Patents by Inventor William R. Van Bemmel

William R. Van Bemmel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5061262
    Abstract: An article having a refastenable tape system comprising a flexible substrate having a tear strength, and an adhesive tape member having a peel adhesion value which is greater than the tear strength of the substrate when the tape member is adhered to a first major surface of the substrate. A reinforcement layer composed of a hot melt adhesive is bonded to a second major surface of the substrate located opposite to the first major surface. The reinforcement layer exhibits an elongation-at-break of at least about 100%. The substrate and the reinforcement layer thereby provide a composite tear strength greater than the peel adhesion value of the tape member, and provide a composite elongation-at-break of at least about 100%.
    Type: Grant
    Filed: May 21, 1987
    Date of Patent: October 29, 1991
    Assignee: Kimberly-Clark Corporation
    Inventors: Franklin M. C. Chen, Paul M. Linker, William R. Van Bemmel, Dave A. Soerens
  • Patent number: 4643730
    Abstract: The present invention provides a method for reinforcing a substrate, which includes the step of coating at least a portion of the surface of the substrate with a layer of material that is curable by a high-energy-radiation. The coating material is cured with a suitable source of the high-energy-radiation to form a reinforcement layer affixed to the substrate. The reinforced substrate is particularly useful in the attachment zone of a refastenable, pressure-sensitive tape closure systems.
    Type: Grant
    Filed: September 26, 1985
    Date of Patent: February 17, 1987
    Assignee: Kimberly-Clark Corporation
    Inventors: Franklin M. C. Chen, William R. Van Bemmel