Abstract: Disclosed herein are low dielectric constant (low-k) two-dimensional covalent organic framework materials that have a dielectric constant k less than 2.4, optionally less than 1.9, and are comprised of regularly porous, covalently linked, layer structures.

Abstract: Electrical connector for connecting opposed conductors on spaced-apart printed circuit boards or the like comprises a connector housing body having oppositely directed sides which have trough-like recesses therein. Elastomeric bodies are provided in the recesses and have surface portions which normally project beyond the oppositely directed sides. A flexible circuit having closely spaced parallel conductors thereon is held on the elastomeric bodies and extends over the projecting portions of these bodies and across a side of the housing body which is between the opposed oppositely directed sides. In use, the connector is clamped between opposed surfaces of the printed circuit boards with the conductors on the flexible circuit in engagement with conductors on the printed circuit boards.

Abstract: Miniature electrical connector for forming connections between conductors on parallel spaced apart substrates comprises a generally cylindrical elastomeric body having a thin non-yielding flexible circuit wrapped therearound. The circuit has parallel spaced apart conductors on its surface so that when the connector is positioned between the two parallel substrates and compressed between the substrates, the corresponding conductors on the substrates will be electrically connected by the conductors on the flexible circuit. The flexible circuit is not firmly bonded to the elastomeric body and the body is not significantly deformed when compressed between the substrates. The flexible circuit, being non-yielding is not deformed laterally so that alignment of conductors on the circuit with conductors on the substrate is maintained.