Abstract: A memory stick configured for use with a processor in a computer is provided. The memory stick includes a printed circuit board with first and second sides, each of the first and second sides including eighteen memory chips, each of the memory chips being an ×8 DRAM chip; the eighteen memory chips being distributed into first, second, third and fourth rows, the first row and the second row being on a left half of the printed circuit board and the third and fourth row being on a right half of the printed circuit board; and the printed circuit board including at least 400 pins including at least 16 pins for ECC bits and at least 128 pins for data bits; wherein at least the memory chips and the 128 pins for data bits establish a 128-bit data width to communicate.

Abstract: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.

Abstract: In various embodiments, a high-density solid-state storage unit includes a base section and a cassette section having plurality of flash cards. The cassette section can be removably attached to the base section to provide security of data stored on the plurality of flash cards. The cassette section provides for physical security of the flash cards in part through packaging of the enclosure and energy transfer to the base station. The cassette section further provides for security of the data stored on the flash cards in part through a trusted platform module (TPM) embodied as a removable module connected to a universal serial bus (USB) style connector.

Abstract: Various systems, methods, apparatuses, and computer-readable media, for accessing a storage device are described. In certain example embodiments, an active/active fault tolerant storage device comprising two or more controllers may be implemented. In one embodiment, each controller may be coupled to the non-volatile memory’ (NVM) blades comprising the non-volatile memory (NVM) storage medium. In one example implementation, a standardized protocol, such as Peripheral Component Interconnect Express protocol may be used for communicating amongst the various components of the controller and also the NVM storage medium.

Abstract: In various embodiments, a high-density solid-state storage unit includes a base section and a cassette section having plurality of flash cards. The cassette section can be removably attached to the base section to provide security of data stored on the plurality of flash cards. The cassette section provides for physical security of the flash cards in part through packaging of the enclosure and energy transfer to the base station. The cassette section further provides for security of the data stored on the flash cards in part through a trusted platform module (TPM) embodied as a removable module connected to a universal serial bus (USB) style connector.

Abstract: A rack mountable 10U storage unit includes a plurality of memory modules arranged in multiple rows. The storage unit also has control circuitry. Each of the memory modules have multiple heating zones and a heat spreader coupled to it. The memory modules may have heat spreaders having differing thermal dissipation capacity coupled to them. The storage unit can accommodate up to 120 memory modules due to a unique method of placing the individual memory modules.

Abstract: Various systems, methods, apparatuses, and computer-readable media for accessing a storage device are described. In certain example embodiments, an active/active fault-tolerant storage device comprising two or more controllers may be implemented. In one aspect, each controller may have two or more processing entities for distributing the processing of the I/O requests. In one embodiment, the configuration of the components, modules and the controller board may be arranged in a manner to enhance heat dissipation, reduce power consumption, spread the power and work load, and reduce latency. In one embodiment, each controller may be coupled to the non-volatile memory (NVM) blades comprising the non-volatile memory (NVM) storage medium. In one example implementation, a standardized protocol, such as the Peripheral Component Interconnect Express protocol may be used for communicating amongst the various components of the controller and also the NVM storage medium.

Abstract: Various systems, methods, apparatuses, and computer-readable media, for accessing a storage device are described. In certain example embodiments, an active/active fault tolerant storage device comprising two or more controllers may be implemented. In one embodiment, each controller may be coupled to the non-volatile memory’ (NVM) blades comprising the non-volatile memory (NVM) storage medium. In one example implementation, a standardized protocol, such as Peripheral Component Interconnect Express protocol may be used for communicating amongst the various components of the controller and also the NVM storage medium.

Abstract: In various embodiments, a high-density solid-state storage unit includes a base section and a cassette section having plurality of flash cards. The cassette section can be removably attached to the base section to provide security of data stored on the plurality of flash cards. The cassette section provides for physical security of the flash cards in part through packaging of the enclosure and energy transfer to the base station. The cassette section further provides for security of the data stored on the flash cards in part through a trusted platform module (TPM) embodied as a removable module connected to a universal serial bus (USB) style connector.

Abstract: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.

Abstract: Methods and apparatus for managing data storage in hybrid memory devices utilizing single level and multi-level memory cells. Logical addresses can be distributed between single level and multilevel memory cells based on a frequency of write operations performed. Initial storage of data corresponding to a logical address in memory can be determined by various methods including initially writing all data to single level memory or initially writing all data to multilevel memory. Other methods permit a host to direct logical address writes to single level or multilevel memory cells based on anticipated usage.

