressure applied to the external surface of the diaphragm. Fabrication of this resonant microbeam sensor has no backside wafer processing, and involves a process and layout independent of wafer thickness for high yield and robustness. Both the diaphragm and resonant beam are formed from polysilicon. The sensor may have more than one resonant beam. The sensor beam or beams may be driven and sensed by electrical or optical mechanisms. For stress isolation, the sensor may be situated on a cantilevered single crystal silicon paddle. The sensor may be recessed on the isolating die for non-interfering interfacing with optical or electrical devices. The sensor die may be circular for ease in mounting with fiber optic components.

Abstract: A micromechnical sensor having a polysilicon beam that is an integral part of the diaphragm resulting in a frequency of the beam that is a direct result of the pressure applied to the external surface of the diaphragm. Fabrication of this resonant microbeam sensor has no backside wafer processing, and involves a process and layout independent of wafer thickness for high yield and robustness. Both the diaphragm and resonant beam are formed from polysilicon. The sensor may have more than one resonant beam. The sensor beam or beams may be driven and sensed by electrical or optical mechanisms. For stress isolation, the sensor may be situated on a cantilevered single crystal silicon paddle. The sensor may be recessed on the isolating die for non-interfering interfacing with optical or electrical devices.