Patents by Inventor William Rochowicz

William Rochowicz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnection of circuit substrates on different planes in electronic module
    Patent number: 6490168
    Abstract: An electronic module (20) includes a first circuit substrate (40) and a second circuit substrate (44). The first circuit substrate (40) has a post surface (50) and a post (52) protruding from the post surface (50). The second circuit substrate (44) has an upper surface (46) opposed to a lower surface (48). The second circuit substrate (44) forms an opening (56). The first circuit substrate (40) may be manufactured using a Molded Interconnect Device substrate. The second circuit substrate (44) may be manufactured using a High Density Interconnect substrate. The second circuit substrate (44) is placed on top of the first circuit substrate (40) so that the post (52) of the first circuit substrate (40) is mated with the opening (56) of the second circuit substrate (44).
    Type: Grant
    Filed: September 27, 1999
    Date of Patent: December 3, 2002
    Assignee: Motorola, Inc.
    Inventors: William Rochowicz, Declan Killarney, Tom Gall, Chris Van Houten, Don Zito