Patents by Inventor William Raeming Dong

William Raeming Dong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board configurations facilitating operation of heat sensitive sensor components
    Patent number: 9664569
    Abstract: A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: May 30, 2017
    Assignee: Google Inc.
    Inventors: Adam Mittleman, Ian Charles Smith, Daniel Adam Warren, William Raeming Dong, Jeff Wheeler
  • CIRCUIT BOARD CONFIGURATIONS FACILITATING OPERATION OF HEAT SENSITIVE SENSOR COMPONENTS
    Publication number: 20160334279
    Abstract: A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.
    Type: Application
    Filed: May 15, 2015
    Publication date: November 17, 2016
    Applicant: Google Inc.
    Inventors: Adam Mittleman, Ian Charles Smith, Daniel Adam Warren, William Raeming Dong, Jeff Wheeler