Abstract: Various systems, methods, apparatuses, and computer-readable media for accessing a storage device are described. In certain example embodiments, an active/active fault tolerant storage device comprising two or more controllers may be implemented. In one embodiment, each controller may be coupled to the non-volatile memory (NVM) blades comprising the non-volatile memory (NVM) storage medium. In one example implementation, a standardized protocol, such as Peripheral Component Interconnect Express protocol may be used for communicating amongst the various components of the controller and also the NVM storage medium.

Abstract: Various systems, methods, apparatuses, and computer-readable media for accessing a storage device are described. In certain example embodiments, an active/active fault-tolerant storage device comprising two or more controllers may be implemented. In one aspect, each controller may have two or more processing entities for distributing the processing of the I/O requests. In one embodiment, the configuration of the components, modules and the controller board may be arranged in a manner to enhance heat dissipation, reduce power consumption, spread the power and work load, and reduce latency. In one embodiment, each controller may be coupled to the non-volatile memory (NVM) blades comprising the non-volatile memory (NVM) storage medium. In one example implementation, a standardized protocol, such as the Peripheral Component Interconnect Express protocol may be used for communicating amongst the various components of the controller and also the NVM storage medium.

Abstract: In various embodiments, a high-density solid-state storage unit includes a base section and a cassette section having plurality of flash cards. The cassette section can be removably attached to the base section to provide security of data stored on the plurality of flash cards. The cassette section provides for physical security of the flash cards in part through packaging of the enclosure and energy transfer to the base station. The cassette section further provides for security of the data stored on the flash cards in part through a trusted platform module (TPM) embodied as a removable module connected to a universal serial bus (USB) style connector.

Abstract: A rack mountable 1U storage unit includes a plurality of memory modules arranged in two groups. The storage unit also has control circuitry. The memory modules have a dedicated exhaust channel to draw heat away from the memory modules. The exhaust channel for the memory modules is disposed over and is physically separated from the exhaust channel for the control circuitry. The storage unit can accommodate up to 42 memory modules due to a unique method of placing the individual memory modules.

Abstract: Various systems, methods, apparatuses, and computer-readable media for accessing a storage device are described. In certain example embodiments, an active/active fault-tolerant storage device comprising two or more controllers may be implemented. In one aspect, each controller may have two or more processing entities for distributing the processing of the I/O requests. In one embodiment, the configuration of the components, modules and the controller board may be arranged in a manner to enhance heat dissipation, reduce power consumption, spread the power and work load, and reduce latency. In one embodiment, each controller may be coupled to the non-volatile memory (NVM) blades comprising the non-volatile memory (NVM) storage medium. In one example implementation, a standardized protocol, such as the Peripheral Component Interconnect Express protocol may be used for communicating amongst the various components of the controller and also the NVM storage medium.

Abstract: Methods and apparatus are disclosed related to a memory device, such as a flash memory device that includes an array of memory cells. One such method includes detecting values of charges stored in selected memory cells in the memory cell array. The method also includes processing the detected values in accordance with a Viterbi algorithm so as to determine data stored in the selected memory cells. In one embodiment, the flash memory cell array includes word lines and bit lines. Detecting the values of charges includes detecting values of charges stored in a selected row of memory cells by selecting one of the word lines. The Viterbi algorithm provides correct data where inter-signal interference between the cells affects the accuracy of read data.

Abstract: In various embodiments, a high-density solid-state storage unit includes a base section and a cassette section having plurality of flash cards. The cassette section can be removably attached to the base section to provide security of data stored on the plurality of flash cards. The cassette section provides for physical security of the flash cards in part through packaging of the enclosure and energy transfer to the base station. The cassette section further provides for security of the data stored on the flash cards in part through a trusted platform module (TPM) embodied as a removable module connected to a universal serial bus (USB) style connector.

Abstract: In various embodiments, a high-density solid-state storage unit includes a base section and a cassette section having plurality of flash cards. The cassette section can be removably attached to the base section to provide security of data stored on the plurality of flash cards. The cassette section provides for physical security of the flash cards in part through packaging of the enclosure and energy transfer to the base station. The cassette section further provides for security of the data stored on the flash cards in part through a trusted platform module (TPM) embodied as a removable module connected to a universal serial bus (USB) style connector.

Abstract: Various systems, methods, apparatuses, and computer-readable media. for accessing a storage device are described. In certain example embodiments, an active/active fault tolerant storage device comprising two or more controllers may be implemented. In one embodiment, each controller may be coupled to the non-volatile memory (NVM) blades comprising the non-volatile memory (NVM) storage medium. In one example implementation, a standardized protocol, such as Peripheral Component Interconnect Express protocol may be used for communicating amongst the various components of the controller and also the NVM storage medium.