Patents by Inventor William R. Wade

William R. Wade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6121105
    Abstract: An integrated circuit inverted thin film resistor structure and method of manufacture having interconnect defining resistor contacts and leads resident within and coplanar with a supporting layer, resistive material uniformly overlaying the supporting layer and contacts, the resistive material diffused into the resistor/interconnect contact region.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: September 19, 2000
    Assignee: Intersil Corporation
    Inventors: William R. Wade, Jack Linn
  • Patent number: 6034411
    Abstract: An integrated circuit inverted thin film resistor structure and method of manufacture having interconnect defining resistor contacts and leads resident within and coplanar with a supporting layer, resistive material uniformly overlaying the supporting layer and contacts, the resistive material diffused into the resistor/interconnect contact region.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: March 7, 2000
    Assignee: Intersil Corporation
    Inventors: William R. Wade, Jack Linn
  • Patent number: 5070388
    Abstract: Interconnect metal is selectively provided in a network of trenches formed in the top surface of a semiconductor substrate containing multiple circuit devices, electrical contact to regions of which is to be provided. The trench network is formed so that it intersects the device regions, thus exposing the regions at sidewalls of the trench. On the floor of the trench a bottom layer of insulator material is provided, and conductive material (such as tungsten) is deposited on or grown from the trench sidewalls, in order to electrically couple device regions to one another. Because the device interconnect employs a trench network, not only are top surface contact apertures unnecessary, but, with a device region contact (from the trench sidewall) being made along the entire width of the region, device resistance can be decreased and performance improved.
    Type: Grant
    Filed: January 19, 1990
    Date of Patent: December 3, 1991
    Assignee: Harris Corporation
    Inventors: William R. Wade, Kenneth A. Ports
  • Patent number: 4777656
    Abstract: An emergency locating transmitting (ELT) system comprising a legislated ELT modified with an interface unit and connected by a multiwire cable to a remote control monitor (RCM), typically located at the pilot position. The RCM can remotely (1) test the ELT by disabling the legislated swept tone and allowing transmission of a single tone, (2) turn the ELT "on" for legislated ELT transmission, and (3) reset the ELT to an "armed" condition. The RCM also provides visual and audio indications of transmitter operating condition as well as ELT battery condition. Removing the RCM or shorting or opening the interface input connections will not affect traditional ELT operation.
    Type: Grant
    Filed: September 28, 1984
    Date of Patent: October 11, 1988
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: William R. Wade