Patents by Inventor William Roger Lambert

William Roger Lambert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6501900
    Abstract: An optical fiber connection device is disclosed that allows for in situ variable attenuation of a signal transmitted between two optical fibers. The connection device comprises an attenuator element fabricated with an inherently compliant, elastomeric material, preferably a silicone elastomer. The elastomeric properties of the attenuator element allow for varying the thickness of the attenuator element and thereby changing the level of attenuation in situ. Silicone elastomers are preferred for fabricating the attenuator element as applicants have discovered they may be index-matched to optical transmission fibers, have a high creep modulus, exhibit relatively constant mechanical properties over a broad range of temperatures, and are reliable upon exposure to varied environmental conditions.
    Type: Grant
    Filed: February 17, 2000
    Date of Patent: December 31, 2002
    Assignee: Fitel USA Corp.
    Inventors: Charles Joseph Aloisio, Jr., Robert William Filas, Wilton Wayt King, William Roger Lambert, Claire H. Plagianis, George John Shevchuk
  • Patent number: 6255587
    Abstract: Electronic devices include at least two electronic components in electrical contact by a connector, the components being at least partially encased by a molded resin. Preferably, the connector is a compression connector and the molded resin maintains a compressive force on the connector to ensure that reliable contact is maintained.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: July 3, 2001
    Assignee: AT&T Corporation
    Inventors: William Roger Lambert, John David Weld
  • Patent number: 6097873
    Abstract: An improved optical fiber connection system comprises an attenuator element fabricated with an inherently elastomeric material, preferably a silicone elastomer. Silicone elastomers are particularly preferred for fabricating attenuator elements as they may be index-matched to optical transmission fibers, have a high creep modulus, exhibit relatively constant mechanical properties over a broad range of temperatures, and are reliable upon exposure to varied environmental conditions. Preferably, a disc-like attenuator element is punch-cut from a sheet of a silicone elastomer and inserted into the sleeve of an optical connector apparatus adjacent the end portion of an optical fiber to provide a simplified method of fabrication. Alternatively, the silicone attenuator element may be fabricated by liquid injection molding technology. The approximate reflectance of the inventive silicone attenuators at wavelengths of about 1310 nm measured at 23.degree. C. is less than -50 dB.
    Type: Grant
    Filed: January 14, 1998
    Date of Patent: August 1, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Robert William Filas, Wilton Wayt King, William Roger Lambert
  • Patent number: 5754643
    Abstract: A network interface device includes a weatherable enclosure having injection molded, die cast, or stamped top and bottom cap portions and a body portion which is extruded. The injection molded portions are fabricated from a polymer, such as polyvinyl chloride, with a higher melt index than the grade of polymer used to fabricate the body portion. The body portion has top and bottom openings adapted to receive the top and bottom cap portions. The network interface electrical components are enclosed within the housing.
    Type: Grant
    Filed: October 2, 1995
    Date of Patent: May 19, 1998
    Assignee: Lucent Technologies Inc.
    Inventors: Robert LeRoy Decker, Philip Hubbauer, William Roger Lambert, Lloyd Shepherd, George John Shevchuk, John David Weld
  • Patent number: 5689878
    Abstract: An assembly for protecting the active electronic components of an electronic product from the environment and electromagnetic interference (EMI). A method is described where the assembly is formed by providing a metallized flexible enclosure around the electronic product, such as a printed circuit board, and subsequently sealing the metallized flexible enclosure, such that separable connectors can be readily accessed without violating the integrity of the seal. The metallized flexible enclosure includes multiple layers of polymeric materials that provide diffusion barrier properties and a metallic layer that provides both diffusion barrier properties and EMI shielding capabilities. The multiple layer sheet is patterned to optimize the diffusion barrier properties and EMI shielding capabilities. Further, the multiple layer sheet enables efficient, high volume production.
    Type: Grant
    Filed: April 17, 1996
    Date of Patent: November 25, 1997
    Assignee: Lucent Technologies Inc.
    Inventors: Donald William Dahringer, Philip Hubbauer, William Roger Lambert, Alan Michael Lyons, Lloyd Shepherd, John David Weld