Abstract: A catheter including one or more echogenic members facilitate guiding the catheter to a selected locations within a patient using ultrasound imaging. The echogenic members may include expandable members, such as balloons, be positioned near a distal end of the catheter. The echogenic members include an echogenic material, such as a coating or a fluid, that is configured to enhance the diffuse sound scattering of the echogenic member. An expanded echogenic member is detectable using ultrasound imaging.

Abstract: A catheter including one or more echogenic members facilitate guiding the catheter to a selected locations within a patient using ultrasound imaging. The echogenic members may include expandable members, such as balloons, be positioned near a distal end of the catheter. The echogenic members include an echogenic material, such as a coating or a fluid, that is configured to enhance the diffuse sound scattering of the echogenic member. An expanded echogenic member is detectable using ultrasound imaging.

Abstract: A catheter including one or more echogenic members facilitate guiding the catheter to a selected locations within a patient using ultrasound imaging. The echogenic members may include expandable members, such as balloons, be positioned near a distal end of the catheter. The echogenic members include an echogenic material, such as a coating or a fluid, that is configured to enhance the diffuse sound scattering of the echogenic member. An expanded echogenic member is detectable using ultrasound imaging.

Abstract: Processes for manufacture and assembly of implantable medical devices are described. In particular, techniques are provided for nondestructive electrical isolation assessment of feedthrough assemblies of the implantable medical devices. The feedthrough assemblies may include an insulating structure, a plurality of terminal pins extending through the insulator and a ferrule having an inner lumen into which the insulating structure is disposed. One or more insulating seals may be disposed at the interface of the ferrule-to-insulating structure and/or the terminal pin-to-insulating structure. The electrical isolation assessments may be based on the dielectric properties of the components of the feedthrough assemblies, such as the insulating structure.

Abstract: A method of connecting a fixture to a case component at an opening on the case component, the case component having a base and a wall disposed along at least a portion of the perimeter of the base, and the case component having an interior surface and an exterior surface, includes positioning a first end of the fixture within the opening in the case component such that the first end of the fixture is substantially flush with the interior surface of the wall of the case component. Then welding the fixture to the case component along the interior surface of the case component. Further disclosed is a welded apparatus that includes a first component, an opening, a fixture, and a weld between the first component and the fixture that is located along an inner surface of the first component.

Abstract: A method of connecting two components includes providing an assembly including a first component and a second component, optically sensing a connection region between the first component and the second component to produce an image, defining a substantially elliptical path in a three-dimensional space based on the image, and initiating relative movement between the assembly and welding means such that the welding means is positioned, by relative movement, along the substantially elliptical path to produce a weld between the first component and the second component.

Abstract: A method of connecting two components includes providing an assembly including a first component and a second component, optically sensing a connection region between the first component and the second component to produce an image, defining a substantially elliptical path in a three-dimensional space based on the image, and initiating relative movement between the assembly and welding means such that the welding means is positioned, by relative movement, along the substantially elliptical path to produce a weld between the first component and the second component.

Abstract: An interconnect module providing conductive interconnection paths between an integrated chip, a printed wiring board, and at least one layer within the module, incorporating a plurality of alternating dielectric and conductive layers laminated together to form a unitary structure. The module includes a chip attach surface and a board attach surface, that define contact pads for attachment to corresponding pads on the chip and printed wiring board, respectively, by means of solder balls.