Abstract: A system for simultaneously burning in, testing and curing all the die on an uncut semiconductor wafer having top and bottom surfaces, the system having upper and lower platen assemblies with a flow section configured to receive and discharge a temperature-controlled, circulated liquid heat transfer medium to maintain the temperatures of the top and bottom surfaces of the uncut semiconductor wafer within desired limits during wafer burn-in and testing and a programmable CPU and service controller configurable to selectively energize, monitor, test, display and store a plurality of performance parameters for the electronic circuitry of each of the plurality of die of the uncut semiconductor wafer simultaneously throughout a desired burn-in and test period.

Abstract: A system for simultaneously burning in, testing and curing all the die on an uncut semiconductor wafer; for establishing electrical connectivity in one-to-one correspondence between each die and a specific current amplifier, for monitoring, displaying, evaluating and recording test parameters in relation to preset parametric limits during a requisite test period; and for shutting down any individual die that exceeds the preset parametric limits. Methods of use and subsystems for raising and lowering a semiconductor wafer in relation to a pin chuck and for controlling wafer temperature by circulating a liquid heat exchange medium through platen assemblies disposed above and below the wafer are also disclosed.