Patents by Inventor William Robert Crumly

William Robert Crumly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROPLATING OF NANOLAMINATES
    Publication number: 20230279575
    Abstract: Practical method for constructing materials composed of layers that are a few nanometers thick is disclosed which comprises of plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and using plating cell(s) to locally plate the layers by alternating multiple cells with different plating solutions or alternating plating solutions in a cell.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 7, 2023
    Inventors: William Robert Crumly, Pete H. I Lusdon, Eric Dean Jensen
  • Commercial plating of nanolaminates
    Patent number: 6547944
    Abstract: A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and controlling the plating current to obtain a desired current density at the cathode, which is maintained within a predefined range.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: April 15, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: Chris M. Schreiber, Mordechay Schlesinger, Robert Martinez, Haim Feigenbaum, William Robert Crumly
  • Nanolaminate mechanical structures
    Publication number: 20020071962
    Abstract: A nanolaminate structure comprises a plurality of adjacent metal layers with each layer having a thickness of less than about 1000 nanometers. The composition of the adjacent metal layers alternates between a first metal and a second metal, where at least one mechanical property of the nanolaminate is improved over the same mechanical property of the first and second metal.
    Type: Application
    Filed: December 8, 2000
    Publication date: June 13, 2002
    Inventors: Chris M. Schreiber, Mordechay Schlesinger, Eric Dean Jensen, Haim Feigenbaum, William Robert Crumly
  • Commercial plating of nanolaminates
    Publication number: 20020070118
    Abstract: A method for forming a nanolaminate structure is provided which comprises plating a substrate with layers of substantially a first metal and substantially a second metal using an electrolytic plating process and controlling the plating current to obtain a desired current density at the cathode, which is maintained within a predefined range.
    Type: Application
    Filed: December 8, 2000
    Publication date: June 13, 2002
    Inventors: Chris M. Schreiber, Mordechay Schlesinger, Robert Martinez, Haim Feigenbaum, William Robert Crumly
  • Chip scale package
    Patent number: 6109369
    Abstract: A chip scale package includes a mandrel built flexible circuit having a circuit trace on a first surface and an aperture extending therethrough. The chip scale package includes a pad covering the aperture on the first surface of the flexible circuit and a raised interconnection member extending outwardly from the pad. The chip scale package also includes a chip secured to a second surface of the flexible circuit, such that the chip is electrically connected to the pad.
    Type: Grant
    Filed: January 29, 1999
    Date of Patent: August 29, 2000
    Assignee: Delphi Technologies, Inc.
    Inventors: William Robert Crumly, Pete Henry Hudson, Robert Joseph Cochrane, Haim Feigenbaum, Eric Dean Jensen